JP5861040B2 - ペースト転写ユニットおよび電子部品実装装置ならびに転写膜厚測定方法 - Google Patents
ペースト転写ユニットおよび電子部品実装装置ならびに転写膜厚測定方法 Download PDFInfo
- Publication number
- JP5861040B2 JP5861040B2 JP2012284186A JP2012284186A JP5861040B2 JP 5861040 B2 JP5861040 B2 JP 5861040B2 JP 2012284186 A JP2012284186 A JP 2012284186A JP 2012284186 A JP2012284186 A JP 2012284186A JP 5861040 B2 JP5861040 B2 JP 5861040B2
- Authority
- JP
- Japan
- Prior art keywords
- transfer
- paste
- film thickness
- electronic component
- transfer unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
- G01B7/02—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness
- G01B7/06—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0465—Surface mounting by soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
- B23K3/0638—Solder feeding devices for viscous material feeding, e.g. solder paste feeding
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
- G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/118—Post-treatment of the bump connector
- H01L2224/1182—Applying permanent coating, e.g. in-situ coating
- H01L2224/11822—Applying permanent coating, e.g. in-situ coating by dipping, e.g. in a solder bath
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/13099—Material
- H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/13101—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of less than 400°C
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7515—Means for applying permanent coating, e.g. in-situ coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/759—Means for monitoring the connection process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/81009—Pre-treatment of the bump connector or the bonding area
- H01L2224/8101—Cleaning the bump connector, e.g. oxide removal step, desmearing
- H01L2224/81011—Chemical cleaning, e.g. etching, flux
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Length Measuring Devices By Optical Means (AREA)
Description
3 基板
4A、4B 部品供給部
6 テープフィーダ
7 ペースト転写ユニット
10 実装ヘッド
24 転写ステージ
24a 塗膜形成面
25 フラックス(接合用ペースト)
26 転写エリア
50 膜厚測定ユニット
52 測定処理部
53 光学式膜厚測定センサ
54 光学プリズム
P 電子部品
Claims (6)
- 下面に半田バンプが形成された電子部品を基板に実装する電子部品実装装置において、前記半田バンプに光透過性を有する接合用ペーストを転写するために用いられるペースト転写ユニットであって、
前記接合用ペーストが供給されるとともに、前記半田バンプをアクセスさせて前記転写を行う転写エリアの少なくとも一部が透光部材で形成された転写ステージと、
前記転写ステージの上方に塗膜形成面との間に所定の膜形成隙間を保って配設され、前記転写ステージに対して水平方向に相対移動することにより前記供給された接合用ペーストを所定膜厚の塗膜に成膜するスキージと、
前記転写ステージの下方に配設され、前記透光部材を介して前記転写エリアにおける前記塗膜の膜厚を測定する光学式膜厚測定センサとを備えたことを特徴とするペースト転写ユニット。 - 前記透光部材は、前記接合用ペーストよりも光の屈折率が高い光学特性を有する材質よりなることを特徴とする請求項1記載のペースト転写ユニット。
- 前記光学式膜厚測定センサにより測定された前記膜厚の測定結果に基づいて、前記膜形成隙間を調整する隙間調整部を備えたことを特徴とする請求項1または2に記載のペースト転写ユニット。
- 前記光学式膜厚測定センサは、前記透光部材の下方に配設された光学プリズムを介して前記膜厚を測定することを特徴とする請求項1乃至3に記載のペースト転写ユニット。
- 下面に半田バンプが形成された電子部品を部品供給部から実装ヘッドによって取り出して基板に移送搭載する電子部品実装装置であって、
前記実装ヘッドに保持された電子部品の前記半田バンプに光透過性を有する接合用ペーストを転写するために用いられるペースト転写ユニットと、
前記実装ヘッドを移動させて前記基板およびペースト転写ユニットにアクセスさせるヘッド移動手段とを備え、
前記ペースト転写ユニットは、請求項1乃至4に記載のペースト転写ユニットであることを特徴とする電子部品実装装置。 - 下面に半田バンプが形成された電子部品を基板に実装する電子部品実装装置において、前記半田バンプに光透過性を有する接合用ペーストを転写するために用いられるペースト転写ユニットの転写ステージに成膜された前記接合用ペーストの塗膜の膜厚を測定する膜厚測定方法であって、
前記転写ステージの下方に配設された光学式膜厚測定センサによって、前記転写ステージにおいて前記半田バンプをアクセスさせて前記転写を行う転写エリアの少なくとも一部に形成された透光部材を介して、前記転写エリアにおける前記塗膜の膜厚を測定することを特徴とする転写膜厚測定方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012284186A JP5861040B2 (ja) | 2012-12-27 | 2012-12-27 | ペースト転写ユニットおよび電子部品実装装置ならびに転写膜厚測定方法 |
US14/655,593 US9285204B2 (en) | 2012-12-27 | 2013-12-19 | Paste transfer unit, electronic component mounting device, and transferred film thickness measuring method |
CN201380068409.0A CN104885592B (zh) | 2012-12-27 | 2013-12-19 | 膏转印组件及电子零件安装装置以及转印膜厚测量方法 |
PCT/JP2013/007477 WO2014103262A1 (ja) | 2012-12-27 | 2013-12-19 | ペースト転写ユニットおよび電子部品実装装置ならびに転写膜厚測定方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012284186A JP5861040B2 (ja) | 2012-12-27 | 2012-12-27 | ペースト転写ユニットおよび電子部品実装装置ならびに転写膜厚測定方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014127615A JP2014127615A (ja) | 2014-07-07 |
JP5861040B2 true JP5861040B2 (ja) | 2016-02-16 |
Family
ID=51020382
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012284186A Active JP5861040B2 (ja) | 2012-12-27 | 2012-12-27 | ペースト転写ユニットおよび電子部品実装装置ならびに転写膜厚測定方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US9285204B2 (ja) |
JP (1) | JP5861040B2 (ja) |
CN (1) | CN104885592B (ja) |
WO (1) | WO2014103262A1 (ja) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9243726B2 (en) | 2012-10-03 | 2016-01-26 | Aarne H. Reid | Vacuum insulated structure with end fitting and method of making same |
JP6272676B2 (ja) * | 2013-11-07 | 2018-01-31 | 東レエンジニアリング株式会社 | ボンディング装置 |
US9463918B2 (en) | 2014-02-20 | 2016-10-11 | Aarne H. Reid | Vacuum insulated articles and methods of making same |
US10542649B2 (en) * | 2014-07-15 | 2020-01-21 | Panasonic Intellectual Property Management Co., Ltd. | Component mounting related apparatus and component mounting related system |
US20160021802A1 (en) * | 2014-07-15 | 2016-01-21 | Panasonic Intellectual Property Management Co., Ltd. | Component mounting related apparatus and component mounting related system |
JP6561469B2 (ja) * | 2015-01-14 | 2019-08-21 | セイコーエプソン株式会社 | 印加電圧設定方法、およびプログラム並びにインクジェットプリンター |
US10497908B2 (en) | 2015-08-24 | 2019-12-03 | Concept Group, Llc | Sealed packages for electronic and energy storage devices |
US10065256B2 (en) * | 2015-10-30 | 2018-09-04 | Concept Group Llc | Brazing systems and methods |
US11702271B2 (en) | 2016-03-04 | 2023-07-18 | Concept Group Llc | Vacuum insulated articles with reflective material enhancement |
CN109315067B (zh) * | 2016-07-04 | 2019-12-24 | 株式会社铃木 | 转印方法以及安装方法 |
JP6804544B2 (ja) * | 2016-09-20 | 2020-12-23 | 株式会社Fuji | 部品実装機 |
CN109792859B (zh) * | 2016-10-05 | 2021-03-16 | 株式会社富士 | 元件安装机 |
KR20200010162A (ko) | 2016-11-15 | 2020-01-30 | 컨셉트 그룹 엘엘씨 | 미세 다공성 절연재를 갖는 향상된 진공-절연된 물품 |
US11008153B2 (en) | 2016-11-15 | 2021-05-18 | Concept Group Llp | Multiply-insulated assemblies |
WO2018109807A1 (ja) * | 2016-12-12 | 2018-06-21 | 株式会社Fuji | 部品装着機 |
JP2020531764A (ja) | 2017-08-25 | 2020-11-05 | コンセプト グループ エルエルシー | 複合的ジオメトリおよび複合的材料の断熱部品 |
US20190275600A1 (en) * | 2018-03-07 | 2019-09-12 | Powertech Technology Inc. | Flux transfer tool and flux transfer method |
WO2021243545A1 (zh) * | 2020-06-02 | 2021-12-09 | 南京溧水高新创业投资管理有限公司 | 一种电子零件安装装置 |
CN113547182B (zh) * | 2021-09-18 | 2021-12-17 | 深圳荣耀智能机器有限公司 | 一种回流炉中助焊剂浓度的检测方法及检测设备 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3723845B2 (ja) * | 2002-03-26 | 2005-12-07 | 国立大学法人富山大学 | 有機エレクトロルミネッセンス素子に使用される有機薄膜の膜厚測定法および測定装置 |
JP4908955B2 (ja) * | 2006-07-18 | 2012-04-04 | ヤマハ発動機株式会社 | 印刷検査方法および印刷検査装置 |
JP5082358B2 (ja) * | 2006-09-22 | 2012-11-28 | ソニー株式会社 | 塗布装置、実装装置及び電子部品の製造方法 |
JP4788759B2 (ja) * | 2008-11-20 | 2011-10-05 | パナソニック株式会社 | 部品実装装置 |
JP5610915B2 (ja) * | 2010-08-17 | 2014-10-22 | 富士機械製造株式会社 | ディップフラックスユニット |
JP5057409B2 (ja) * | 2011-02-16 | 2012-10-24 | 富士機械製造株式会社 | フラックス転写装置 |
-
2012
- 2012-12-27 JP JP2012284186A patent/JP5861040B2/ja active Active
-
2013
- 2013-12-19 WO PCT/JP2013/007477 patent/WO2014103262A1/ja active Application Filing
- 2013-12-19 US US14/655,593 patent/US9285204B2/en active Active
- 2013-12-19 CN CN201380068409.0A patent/CN104885592B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
US9285204B2 (en) | 2016-03-15 |
JP2014127615A (ja) | 2014-07-07 |
WO2014103262A1 (ja) | 2014-07-03 |
CN104885592B (zh) | 2018-02-02 |
CN104885592A (zh) | 2015-09-02 |
US20150345930A1 (en) | 2015-12-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5861040B2 (ja) | ペースト転写ユニットおよび電子部品実装装置ならびに転写膜厚測定方法 | |
JP6174677B2 (ja) | 部品実装装置および部品実装装置における校正方法 | |
JP6871930B2 (ja) | 実装装置 | |
JP6355097B2 (ja) | 実装システム、キャリブレーション方法及びプログラム | |
JP5786139B2 (ja) | 電子部品実装装置および電子部品実装装置におけるペースト転写方法 | |
WO2015040696A1 (ja) | 部品実装機 | |
JP5373657B2 (ja) | 部品実装装置および部品実装方法 | |
JP5845421B2 (ja) | 電子部品実装装置および転写膜厚検出方法 | |
EP2981162B1 (en) | Manufacturing equipment | |
JP6837161B2 (ja) | 撮像ユニット及び部品実装機 | |
JP6351486B2 (ja) | 電子部品搬送ノズル及びこれを有する電子部品実装装置 | |
JP5786138B2 (ja) | 電子部品実装装置および電子部品実装装置におけるペースト転写方法 | |
JP6225335B2 (ja) | 部品実装装置及び部品実装方法 | |
EP3419404B1 (en) | Component determination device and component determination method | |
JP6322807B2 (ja) | ペースト転写装置及び電子部品実装機 | |
JP2022170080A (ja) | 部品実装装置 | |
EP3606302B1 (en) | Electronic component mounting machine and mounting method | |
CN219560243U (zh) | 点胶机构 | |
CN212093041U (zh) | 一种点胶机构及显示屏生产线 | |
JP4781461B2 (ja) | 部品認識装置、部品認識方法および表面実装機 | |
JP2007149934A (ja) | 部品位置認識装置、基板認識装置及び電子部品実装装置 | |
KR20180000209A (ko) | 부품 실장 장치 및 부품 실장 방법 | |
CN117531656A (zh) | 自动跟随点胶设备 | |
JP5042681B2 (ja) | 部品実装装置 | |
CN117991460A (zh) | 透镜自动耦合装置及方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A711 | Notification of change in applicant |
Free format text: JAPANESE INTERMEDIATE CODE: A711 Effective date: 20141006 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20150115 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20150707 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20150720 |
|
R151 | Written notification of patent or utility model registration |
Ref document number: 5861040 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R151 |