TWI700709B - 導電糊及導體膜的形成方法 - Google Patents
導電糊及導體膜的形成方法 Download PDFInfo
- Publication number
- TWI700709B TWI700709B TW105131910A TW105131910A TWI700709B TW I700709 B TWI700709 B TW I700709B TW 105131910 A TW105131910 A TW 105131910A TW 105131910 A TW105131910 A TW 105131910A TW I700709 B TWI700709 B TW I700709B
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- Taiwan
- Prior art keywords
- conductive paste
- gravure printing
- contact angle
- film
- conductive
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 25
- 238000007646 gravure printing Methods 0.000 claims abstract description 50
- 238000012360 testing method Methods 0.000 claims abstract description 22
- 238000007639 printing Methods 0.000 claims description 21
- 239000000843 powder Substances 0.000 claims description 19
- 239000000853 adhesive Substances 0.000 claims description 11
- 230000001070 adhesive effect Effects 0.000 claims description 11
- 239000003960 organic solvent Substances 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 10
- 238000007747 plating Methods 0.000 claims description 10
- 229910052759 nickel Inorganic materials 0.000 claims description 8
- 230000002093 peripheral effect Effects 0.000 claims description 8
- 238000001354 calcination Methods 0.000 claims description 6
- 229910052804 chromium Inorganic materials 0.000 claims description 4
- 238000011049 filling Methods 0.000 claims description 2
- 239000010408 film Substances 0.000 abstract description 49
- 239000004020 conductor Substances 0.000 abstract description 22
- 239000000919 ceramic Substances 0.000 abstract description 21
- 238000012546 transfer Methods 0.000 abstract description 9
- 239000010409 thin film Substances 0.000 abstract description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 19
- 239000002245 particle Substances 0.000 description 11
- 230000003746 surface roughness Effects 0.000 description 10
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 7
- 229910002113 barium titanate Inorganic materials 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 7
- 239000000203 mixture Substances 0.000 description 7
- 239000002904 solvent Substances 0.000 description 7
- 238000011156 evaluation Methods 0.000 description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 238000001035 drying Methods 0.000 description 4
- 230000003628 erosive effect Effects 0.000 description 4
- 238000010304 firing Methods 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 230000003068 static effect Effects 0.000 description 3
- WWJLCYHYLZZXBE-UHFFFAOYSA-N 5-chloro-1,3-dihydroindol-2-one Chemical compound ClC1=CC=C2NC(=O)CC2=C1 WWJLCYHYLZZXBE-UHFFFAOYSA-N 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 239000001856 Ethyl cellulose Substances 0.000 description 2
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 2
- KGEKLUUHTZCSIP-UHFFFAOYSA-N Isobornyl acetate Natural products C1CC2(C)C(OC(=O)C)CC1C2(C)C KGEKLUUHTZCSIP-UHFFFAOYSA-N 0.000 description 2
- 239000001940 [(1R,4S,6R)-1,7,7-trimethyl-6-bicyclo[2.2.1]heptanyl] acetate Substances 0.000 description 2
- 239000005456 alcohol based solvent Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229920001249 ethyl cellulose Polymers 0.000 description 2
- 235000019325 ethyl cellulose Nutrition 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- UODXCYZDMHPIJE-UHFFFAOYSA-N menthanol Chemical compound CC1CCC(C(C)(C)O)CC1 UODXCYZDMHPIJE-UHFFFAOYSA-N 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- CFJYNSNXFXLKNS-UHFFFAOYSA-N p-menthane Chemical compound CC(C)C1CCC(C)CC1 CFJYNSNXFXLKNS-UHFFFAOYSA-N 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 150000003505 terpenes Chemical class 0.000 description 2
- 235000007586 terpenes Nutrition 0.000 description 2
- DHKHKXVYLBGOIT-UHFFFAOYSA-N 1,1-Diethoxyethane Chemical compound CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 1
- FAMJUFMHYAFYNU-UHFFFAOYSA-N 1-methyl-4-(propan-2-yl)cyclohex-1-ene Chemical compound CC(C)C1CCC(C)=CC1 FAMJUFMHYAFYNU-UHFFFAOYSA-N 0.000 description 1
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 229920001774 Perfluoroether Polymers 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 239000011354 acetal resin Substances 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000003759 ester based solvent Substances 0.000 description 1
- 239000004210 ether based solvent Substances 0.000 description 1
- HJUFTIJOISQSKQ-UHFFFAOYSA-N fenoxycarb Chemical compound C1=CC(OCCNC(=O)OCC)=CC=C1OC1=CC=CC=C1 HJUFTIJOISQSKQ-UHFFFAOYSA-N 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229930004008 p-menthane Natural products 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000000518 rheometry Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 235000015096 spirit Nutrition 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 229940116411 terpineol Drugs 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/008—Selection of materials
- H01G4/0085—Fried electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/012—Form of non-self-supporting electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Organic Chemistry (AREA)
- Wood Science & Technology (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Dispersion Chemistry (AREA)
- Physics & Mathematics (AREA)
- Conductive Materials (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015-217135 | 2015-11-04 | ||
JP2015217135A JP7023042B2 (ja) | 2015-11-04 | 2015-11-04 | 導電ペーストおよび導体膜の形成方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201729221A TW201729221A (zh) | 2017-08-16 |
TWI700709B true TWI700709B (zh) | 2020-08-01 |
Family
ID=58740003
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW105131910A TWI700709B (zh) | 2015-11-04 | 2016-10-03 | 導電糊及導體膜的形成方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7023042B2 (ko) |
KR (1) | KR102600208B1 (ko) |
CN (1) | CN106653146B (ko) |
TW (1) | TWI700709B (ko) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013235806A (ja) * | 2012-05-10 | 2013-11-21 | Samsung Electro-Mechanics Co Ltd | 内部電極用導電性ペースト組成物、積層セラミック電子部品及びその製造方法 |
JP2014188741A (ja) * | 2013-03-26 | 2014-10-06 | Fujifilm Corp | 印刷装置及び印刷方法 |
TW201443169A (zh) * | 2013-05-01 | 2014-11-16 | Jsr Corp | 具有凹圖案的基材的製造方法、組成物、導電膜的形成方法、電子電路及電子元件 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1032968C (zh) * | 1990-01-18 | 1996-10-09 | E.I.内穆尔杜邦公司 | 生坯陶瓷体烧成期间降低收缩的方法 |
JPH06142579A (ja) | 1992-11-12 | 1994-05-24 | Sony Corp | 塗布装置 |
JP3601226B2 (ja) | 1997-01-16 | 2004-12-15 | 松下電器産業株式会社 | グラビア焼成インキ |
JP2000182435A (ja) * | 1998-12-15 | 2000-06-30 | Murata Mfg Co Ltd | 導電性ペースト及びセラミック電子部品 |
JP4389431B2 (ja) | 2001-12-13 | 2009-12-24 | 株式会社村田製作所 | グラビア印刷用導電性ペーストおよびその製造方法、ならびに積層セラミック電子部品 |
JP3918569B2 (ja) | 2001-12-20 | 2007-05-23 | 株式会社村田製作所 | 導電性ペーストおよび積層セラミック電子部品 |
JP4432106B2 (ja) * | 2003-10-22 | 2010-03-17 | 株式会社村田製作所 | グラビア印刷用インク、及び積層セラミック電子部品の製造方法 |
CN101036199A (zh) * | 2004-10-08 | 2007-09-12 | 三井金属矿业株式会社 | 导电性油墨 |
JP4572704B2 (ja) * | 2005-03-03 | 2010-11-04 | 株式会社村田製作所 | グラビア印刷用導電性ペーストおよび積層セラミック電子部品の製造方法 |
CN101384425A (zh) * | 2006-02-20 | 2009-03-11 | 大赛璐化学工业株式会社 | 多孔性薄膜及使用了多孔性薄膜的层叠体 |
JP2010155882A (ja) * | 2008-12-26 | 2010-07-15 | Hitachi Maxell Ltd | 透明導電膜形成用インク及び透明導電膜 |
JP5560014B2 (ja) * | 2009-09-30 | 2014-07-23 | 太陽ホールディングス株式会社 | 導電性ペースト |
JP5663892B2 (ja) * | 2010-02-16 | 2015-02-04 | 住友化学株式会社 | 薄膜の製造方法 |
KR20120059126A (ko) * | 2010-11-30 | 2012-06-08 | 삼성전기주식회사 | 그라비아 인쇄용 내부전극 페이스트 조성물, 이를 이용한 적층 세라믹 커패시터 및 이의 제조방법 |
JP6417621B2 (ja) | 2014-02-12 | 2018-11-07 | ナガセケムテックス株式会社 | インク用組成物及び透明電極 |
US20150240100A1 (en) * | 2014-02-24 | 2015-08-27 | Xerox Corporation | Silver nanoparticle inks with gelling agent for gravure and flexographic printing |
-
2015
- 2015-11-04 JP JP2015217135A patent/JP7023042B2/ja active Active
-
2016
- 2016-10-03 TW TW105131910A patent/TWI700709B/zh active
- 2016-10-27 CN CN201610959190.9A patent/CN106653146B/zh active Active
- 2016-11-02 KR KR1020160144949A patent/KR102600208B1/ko active IP Right Grant
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013235806A (ja) * | 2012-05-10 | 2013-11-21 | Samsung Electro-Mechanics Co Ltd | 内部電極用導電性ペースト組成物、積層セラミック電子部品及びその製造方法 |
JP2014188741A (ja) * | 2013-03-26 | 2014-10-06 | Fujifilm Corp | 印刷装置及び印刷方法 |
TW201443169A (zh) * | 2013-05-01 | 2014-11-16 | Jsr Corp | 具有凹圖案的基材的製造方法、組成物、導電膜的形成方法、電子電路及電子元件 |
Also Published As
Publication number | Publication date |
---|---|
KR102600208B1 (ko) | 2023-11-08 |
CN106653146B (zh) | 2020-01-10 |
JP2017088668A (ja) | 2017-05-25 |
JP7023042B2 (ja) | 2022-02-21 |
CN106653146A (zh) | 2017-05-10 |
TW201729221A (zh) | 2017-08-16 |
KR20170052498A (ko) | 2017-05-12 |
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