TWI700709B - Method for forming conductive paste and conductive film - Google Patents
Method for forming conductive paste and conductive film Download PDFInfo
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- TWI700709B TWI700709B TW105131910A TW105131910A TWI700709B TW I700709 B TWI700709 B TW I700709B TW 105131910 A TW105131910 A TW 105131910A TW 105131910 A TW105131910 A TW 105131910A TW I700709 B TWI700709 B TW I700709B
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- 238000007646 gravure printing Methods 0.000 claims abstract description 50
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- 239000010408 film Substances 0.000 abstract description 49
- 239000004020 conductor Substances 0.000 abstract description 22
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- FAMJUFMHYAFYNU-UHFFFAOYSA-N 1-methyl-4-(propan-2-yl)cyclohex-1-ene Chemical compound CC(C)C1CCC(C)=CC1 FAMJUFMHYAFYNU-UHFFFAOYSA-N 0.000 description 1
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- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
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- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
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- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/008—Selection of materials
- H01G4/0085—Fried electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/012—Form of non-self-supporting electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
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- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Dispersion Chemistry (AREA)
- Conductive Materials (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
本發明之課題,係提供一種能夠形成適合於小型高容量MLCC的內部電極之連續且較薄的導體膜之凹版印刷用導電糊、及該導體膜的形成方法。 本發明之解決手段,係提供一種導電糊,因為其黏度x(Pa・s)、及相對於算術平均粗糙度Ra為0.010(μm)以下的試驗面之接觸角y(∘)係滿足y<17.6x+19.1 (但是,x≦3.0、y<40),所以使用該導電糊而在陶瓷生坯片上施行凹版印刷時,導電糊能夠迅速且均勻地從凹版印刷製版被轉印。藉此,因為從剛轉印後糊劑表面就成為平滑面,所以容易在保持連續性的狀態下將膜厚薄化,因而能夠形成適合於小型高容量MLCC的內部電極之連續且較薄的膜厚之導體膜。The subject of the present invention is to provide a conductive paste for gravure printing capable of forming a continuous and thin conductor film suitable for internal electrodes of a small high-capacity MLCC, and a method for forming the conductor film. The solution of the present invention is to provide a conductive paste, because the viscosity x (Pa・s) and the contact angle y (∘) of the test surface with respect to the arithmetic mean roughness Ra of 0.010 (μm) or less satisfy y< 17.6x+19.1 (however, x≦3.0, y<40), so when gravure printing is performed on a ceramic green sheet using this conductive paste, the conductive paste can be quickly and uniformly transferred from the gravure printing plate. As a result, since the surface of the paste becomes smooth immediately after transfer, it is easy to reduce the film thickness while maintaining continuity, and thus it is possible to form a continuous and thin film suitable for internal electrodes of small high-capacity MLCCs Thick conductor film.
Description
本發明係有關於一種能夠適合使用在凹版印刷(gravure printing)之導電糊、及利用凹版印刷法之導體膜的形成方法。 The present invention relates to a conductive paste suitable for use in gravure printing and a method for forming a conductive film by gravure printing.
例如,製造在圖1示意性地顯示剖面結構之積層陶瓷電容器(MLCC)10時,係將含有具有耐熱性的金屬作為導電性成分之導電糊,印刷塗布在用以構成其介電體層12之未煅燒的陶瓷生坯片(ceramic green sheet)表面,而且將其層積多數且壓黏之後,藉由施行煅燒處理,從生坯片生成介電體層12之同時,生成由導電糊構成內部電極之導體層14。又,在圖1,16係用以通電至該內部電極(導體層14)之外部電極。在此種內部電極的印刷形成,係能夠應用凹版印刷的一種之凹版印刷法(例如參照專利文獻1)。凹版印刷法係將導電糊填充至設置在製版之凹部,藉由將其加壓接觸被印刷面而將導電糊從該製版轉印之連續印刷法,其具有印刷速度較快的優點。
For example, when manufacturing a multilayer ceramic capacitor (MLCC) 10 whose cross-sectional structure is schematically shown in FIG. 1, a conductive paste containing a heat-resistant metal as a conductive component is printed and applied to the
印刷用以形成MLCC的內部電極等之導電糊,以往通常係使用網版印刷法,但是網版印刷法係有起因版延伸之尺寸精確度低落所產生的問題。特別是在0603尺寸(外形尺寸0.6mm×0.3mm×0.3mm)、0402尺寸(外形尺寸0.4mm×0.2mm×0.2mm)等超小型MLCC,確保印刷膜的尺寸精確度係進一步變為困難。相對於此,使用前述的凹版印刷法時,因為不產生版延伸,所以適合於要求此種高精確度印刷之MLCC用途。 In the past, the screen printing method is usually used to print the conductive paste used to form the internal electrodes of the MLCC. However, the screen printing method has a problem caused by the low dimensional accuracy of the plate extension. Especially in ultra-small MLCCs such as 0603 size (outer size 0.6mm×0.3mm×0.3mm) and 0402 size (outer size 0.4mm×0.2mm×0.2mm), it is further difficult to ensure the dimensional accuracy of the printed film. In contrast, when the aforementioned gravure printing method is used, since plate extension does not occur, it is suitable for MLCC applications that require such high-precision printing.
專利文獻1:日本專利特開平10-199331號公報 Patent Document 1: Japanese Patent Laid-Open No. 10-199331
專利文獻2:日本專利特開2003-249121號公報 Patent Document 2: Japanese Patent Laid-Open No. 2003-249121
專利文獻3:日本專利特開2005-126505號公報 Patent Document 3: Japanese Patent Laid-Open No. 2005-126505
專利文獻4:日本專利特開平06-142579號公報 Patent Document 4: Japanese Patent Laid-Open No. 06-142579
在如前述的0603尺寸、0402尺寸等的小型高容量MLCC,係有要求將內部電極的厚度尺寸設作1(μm)以下之情形。為了以此種較薄的膜厚來得到連續膜,必須形成表面平滑的印刷膜。在印刷速度較快速且印刷、乾燥步驟之生產作業時間(tact time)較短的凹版印刷法,因為從被印刷起至進入乾燥為止的時間變短,使印刷膜調平之時間亦變短。因此,為了得到具有優異的表面平滑性之印刷膜,較佳是藉由導電糊從製版均勻地被轉印,在剛轉印後立即形成表面平滑的印刷膜。 In small high-capacity MLCCs such as the aforementioned 0603 size, 0402 size, etc., it is required to set the thickness of the internal electrode to 1 ( μm ) or less. In order to obtain a continuous film with such a thin film thickness, it is necessary to form a printed film with a smooth surface. In the gravure printing method where the printing speed is faster and the tact time of the printing and drying steps is short, the time from printing to drying becomes shorter, and the time for leveling the printed film is also shorter. Therefore, in order to obtain a printed film with excellent surface smoothness, it is preferable to uniformly transfer from the plate making by a conductive paste, and to form a printed film with a smooth surface immediately after the transfer.
以往,已進行各種使用在凹版印刷法之改良導電糊的提案。例如將凹版印刷法應用在MLCC時,有提案揭示使用石油系溶劑或醇系溶劑,用以抑制因溶劑引起陶瓷生坯片膨潤和再溶解(薄片浸蝕)(例如參照前述專利文獻1)。又,在抑制薄片浸蝕時,有提案揭示考慮印刷塗膜的乾燥速度而使用1-對薄荷烯(1-p-menthene)、對薄荷烷(p-menthane)等的溶劑(例如參照專利文獻2)。 In the past, various proposals have been made to improve conductive pastes used in gravure printing. For example, when the gravure printing method is applied to MLCC, it has been proposed to use petroleum solvents or alcohol solvents to suppress swelling and re-dissolution (sheet erosion) of ceramic green sheets due to solvents (for example, refer to the aforementioned Patent Document 1). In addition, when suppressing sheet erosion, there are proposals to disclose the use of solvents such as 1-p-menthene and p-menthane in consideration of the drying speed of the printed coating film (for example, refer to Patent Document 2 ).
又,在製造MLCC等的積層陶瓷零件時,將導電糊印刷在陶瓷生坯片後,將以陶瓷原料作為主成分之糊劑印刷在導體圖案的形成部以外的部位而使陶瓷生坯片的表面平坦化時,有提案揭示藉由使糊劑中除了含有乙基纖維素樹脂以外,亦含有數量平均分子量為300~5,000的萜烯樹脂,來形成具有優異的柔軟性之印刷膜(例如參照專利文獻3)。在凹版印刷,係使用低黏度且經抑制觸變性之導電糊,來使其容易地從印刷版被轉印至被印刷體,但是從此種導電糊所生成的印 刷膜,在陶瓷糊劑印刷時,當印刷版接觸時容易產生導體圖案破損.脫落。因此希望藉由提高印刷膜的柔軟性,來抑制該破損、脫落。 In addition, when manufacturing laminated ceramic parts such as MLCC, after printing a conductive paste on a ceramic green sheet, a paste mainly composed of a ceramic raw material is printed on a portion other than the conductor pattern formation portion to make the ceramic green sheet When the surface is flattened, it has been proposed that the paste contains not only ethyl cellulose resin but also terpene resin with a number average molecular weight of 300 to 5,000 to form a printed film with excellent flexibility (for example, refer to Patent Document 3). In gravure printing, a conductive paste with low viscosity and suppressed thixotropy is used to make it easy to transfer from the printing plate to the to-be-printed body, but the print produced from this conductive paste Film brushing, when the ceramic paste is printed, the conductor pattern is easily damaged when the printing plate contacts. Fall off. Therefore, it is desired to improve the flexibility of the printed film to suppress the breakage and peeling.
而且,以藉由製版側的變更來改善糊劑轉印性作為目的,有提案揭示一種使用對水之接觸角為50°以上的被膜覆蓋槽溝內而成之製版(例如參照專利文獻4)。依照該製版,因為藉由使用全氟烷氧基樹脂等覆蓋槽溝,與水的接觸角增大為50°以上,一般認為糊劑與製版的濕潤性降低且轉印性提升。 Furthermore, for the purpose of improving the transferability of the paste by changing the plate-making side, there is a proposal to disclose a plate-making method in which the groove is covered with a film having a contact angle of 50° or more to water (for example, refer to Patent Document 4) . According to this platemaking, because the contact angle with water is increased to 50° or more by covering the grooves with perfluoroalkoxy resin or the like, it is believed that the wettability of the paste and the platemaking is reduced and the transferability is improved.
如此,就抑制薄片浸蝕和提高印刷膜強度的觀點等而言,已有各種使用在凹版印刷法之導電糊的改良和製版的改良之各種提案。但是該等無法使用於以1(μm)以下之較薄的膜厚來形成連續膜。又,即便以成為同樣的接觸角之方式調製導電糊,導電性粉末的種類、粒徑等、媒液(Vehicle)等的組成有差異時,轉印性為不同而未必能夠得到良好的結果,亦再次試驗而清楚明白上述結果。 In this way, from the viewpoints of suppressing sheet erosion and increasing the strength of the printed film, various proposals have been made to improve the conductive paste used in the gravure printing method and to improve the plate making. However, these cannot be used to form a continuous film with a thin film thickness of 1 ( μm ) or less. In addition, even if the conductive paste is prepared so as to have the same contact angle, when the type of conductive powder, particle size, etc., and the composition of the vehicle are different, the transferability is different, and good results may not be obtained. Also tried again to clearly understand the above results.
本發明係以上述情況作為背景而進行,其目的係提供一種能夠形成適合於小型高容量MLCC的內部電極之連續且較薄的導體膜之凹版印刷用電糊、及該導體膜的形成方法。 The present invention is based on the above-mentioned circumstances, and its object is to provide an electro-paste for gravure printing capable of forming a continuous and thin conductor film suitable for internal electrodes of a small high-capacity MLCC, and a method for forming the conductor film.
為了達成如此的目的,作為第1發明的要旨,係一種含有導電性粉末、黏著劑、及有機溶劑之凹版印刷用導電糊,其在25(℃)且剪切速度40(1/s)之黏度設作x(Pa.s)、算術平均粗糙度Ra為0.010(μm)以下之水平的試驗面在25(℃)滴下10(μL)時的接觸角設作y(°),此時x、y滿足下式(1)。 In order to achieve such an objective, as the gist of the first invention, a conductive paste for gravure printing containing conductive powder, adhesive, and organic solvent, at a temperature of 25 (℃) and a shear rate of 40 (1/s) Set the viscosity as x (Pa.s), and the contact angle of the test surface with the arithmetic mean roughness Ra of 0.010 (μm) or less when dropping 10 (μL) at 25 (℃) as y (°), at this time x , Y satisfies the following formula (1).
y<17.6x+19.1(但是,x≦3.0、y<40)...(1) y<17.6x+19.1 (however, x≦3.0, y<40). . . (1)
又,為了達成前述目的,作為第2發明的要旨,係一種包含下列步驟之導體膜的形成方法:調製含有導電性粉末、黏著劑、及有機溶劑之導電糊之步驟;將該導電糊填充在凹版印刷製版的凹處並轉印至被印刷面之印刷步驟;及藉由對所形成的印刷膜施行煅燒處理而在該被印刷面形成導體膜之煅燒步驟;其中,前述調製導電糊之步驟,係在滿足下述情況下進行前述導電糊之調製:在25(℃)且剪切速 度40(1/s)之黏度x(Pa.s)、使用與前述凹版印刷製版的最外周面相同材料且以成為相同表面狀態的方式水平配置的試驗面時之接觸角y(°),所述x、y滿足前述(1)式。 In addition, in order to achieve the foregoing object, as the gist of the second invention, a method for forming a conductive film includes the steps of: preparing a conductive paste containing conductive powder, an adhesive, and an organic solvent; and filling the conductive paste with The printing step of gravure printing the concave portion of the plate making and transferring to the printed surface; and the calcining step of forming a conductive film on the printed surface by calcining the formed printed film; wherein, the step of preparing the conductive paste , The preparation of the aforementioned conductive paste is carried out under the following conditions: at 25 (℃) and shear rate The viscosity x (Pa.s) of degree 40 (1/s), the contact angle y (°) when using the same material as the outermost peripheral surface of the gravure printing plate and the test surface arranged horizontally so as to become the same surface state, The x and y satisfy the aforementioned formula (1).
依照前述第1發明,因為凹版印刷用導電糊其黏度x(Pa.s)、相對於算術平均粗糙度Ra為0.010(μm)以下的試驗面之接觸角y(°)係滿足前述(1)式,所以使用該導電糊而在被印刷面施行凹版印刷時,導電糊係迅速地且均勻地從凹版印刷製版被轉印至該被印刷面。藉此,因為從剛轉印後糊劑表面就成為平滑面,因而容易在保持連續性的狀態下將膜厚薄化,所以使用該導電糊時,能夠形成適合於小型高容量MLCC的內部電極之連續且較薄的膜厚之導體膜。 According to the aforementioned first invention, the viscosity x (Pa.s) of the conductive paste for gravure printing and the contact angle y (°) of the test surface with respect to the arithmetic mean roughness Ra of 0.010 (μm) or less satisfy the aforementioned (1) Therefore, when gravure printing is performed on the printed surface using the conductive paste, the conductive paste is quickly and uniformly transferred from the gravure printing plate to the printed surface. As a result, since the surface of the paste becomes smooth immediately after transfer, it is easy to reduce the film thickness while maintaining continuity. Therefore, when the conductive paste is used, it is possible to form an internal electrode suitable for small high-capacity MLCCs. Continuous and thin conductor film.
又,依照前述第2發明,使用凹版印刷法形成導體膜時,在調製導電糊之步驟,係在滿足下述情況下進行前述導電糊之調製:在40(1/s)之黏度x(Pa.s)、使用與凹版印刷製版的最外周面相同材料且以成為相同表面狀態的方式水平配置的試驗面滴下10(μL)時之接觸角y(°),所述x、y滿足前述(1)式。因此,在印刷步驟,使用該導電糊而施行凹版印刷時,導電糊會迅速地且均勻地被轉印至被印刷面。藉此,因為從剛轉印後糊劑表面就成為平滑面,因而容易在保持連續性的狀態下將膜厚薄化,所以能夠形成適合於小型高容量MLCC的內部電極之連續且較薄的膜厚之導體膜。又,在本案,「製版的最外周面」係意指在製版形成印刷圖案前在圓筒面上之面。 Furthermore, according to the aforementioned second invention, when the conductive film is formed by the gravure printing method, in the step of preparing the conductive paste, the preparation of the conductive paste is performed under the following conditions: the viscosity of 40 (1/s) x (Pa .S). The contact angle y(°) when the test surface, which is the same material as the outermost peripheral surface of the gravure printing plate and is arranged in the same surface state, drops 10 (μL), and the x and y satisfy the aforementioned ( 1) Type. Therefore, in the printing step, when gravure printing is performed using the conductive paste, the conductive paste is quickly and uniformly transferred to the printed surface. As a result, since the surface of the paste becomes smooth immediately after transfer, it is easy to reduce the film thickness while maintaining continuity. Therefore, it is possible to form a continuous and thin film suitable for internal electrodes of small high-capacity MLCCs. Thick conductor film. In addition, in this case, "the outermost peripheral surface of the plate making" means the surface on the cylindrical surface before the printing pattern is formed in the plate making.
順便提一下,以往,以從凹版印刷製版被均勻地轉印至被印刷面作為目的,已嘗試導電糊的有機組成之最佳化、流變學的最佳化等,但是如前述,該等嘗試並未獲得充分的結果。相對於此,本申請發明係發現不僅是製版與導電糊的濕潤性亦即接觸角的大小,而且導電糊的黏度亦與轉印性有關聯。藉由黏度與接觸角係滿足前述(1)式的方式進行調製,亦即,藉由在與黏度的關係將接觸角設為一定值以下,導電糊能夠從凹版印刷製版均勻地被轉印至被印刷面且從剛轉 印後膜表面變為平滑。 Incidentally, in the past, for the purpose of uniformly transferring from the gravure printing plate to the printed surface, attempts have been made to optimize the organic composition of the conductive paste and the rheology. However, as mentioned above, these The attempt did not yield sufficient results. In contrast, the invention of the present application found that not only the wettability between the plate making and the conductive paste, that is, the size of the contact angle, but also the viscosity of the conductive paste is also related to the transferability. By adjusting the viscosity and contact angle to satisfy the aforementioned formula (1), that is, by setting the contact angle below a certain value in relation to the viscosity, the conductive paste can be uniformly transferred from the gravure printing plate to the Printed side The surface of the film becomes smooth after printing.
又,在第1發明,試驗面的表面粗糙度係算術平均粗糙度Ra必須為0.010(μm)以下。因為凹版印刷製版的最外周面的表面粗糙度係通常Ra為0.010(μm)以下,所以使用上述試驗面之評價,係能夠視為使用通常的凹版印刷製版的最外周面之評價。 In addition, in the first invention, the arithmetic mean roughness Ra of the surface roughness of the test surface must be 0.010 ( μm ) or less. Because the surface roughness of the outermost peripheral surface of the gravure printing plate is usually Ra of 0.010 ( μm ) or less, the evaluation using the above-mentioned test surface can be regarded as the evaluation of the outermost peripheral surface using the normal gravure printing plate.
而且,在本案,黏度x(Pa.s)係使用在25(℃)且剪切速度40(1/s)之靜黏度。因為該條件係考慮凹版印刷進行時的室溫、及在凹版印刷時導電糊被轉印至被印刷面時作用在該導電糊的應力等而決定,所以藉由使用該值,導電糊的黏度及接觸角與轉印性之間的相關性係能夠穩定地得到。又,黏度測定係能夠使用市售的黏度計而進行。 Moreover, in this case, the viscosity x (Pa.s) is a static viscosity at 25 (℃) and a shear rate of 40 (1/s). This condition is determined by considering the room temperature during gravure printing and the stress that acts on the conductive paste when the conductive paste is transferred to the printed surface during gravure printing. Therefore, by using this value, the viscosity of the conductive paste And the correlation between contact angle and transferability can be stably obtained. In addition, the viscosity measurement system can be performed using a commercially available viscometer.
又,在本案,接觸角y(°)係測定於25(℃)滴下10(μL)至水平面之液滴所測得的值。因為該條件係考慮凹版印刷進行時的室溫、及MLCC的內部電極形成時被轉印的導電糊劑之量等而決定,所以藉由使用該值,導電糊的黏度及接觸角與轉印性之間的相關性係能夠穩定地得到。又,導電糊的滴下係例如能夠使用微吸量管而進行,接觸角的測定係能夠使用市售的接觸角計而使用。 Also, in this case, the contact angle y (°) is a value measured by dropping 10 (μL) droplets to the horizontal at 25 (°C). Because this condition is determined by considering the room temperature during the gravure printing and the amount of conductive paste transferred during the formation of the internal electrodes of the MLCC, by using this value, the viscosity and contact angle of the conductive paste are related to the transfer The correlation between sexes can be stably obtained. In addition, the dripping system of the conductive paste can be performed using, for example, a micropipette, and the measurement system of the contact angle can be used using a commercially available contact angle meter.
而且,前述(1)式係在x≦3.0、y<40的範圍成立。大於該等範圍之黏度及接觸角的範圍時,即便滿足y<17.6x+19.1亦無法得到良好的轉印性。 Furthermore, the aforementioned formula (1) holds true in the range of x≦3.0 and y<40. When the viscosity and contact angle are larger than these ranges, even if y<17.6x+19.1 is satisfied, good transferability cannot be obtained.
依照本申請發明,藉由使用如上述規定的方法來測定黏度及接觸角且以該值為滿足前述(1)式的方式來調製導電糊,導電糊如前述能夠得到從凹版印刷製版被均勻地轉印至被印刷面且從剛轉印後膜表面成為平滑之效果。亦即,只有具有接觸角為一定值以上之濕潤性時,無法經常得到良好的轉印性,黏度越小,必須越減小接觸角、亦即必須容易濕潤。 According to the invention of the present application, by measuring the viscosity and contact angle by using the method specified above, and preparing the conductive paste so that the value satisfies the aforementioned formula (1), the conductive paste can be uniformly produced from the gravure printing plate as described above. It is transferred to the printed surface and the film surface becomes smooth after transfer. That is, only when the wettability has a contact angle above a certain value, good transferability cannot always be obtained. The smaller the viscosity, the smaller the contact angle must be, that is, it must be easy to wet.
又,針對接觸角與轉印性之關係,在前述專利文獻4,係揭示接觸角較大者轉印性良好且必須為50°以上,但是太大時,有糊劑不容易進入槽溝之情形。但是,依照本發明者等的研究結果,為 了得到良好的轉印性,接觸角係以較小者為佳,而且如前述(1)式所顯示,在導電糊與製版之間測定時,必須成為40°以下。雖然上述專利文獻4的記載,以「50°以上且不可太大」為佳,但是依照本發明者等,係得到與其為相反的結果。又,雖然在上述專利文獻4,係藉由對水之值來限定限接觸角,但是這是藉由對水之接觸角之值來間接地限定槽溝的表面狀態,而未考慮實際上係因所使用的糊劑之物性而適當的接觸角為不同。 In addition, regarding the relationship between the contact angle and the transferability, the aforementioned Patent Document 4 discloses that the larger contact angle has good transferability and must be 50° or more, but when it is too large, the paste will not easily enter the grooves. situation. However, according to the research results of the inventors, it is In order to obtain good transferability, the contact angle is preferably smaller, and as shown in the above formula (1), it must be 40° or less when measured between the conductive paste and the plate making. Although the description in Patent Document 4 mentioned above is that "50° or more and not too large" is preferable, but according to the inventors of the present invention, the opposite result was obtained. In addition, although in Patent Document 4 mentioned above, the contact angle is limited by the value of water, this is the surface condition of the groove indirectly limited by the value of the contact angle with water, and the actual system is not considered. The appropriate contact angle is different depending on the physical properties of the paste used.
在此,較佳是在前述第1發明之前述試驗面、或在前述第2發明之前述凹版印刷製版的最外周面及前述試驗面之任一者均是鍍經施行Cr或鍍Ni者。為了提高與導電糊的濕潤性,凹版印刷製版係以經施行鍍Cr或鍍Ni者為佳。因而,在試驗面亦以仿照其而使用經施行鍍Cr或鍍Ni者為佳。又,為了提高濕潤性而減少接觸角,係以施行鍍敷為佳,試驗面的鍍敷種類,係與凹版印刷製版的鍍敷種類一致為佳。但是,因為即便是鍍敷種類有差異亦能夠得到同樣的接觸角,所以不必使的鍍敷種類一致。 Here, it is preferable that either the test surface of the aforementioned first invention or the outermost peripheral surface of the aforementioned gravure printing plate and the aforementioned test surface of the aforementioned second invention is plated with Cr or Ni. In order to improve the wettability with the conductive paste, the gravure printing plate-making system should preferably be plated with Cr or Ni. Therefore, it is better to imitate it on the test surface and use a Cr-plated or Ni-plated one. In addition, in order to improve the wettability and reduce the contact angle, it is better to perform plating, and the plating type of the test surface is preferably the same as the plating type of the gravure printing plate. However, since the same contact angle can be obtained even if there are differences in the types of plating, it is not necessary to match the types of plating.
又,較佳是在前述(1)式,黏度x(Pa.s)的範圍為0.1≦x≦3.0。如前述(1)式所顯示,因為黏度越低,被容許的接觸角y的上限值越低,所以調製能夠滿足(1)式之導電糊係變為困難。因此,黏度係以設作0.1(Pa.s)以上為佳。 Furthermore, it is preferable that the range of the viscosity x (Pa·s) is 0.1≦x≦3.0 in the aforementioned formula (1). As shown in the aforementioned formula (1), because the lower the viscosity, the lower the upper limit of the allowable contact angle y, so it becomes difficult to prepare a conductive paste system that can satisfy the formula (1). Therefore, the viscosity should be set to 0.1 (Pa.s) or more.
又,較佳是在前述(1)式,接觸角y(°)的範圍為10<y<40。接觸角y為10°以下時,因為濕潤性變成太高,反而無法得到良好的轉印性。 Furthermore, it is preferable that in the aforementioned formula (1), the range of the contact angle y (°) is 10<y<40. When the contact angle y is 10° or less, the wettability becomes too high, and on the contrary, good transferability cannot be obtained.
而且,較佳是黏度x及接觸角y為滿足y>8.8x+12.4...(2)者。雖然接觸角y越小,濕潤性越高而操作性變差,但是因為黏度x越低,能夠容許y至越小的值為止,所以較佳是滿足上述式(2)。 Moreover, it is preferable that the viscosity x and the contact angle y satisfy y>8.8x+12.4. . . (2) Person. Although the smaller the contact angle y, the higher the wettability and the worse the handleability, but the lower the viscosity x, the lower the value of y can be allowed, so it is preferable to satisfy the above formula (2).
又,較佳是前述導電糊係用以印刷塗布在陶瓷生坯片來形成導體膜而使用者。本發明的導電糊,係不被用途限定,但是能夠適合使用在將導體膜形成在陶瓷製的絕緣體上之情況。特別是在生坯 片上進行印刷塗布時,在施行煅燒處理而生成絕緣體時,亦可同時藉由煅燒而生成導體膜,在製造成本面具有優點。 Furthermore, it is preferable that the aforementioned conductive paste is used for printing and coating the ceramic green sheet to form a conductive film for the user. The conductive paste of the present invention is not limited by use, but can be suitably used when a conductive film is formed on an insulator made of ceramics. Especially in green In the case of printing and coating on the sheet, when the firing process is performed to produce an insulator, a conductor film can also be produced by firing at the same time, which is advantageous in terms of manufacturing cost.
而且,較佳是前述導電糊係用以形成MLCC的內部電極而使用者。如前述,使用本發明的導電糊時,因為能夠容易地在保持連續性的狀態下使膜厚薄化,所以適合於小型高容量MLCC的內部電極。 Moreover, it is preferable that the aforementioned conductive paste is used to form the internal electrodes of the MLCC for users. As described above, when the conductive paste of the present invention is used, since the film thickness can be easily reduced while maintaining continuity, it is suitable for internal electrodes of small high-capacity MLCCs.
又,較佳是前述導電性粉末為鎳粉末。例如在MLCC的內部電極用途,藉由將印刷有導電糊之陶瓷生坯片進行層積且施行煅燒處理,因為在從陶瓷生坯片生成介電體層之同時生成內部電極,所以導電性粉末係被要求具有耐熱性。因此,作為本發明的導電糊之導電性粉末,係以具有耐熱性之金屬、例如Pt、Pd、Ag-Pd、Ag、Ni、Cu等為佳,但是就製造成本面而言,係以廉價的卑金屬材料為佳,從耐熱性、導電性、價格面而言,特別是以鎳為佳。導電性粉末的平均粒徑,係能夠在可得到導電糊所需要的特性之範圍適當地決定,例如1.0(μm)以下,以0.01~0.50(μm)的範圍為佳,以0.05~0.30(μm)的範圍為更佳。 Furthermore, it is preferable that the aforementioned conductive powder is nickel powder. For example, in the use of internal electrodes of MLCC, by laminating ceramic green sheets printed with conductive paste and subjecting them to firing treatment, the internal electrodes are generated at the same time as the dielectric layer is generated from the ceramic green sheets, so the conductive powder is It is required to have heat resistance. Therefore, as the conductive powder of the conductive paste of the present invention, a heat-resistant metal, such as Pt, Pd, Ag-Pd, Ag, Ni, Cu, etc., is preferred, but in terms of manufacturing cost, it is inexpensive In terms of heat resistance, conductivity, and price, nickel is especially preferred. The average particle size of the conductive powder can be appropriately determined within the range that can obtain the characteristics required for the conductive paste, for example, 1.0 (μm) or less, preferably 0.01 to 0.50 ( μm ), and 0.05 to 0.30 ( The range of μ m) is more preferable.
而且,較佳是前述黏著劑為聚乙烯基丁縮醛、聚乙烯醇、丙烯酸系樹脂、環氧系樹脂、酚系樹脂、醇酸系樹脂、纖維素系高分子、松香系樹脂等。作為本發明的導電糊之黏著劑,能夠適當地選自在能夠實現所需要的黏度和接觸角的範圍通常被使用者,但是就塗膜形成能力(亦即對基板之附著性)和在煅燒時之分解性而言,係以上述物為佳。 Furthermore, it is preferable that the aforementioned adhesive is polyvinyl butyral, polyvinyl alcohol, acrylic resin, epoxy resin, phenol resin, alkyd resin, cellulose polymer, rosin resin or the like. As the adhesive of the conductive paste of the present invention, it can be appropriately selected in the range that can achieve the required viscosity and contact angle. It is usually used by users. However, it is based on the coating film forming ability (that is, the adhesion to the substrate) and during firing. In terms of decomposability, the above substances are better.
又,較佳是前述有機溶劑,係只要能夠適合於將導電性粉末及黏著劑樹脂成分溶解或分散,就沒有特別限制。作為一個例子,係可舉出萜品醇(terpineol)等的醇類系溶劑、異莰基乙酸酯等的萜烯系溶劑、乙二醇等的二醇系溶劑、二乙二醇一丁醚(丁基卡必醇)等的二醇醚系溶劑、酯系溶劑、甲苯、二甲苯等的烴系溶劑、其它礦油精等具有高沸點之有機溶劑。因為該等有機溶劑不容易將陶瓷生坯片中的丁 縮醛系樹脂和丙烯酸系樹脂的黏著劑溶解而不容易產生所謂薄片浸蝕,乃是較佳。 In addition, the aforementioned organic solvent is preferred, and it is not particularly limited as long as it is suitable for dissolving or dispersing the conductive powder and the binder resin component. As an example, the system may include alcohol-based solvents such as terpineol, terpene-based solvents such as isobornyl acetate, glycol-based solvents such as ethylene glycol, and diethylene glycol monobutyl Glycol ether solvents such as ether (butyl carbitol), ester solvents, hydrocarbon solvents such as toluene and xylene, and organic solvents with high boiling points such as other mineral spirits. Because these organic solvents are not easy to The adhesive of the acetal resin and the acrylic resin dissolves and does not easily cause so-called flake erosion, which is preferable.
而且,較佳是前述導電糊係如通常所進行地,含有應用其之陶瓷生坯片的構成成分(共有材料)。例如MLCC的介電體層係由鈦酸鋇所構成時,係以含有鈦酸鋇粉末為佳。因為本發明的導電糊,係能夠容易地形成較薄的內部電極,係以共有材料的平均粒徑係以較小為佳,例如0.5(μm)以下,以0.005~0.2(μm)的範圍為佳,以0.01~0.1(μm)的範圍為更佳。 Furthermore, it is preferable that the aforementioned conductive paste system contains the constituent components (common material) of the ceramic green sheet to which it is applied, as is usually done. For example, when the dielectric layer of the MLCC is composed of barium titanate, it is preferable to contain barium titanate powder. Because the conductive paste of the present invention can easily form thinner internal electrodes, it is better that the average particle size of the common material is smaller, such as 0.5 ( μ m) or less, with 0.005 to 0.2 ( μ m) The range is preferable, and the range of 0.01 to 0.1 ( μ m) is more preferable.
又,前述導電糊的成分比率係沒有特別限定,能夠以滿足前述(1)式和(2)式的方式而適當地決定,例如以質量比計,係以含有30~60(%)的前述導電性粉末、1~5(%)的前述黏著劑、35~65(%)的前述有機溶劑、以及0~20(%)的共有材料之組成為佳。又,含有共有材料時,係以1~20(%)的範圍為佳。 In addition, the composition ratio of the conductive paste is not particularly limited, and can be appropriately determined to satisfy the aforementioned formulas (1) and (2). For example, in terms of mass ratio, it may contain 30-60 (%) of the aforementioned The composition of conductive powder, 1~5 (%) of the aforementioned adhesive, 35~65 (%) of the aforementioned organic solvent, and 0-20 (%) of the common material is preferable. In addition, when a common material is contained, the range of 1-20 (%) is preferable.
10:MLCC 10: MLCC
12:介電體層 12: Dielectric layer
14:導體層 14: Conductor layer
16:外部電極 16: External electrode
圖1係顯示本發明的一實施例的導電糊係被應用在內部電極之MLCC的剖面之圖。 FIG. 1 is a cross-sectional view of an MLCC in which a conductive paste is applied to internal electrodes according to an embodiment of the present invention.
圖2係顯示本發明的一實施例的導電糊黏度與接觸角的關係之圖表。 FIG. 2 is a graph showing the relationship between the viscosity of the conductive paste and the contact angle of an embodiment of the present invention.
以下,詳細地說明本發明的一實施例。又,在以下所說明的實施例,係只要未特別地預先告知,就能夠適當地使用以往通常被採用之結構。 Hereinafter, an embodiment of the present invention will be described in detail. In addition, in the embodiment described below, unless otherwise notified in advance, a structure generally used in the past can be suitably used.
本實施例的導電糊係製造如前述圖1,在製造MLCC10時,係為了利用凹版印刷法來形成當作內部電極之導體層14而使用。在本實施例,介電體層12的一層之厚度尺寸,係例如10(μm)以下,例如0.1~3(μm)的範圍內,例如1(μm)左右,導體層14的一層之厚度尺寸,係例如10(μm)以下,例如0.1~3(μm)的範圍內,例如0.5(μm)左
右。
The conductive paste of the present embodiment is manufactured as shown in FIG. 1. When manufacturing the
上述的導體層14係例如由鎳所形成者,上述的介電體層12係例如由鈦酸鋇所形成者。在製造此種MLCC10時,係依照預先規定的調配方法將導電性粉末、陶瓷粉末、黏著劑、及有機溶劑混合而調製導電糊劑,藉由凹版印刷而印刷塗布在另外準備之用以構成介電體層12之陶瓷生坯片的一面。將塗布有導體糊之陶瓷生坯片層積壓黏後,藉由施行煅燒處理,在生成由陶瓷生坯片所生成的介電體層12之同時,由導體糊劑生成導體層14,隨後,藉由使用浸漬等方法來形成外部電極16,而得到前述圖1所顯示之MLCC10。
The
上述的導電性粉末,係例如平均粒徑為1(μm)以下,例如0.13~0.18(μm)的範圍內之鎳粉末,例如以30~60(wt%)左右的比率被混合在導電糊中。又,上述的陶瓷粉末,係例如平均粒徑為0.1(μm)以下,例如10~20(nm)的範圍內的鈦酸鋇粉末、亦即構成介電體層12之鈦酸鋇的共有材料,例如以鎳比為10~15(wt%)左右的比率被混合在導電糊中。又,上述的黏著劑係例如乙基纖維素、聚乙烯基丁縮醛,上述的有機溶劑係以二氫萜品醇、乙酸異莰酯、丙酸薄荷酯(menthanol propionate)作為主溶劑。該等係各自使用1~5(%)、30~65(%)左右的比率。
The above-mentioned conductive powder is, for example, an average particle diameter of 1 (μm) or less, for example, nickel powder in the range of 0.13 to 0.18 (μm), for example, is mixed in the conductive paste at a ratio of about 30 to 60 (wt%) . In addition, the above-mentioned ceramic powder is, for example, barium titanate powder having an average particle diameter of 0.1 (μm) or less, for example, in the range of 10-20 (nm), that is, a common material for the barium titanate constituting the
在本實施例,上述導電糊的組成係以其黏度、及滴下至使用與凹版印刷版的最外周面相同材料且經調製成為相同表面狀態的試驗面時之接觸角係為滿足前述(1)式(再揭示)的方式調製。黏度係使用例如流變計(HAAKE製Rheostress 6000)所測得的值且使用在25(℃)、剪切速度40(1/s)的條件下1分鐘後的靜黏度。又,接觸角係在25(℃)使用微吸量管滴下10(μL)至被水平地配置之試驗面,且例如使用FACE接觸角計(共和界面化學股份公司製CA-DT)所測定的接觸角。接觸角係例如測定5次之平均值。 In this embodiment, the composition of the above-mentioned conductive paste is based on its viscosity and the contact angle when it is dropped to the test surface with the same material as the outermost peripheral surface of the intaglio printing plate and prepared into the same surface state to satisfy the aforementioned (1) Formula (re-disclosure). The viscosity is a value measured by a rheometer (Rheostress 6000 manufactured by HAAKE) and the static viscosity after 1 minute under the conditions of 25 (°C) and a shear rate of 40 (1/s) is used. In addition, the contact angle is measured by dropping 10 (μL) with a micropipette at 25 (°C) onto the test surface that is arranged horizontally, and for example, using a FACE contact angle meter (CA-DT manufactured by Kyodo Interface Chemical Co., Ltd.) Contact angle. The contact angle is, for example, an average value measured 5 times.
y<17.6x+19.1(但是,x≦3.0、y<40)...(1) y<17.6x+19.1 (however, x≦3.0, y<40). . . (1)
又,上述的試驗面係例如凹版印刷製版為鍍Cr版之情況,例如Cr板,其表面係被精加工成為算術平均粗糙度Ra為0.010(μ m)以下之平滑性非常高的狀態。又,使用與製版同樣地經施行鍍Cr之板來代替Cr板亦無妨。在本實施例,係使用例如從凹版印刷製版之未形成圖案的部分將其表面材剝下者。試驗用平面基板的大小係例如5(cm)×3(cm)。 In addition, the above-mentioned test surface is, for example, a case where the gravure printing plate is a Cr-plated plate. For example, the surface of a Cr plate is finished to a very high smoothness state with an arithmetic average roughness Ra of 0.010 ( μm ) or less. In addition, it is possible to use a plate subjected to Cr plating in the same manner as the plate making instead of the Cr plate. In this embodiment, for example, the surface material is peeled off from the unpatterned portion of the gravure printing plate. The size of the test flat substrate is, for example, 5 (cm)×3 (cm).
將如此進行而調製的導電糊使用凹版印刷法而印刷塗布在陶瓷生坯片之結果,所形成的印刷膜之乾燥膜厚為0.5(μm)左右且具有表面粗糙度Ra為0.020(μm)以下的平滑表面,藉由將其煅燒而得到平滑的連續膜。藉由得到該水準的平滑性,而能夠更有助於提升電容器特性、及可靠性。 As a result of printing and coating the conductive paste prepared in this way on the ceramic green sheet using the gravure printing method, the dry film thickness of the formed printed film is about 0.5 (μm) and the surface roughness Ra is 0.020 (μm) or less The smooth surface is calcined to obtain a smooth continuous film. By obtaining this level of smoothness, it can further contribute to the improvement of capacitor characteristics and reliability.
下述的表1,係在上述導體層14的印刷塗布步驟,將導電糊劑組成進行各種變更且以黏度與接觸角的各種組合來進行評價印刷性之結果彙總而成者。在表1,「Ni粒徑」、「BT粒徑」係各自為鎳粉末的平均粒徑、鈦酸鋇粉末的平均粒徑。又,「BT量」係鈦酸鋇粉末對Ni之質量比。又,「MC」係鎳粉末對糊劑全體之質量比。「40(1/s)黏度」係如前述使用流變計所測定的靜黏度。又,「與Cr板的接觸角」、「鍍Cr製版印刷體Ra」係各自使用鍍Cr製版而施行凹版印刷時之評價數據,前者係導電糊與Cr板的接觸角之測定值,後者係使用該導電糊且印刷塗布在鍍Cr製版而成的印刷膜之乾燥後的表面粗糙度。表面粗糙度係使用干渉顯微鏡(Nikon LV150 ECLIPSE)且在倍率10倍、測定範圍50(μm)×1000(μm)、測定數12所測得的算術平均粗糙度Ra。又,「與Ni板的接觸角」、「鍍Ni製版印刷體Ra」係各自使用鍍Ni製版而施行凹版印刷時之評價數據。
The following Table 1 summarizes the results of evaluating the printability with various combinations of viscosity and contact angle by changing the composition of the conductive paste in the printing and coating step of the
[表1]
在上述表1,印刷體的表面粗糙度Ra為0.020(μm)以下者為印刷性良好者,亦即實施例。在圖2,係顯示上述評價結果之圖表。在圖2,「◆」為實施例,「口」為比較例。實施例1~11係位於比圖2內所圖示的(1)式更下側,為滿足其之導電糊。比較例1~6係位於比(1)式更上側或比黏度3.0(Pa.s)更右側,為不滿足其之本發明的範圍外之比較例的導電糊。 In Table 1 above, those with a surface roughness Ra of 0.020 (μm) or less of the printed matter are those with good printability, that is, examples. In Figure 2, a graph showing the above evaluation results. In Fig. 2, "◆" is an example, and "口" is a comparative example. Examples 1 to 11 are located on the lower side than the formula (1) shown in FIG. 2 and are conductive pastes that satisfy them. Comparative Examples 1 to 6 are conductive pastes of comparative examples that are located on the upper side of formula (1) or on the right side of the viscosity of 3.0 (Pa·s), which do not satisfy the scope of the present invention.
如上述評價結果所顯示,在黏度為0.1~3.0(Pa.s)、接觸角為14~39(°),藉由滿足前述(1)式黏度及接觸角,能夠得到印刷體的表面粗糙度為0.003~0.016(μm)之非常良好的結果。因此,使用此種導電糊而形成MLCC10的內部電極(導體層14)時,能夠從凹版印刷製版而在被印刷面得到良好的轉印性,該結果,因為能夠容易地得到較薄且表面平滑的連續膜,所以能夠以較高的製造產率得到小型、高容量的MLCC10。又,實施例11係對鍍Ni製版亦進行評價,能夠得到與鍍Cr製版時同程度的良好結果。以滿足(1)式的方式調製導電糊時,鍍Cr製
版、鍍Ni製版的任一者均同樣地能夠得到較薄且表面平滑的連續膜。
As shown in the above evaluation results, when the viscosity is 0.1 to 3.0 (Pa.s) and the contact angle is 14 to 39 (°), the surface roughness of the printed body can be obtained by satisfying the above formula (1) viscosity and contact angle It is a very good result of 0.003~0.016 (μm). Therefore, when the internal electrode (conductor layer 14) of the
相對於此,比較例1~4係即便在黏度為0.2~3.0(Pa.s)的範圍,由於接觸角較大而為22~72(°),因為成為不滿足前述(1)式之黏度與接觸角的組合,所以從凹版印刷製版的轉印性較差且印刷體的表面粗糙度Ra成為0.021~0.194(μm)之較大值。該表面粗糙度Ra的大小,係表示印刷膜表面凹凸的大小,因為導體層14的厚度尺寸係非常薄而為0.5(μm)左右,所以如上述的較大的凹凸,係意味著印刷膜無法得到連續性。亦即,比較例的導電糊係難以得到較薄且表面平滑的連續膜。
On the contrary, even in the range of viscosity of 0.2 to 3.0 (Pa.s) in Comparative Examples 1 to 4, the contact angle is 22 to 72 (°) because it does not satisfy the above formula (1). In combination with the contact angle, the transferability of plate making from gravure printing is poor and the surface roughness Ra of the printed body becomes a large value of 0.021 to 0.194 (μm). The surface roughness Ra indicates the size of the unevenness of the printed film surface. Since the thickness of the
又,比較例5、6之黏度係非常高而為5.3~6.9(Pa.s),接觸角為51~61(°)且位於前述(1)式的下側。但是,使用該等而進行凹版印刷時,印刷膜的表面粗糙度Ra係較大的值而為0.036~0.095(μm),與比較例1~4同樣地無法得到連續膜。即便位於(1)式的下側,黏度大於3.0(Pa.s)時轉印性較差。 In addition, the viscosity of Comparative Examples 5 and 6 is very high at 5.3 to 6.9 (Pa.s), and the contact angle is 51 to 61 (°) and is located on the lower side of the aforementioned formula (1). However, when gravure printing is performed using these, the surface roughness Ra of the printed film is a relatively large value and is 0.036 to 0.095 (μm). As in Comparative Examples 1 to 4, a continuous film cannot be obtained. Even at the lower side of formula (1), the transferability is poor when the viscosity is greater than 3.0 (Pa·s).
如上述,依照本實施例,因為導電糊劑係黏度x(Pa.s)、及對算術平均粗糙度Ra為0.010(μm)以下的試驗面之接觸角y(°)為滿足前述(1)式,所以使用該導電糊而在陶瓷生坯片上施行凹版印刷時,導電糊係能夠從凹版印刷製版迅速地且均勻地被轉印。藉此,因為從剛轉印後糊劑表面就成為平滑面且因為在保持連續性的狀態下容易地將膜厚薄化,所以能夠形成適合於小型高容量MLCC10的內部電極之連續且較薄的膜厚之導體膜14。
As mentioned above, according to this embodiment, because the conductive paste system viscosity x (Pa.s) and the contact angle y (°) to the test surface with the arithmetic mean roughness Ra of 0.010 (μm) or less satisfy the aforementioned (1) Therefore, when the conductive paste is used to perform gravure printing on a ceramic green sheet, the conductive paste can be quickly and uniformly transferred from the gravure printing plate. As a result, since the surface of the paste becomes smooth immediately after transfer and the film thickness is easily thinned while maintaining continuity, it is possible to form a continuous and thinner internal electrode suitable for small high-capacity
又,導電糊劑的黏度和接觸角,係藉由變更Ni粒徑、BT粒徑、Ni量、BT量、或變更黏著劑及有機溶劑的種類和量而適當地調整即可。 In addition, the viscosity and contact angle of the conductive paste can be appropriately adjusted by changing the Ni particle size, BT particle size, Ni amount, BT amount, or the types and amounts of adhesives and organic solvents.
而且,依照上述表1及圖2,較佳黏度的下限值為0.1(Pa.s)。使導電糊劑成為比其更低的黏度係困難的。又,接觸角的下限值為10(°)。接觸角為10(°)以下時,因為濕潤性變成太高,反而無法得到良好的轉印性。 Moreover, according to the above Table 1 and Figure 2, the lower limit of the preferred viscosity is 0.1 (Pa.s). It is difficult to make the conductive paste have a lower viscosity. In addition, the lower limit of the contact angle is 10 (°). When the contact angle is 10 (°) or less, the wettability becomes too high, and on the contrary, good transferability cannot be obtained.
又,黏度x及接觸角y係位於比圖2的(2)式更上面、亦即 滿足y>8.8x+12.4為佳。接觸角y越小,濕潤性變高而操作性變差,黏度x越低,能夠容許接觸角y至較小的值為止。 In addition, the viscosity x and the contact angle y are located above the formula (2) in Figure 2, that is It is better to satisfy y>8.8x+12.4. The smaller the contact angle y, the higher the wettability and the worse the handleability, the lower the viscosity x, the lower the contact angle y can be allowed.
以上,參照圖式而詳細地說明,但是本發明亦能夠進一步實施另外的態樣,在不脫離其主旨的範圍能夠施行各種變更。 The above has been described in detail with reference to the drawings, but the present invention can also be implemented in other aspects, and various changes can be made without departing from the spirit of the invention.
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