SG11201807190XA - Transfer method and mounting method - Google Patents

Transfer method and mounting method

Info

Publication number
SG11201807190XA
SG11201807190XA SG11201807190XA SG11201807190XA SG11201807190XA SG 11201807190X A SG11201807190X A SG 11201807190XA SG 11201807190X A SG11201807190X A SG 11201807190XA SG 11201807190X A SG11201807190X A SG 11201807190XA SG 11201807190X A SG11201807190X A SG 11201807190XA
Authority
SG
Singapore
Prior art keywords
mounting
transfer
transfer method
mounting method
mpo
Prior art date
Application number
SG11201807190XA
Other languages
English (en)
Inventor
Tsutomu Katashio
Teruyuki Usui
Kazuo Hiraki
Tsuyoshi TATSUIWA
Original Assignee
Suzuki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suzuki Co Ltd filed Critical Suzuki Co Ltd
Publication of SG11201807190XA publication Critical patent/SG11201807190XA/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Die Bonding (AREA)
  • Heterocyclic Carbon Compounds Containing A Hetero Ring Having Oxygen Or Sulfur (AREA)
SG11201807190XA 2016-07-04 2016-07-04 Transfer method and mounting method SG11201807190XA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2016/069808 WO2018008066A1 (ja) 2016-07-04 2016-07-04 転写方法および実装方法

Publications (1)

Publication Number Publication Date
SG11201807190XA true SG11201807190XA (en) 2019-01-30

Family

ID=60912619

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201807190XA SG11201807190XA (en) 2016-07-04 2016-07-04 Transfer method and mounting method

Country Status (6)

Country Link
JP (1) JP6543421B2 (ko)
KR (1) KR102019298B1 (ko)
CN (1) CN109315067B (ko)
SG (1) SG11201807190XA (ko)
TW (1) TWI710294B (ko)
WO (1) WO2018008066A1 (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7023740B2 (ja) * 2018-02-22 2022-02-22 東レエンジニアリング株式会社 実装装置
KR102436955B1 (ko) * 2020-03-11 2022-08-26 넥스타테크놀로지 주식회사 실장 헤드 및 이를 포함하는 부품 실장 장치
KR102391169B1 (ko) * 2020-03-11 2022-05-03 넥스타테크놀로지 주식회사 실장 헤드 및 이를 포함하는 부품 실장 장치
KR102182856B1 (ko) * 2020-03-11 2020-11-25 넥스타테크놀로지 주식회사 부품 실장 장치
KR102271499B1 (ko) * 2020-10-16 2021-07-01 넥스타테크놀로지 주식회사 실장 헤드 및 이를 포함하는 부품 실장 장치

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03120790A (ja) * 1989-10-03 1991-05-22 Toshiba Corp 配線基板の接続装置
JPH09181491A (ja) * 1995-12-27 1997-07-11 Toshiba Corp 半導体装置の実装方法及び実装構造
JP2002226822A (ja) * 2001-01-30 2002-08-14 Three M Innovative Properties Co 光線活性化型接着フィルムを用いた基材接着方法
JP3914732B2 (ja) * 2001-10-02 2007-05-16 鹿児島日本電気株式会社 回路基板の接続構造及び該接続構造を備えた液晶表示装置並びに液晶表示装置の実装方法
JP2004235442A (ja) * 2003-01-30 2004-08-19 Sharp Corp 表面実装電子部品の実装方法および接着剤供給装置
JP2008177351A (ja) * 2007-01-18 2008-07-31 Fujitsu Ltd 電子装置および電子装置の製造方法
JP2009158791A (ja) * 2007-12-27 2009-07-16 Ohashi Seisakusho:Kk 緩衝材テープ供給装置の連装装置
JP2011082242A (ja) 2009-10-05 2011-04-21 Panasonic Corp 電子部品実装装置及び電子部品実装方法
JP5370278B2 (ja) * 2010-06-09 2013-12-18 パナソニック株式会社 テープ貼付け装置およびテープ貼付け方法
JP5630639B2 (ja) * 2010-07-07 2014-11-26 住友電気工業株式会社 フィルム状導電性接着剤
JP5025825B2 (ja) * 2010-07-28 2012-09-12 積水化学工業株式会社 絶縁性粒子付き導電性粒子、異方性導電材料及び接続構造体
JP5873972B2 (ja) * 2012-02-23 2016-03-01 パナソニックＩｐマネジメント株式会社 電子部品搭載方法
JP5861040B2 (ja) * 2012-12-27 2016-02-16 パナソニックＩｐマネジメント株式会社 ペースト転写ユニットおよび電子部品実装装置ならびに転写膜厚測定方法

Also Published As

Publication number Publication date
TWI710294B (zh) 2020-11-11
TW201803436A (zh) 2018-01-16
KR20190024869A (ko) 2019-03-08
JPWO2018008066A1 (ja) 2019-04-18
WO2018008066A1 (ja) 2018-01-11
KR102019298B1 (ko) 2019-09-06
CN109315067A (zh) 2019-02-05
CN109315067B (zh) 2019-12-24
JP6543421B2 (ja) 2019-07-10

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