TW201729221A - Conductive paste and method for forming conductor membrane suitable for internal electrodes of a small-sized high-capacity MLCC - Google Patents

Conductive paste and method for forming conductor membrane suitable for internal electrodes of a small-sized high-capacity MLCC Download PDF

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TW201729221A
TW201729221A TW105131910A TW105131910A TW201729221A TW 201729221 A TW201729221 A TW 201729221A TW 105131910 A TW105131910 A TW 105131910A TW 105131910 A TW105131910 A TW 105131910A TW 201729221 A TW201729221 A TW 201729221A
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conductive paste
gravure printing
contact angle
viscosity
film
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TWI700709B (en
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Kazuhisa Ohashi
Juji Takada
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Noritake Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20Conductive material dispersed in non-conductive organic material
    • H01B1/22Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00Inks
    • C09D11/02Printing inks
    • C09D11/10Printing inks based on artificial resins
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00Inks
    • C09D11/52Electrically conductive inks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/005Electrodes
    • H01G4/008Selection of materials
    • H01G4/0085Fried electrodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/005Electrodes
    • H01G4/012Form of non-self-supporting electrodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/30Stacked capacitors

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Conductive Materials (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)

Abstract

To provide a conductive paste for gravure printing which can form a continuous thin conductor membrane suitable for internal electrodes of a small-sized high-capacity MLCC, and a method for forming the conductor membrane. In the conductive paste, viscosity x(Pa.s) and a contact angle y for a test surface having an arithmetic average roughness Ra of 0.010 ([mu]m) or less satisfy y < 17.6x+19.1 (where x ≤ 3.0 and y < 40); therefore, when gravure printing is performed on a ceramic green sheet using this conductive paste, the conductive paste is transferred promptly and uniformly from a gravure printing plate. Accordingly, the paste surface becomes smooth immediately after the transfer to make it easy for the film thickness to be thinned while maintaining continuity. Thus, it becomes possible to form a continuous conductor membrane having a thin film thickness suitable for internal electrodes of a small-sized high-capacity MLCC.

Description

導電糊及導體膜的形成方法Method for forming conductive paste and conductor film

發明領域 本發明係有關於一種能夠適合使用在凹版印刷(gravure printing)之導電糊、及利用凹版印刷法之導體膜的形成方法。FIELD OF THE INVENTION The present invention relates to a conductive paste which can be suitably used in gravure printing, and a method of forming a conductor film by gravure printing.

發明背景 例如,製造在圖1示意性地顯示剖面結構之積層陶瓷電容器(MLCC)10時,係將含有具有耐熱性的金屬作為導電性成分之導電糊,印刷塗布在用以構成其介電體層12之未煅燒的陶瓷生坯片(ceramic green sheet)表面,而且將其層積多數且壓黏之後,藉由施行煅燒處理,從生坯片生成介電體層12之同時,生成由導電糊構成內部電極之導體層14。又,在圖1,16係用以通電至該內部電極(導體層14)之外部電極。在此種內部電極的印刷形成,係能夠應用凹版印刷的一種之凹版印刷法(例如參照專利文獻1)。凹版印刷法係將導電糊填充至設置在製版之凹部,藉由將其加壓接觸被印刷面而將導電糊從該製版轉印之連續印刷法,其具有印刷速度較快的優點。BACKGROUND OF THE INVENTION For example, when a multilayer ceramic capacitor (MLCC) 10 having a cross-sectional structure is schematically shown in Fig. 1, a conductive paste containing a metal having heat resistance as a conductive component is printed and coated to form a dielectric layer thereof. 12 uncalcined ceramic green sheet surface, and after laminating a large number and pressure-bonding, by performing a calcination treatment, the dielectric layer 12 is formed from the green sheet, and a conductive paste is formed. Conductor layer 14 of internal electrodes. Further, in Fig. 1, 16 is an external electrode for energizing the internal electrode (conductor layer 14). In the printing formation of such an internal electrode, a gravure printing method in which gravure printing can be applied (for example, refer to Patent Document 1). The gravure printing method is a method in which a conductive paste is filled into a concave portion provided in a plate making, and a conductive paste is transferred from the plate-making by pressurizing it to contact the surface to be printed, which has an advantage of a printing speed being fast.

印刷用以形成MLCC的內部電極等之導電糊,以往通常係使用網版印刷法,但是網版印刷法係有起因版延伸之尺寸精確度低落所產生的問題。特別是在0603尺寸(外形尺寸0.6mm×0.3mm×0.3mm)、0402尺寸(外形尺寸0.4mm×0.2mm×0.2mm)等超小型MLCC,確保印刷膜的尺寸精確度係進一步變為困難。相對於此,使用前述的凹版印刷法時,因為不產生版延伸,所以適合於要求此種高精確度印刷之MLCC用途。 先前技術文獻 專利文獻A conductive paste for forming an internal electrode or the like of an MLCC has been conventionally used in a conventional screen printing method, but the screen printing method has a problem in that the dimensional accuracy of the plate extension is lowered. In particular, in an ultra-small MLCC such as 0603 size (outer size 0.6 mm × 0.3 mm × 0.3 mm) and 0402 size (outer size 0.4 mm × 0.2 mm × 0.2 mm), it is further difficult to ensure the dimensional accuracy of the printed film. On the other hand, when the above-described gravure printing method is used, since the plate extension is not generated, it is suitable for the MLCC application requiring such high-precision printing. Prior Technical Literature Patent Literature

專利文獻1:日本專利特開平10-199331號公報 專利文獻2:日本專利特開2003-249121號公報 專利文獻3:日本專利特開2005-126505號公報 專利文獻4:日本專利特開平06-142579號公報Patent Document 1: Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. Bulletin

發明概要 發明欲解決之課題 在如前述的0603尺寸、0402尺寸等的小型高容量MLCC,係有要求將內部電極的厚度尺寸設作1(μm)以下之情形。為了以此種較薄的膜厚來得到連續膜,必須形成表面平滑的印刷膜。在印刷速度較快速且印刷、乾燥步驟之生產作業時間(tact time)較短的凹版印刷法,因為從被印刷起至進入乾燥為止的時間變短,使印刷膜調平之時間亦變短。因此,為了得到具有優異的表面平滑性之印刷膜,較佳是藉由導電糊從製版均勻地被轉印,在剛轉印後立即形成表面平滑的印刷膜。Disclosure of the Invention Problems to be Solved by the Invention In the small-sized high-capacity MLCC such as the 0603 size and the 0402 size described above, it is required to set the thickness of the internal electrode to 1 (μm) or less. In order to obtain a continuous film with such a thin film thickness, it is necessary to form a printed film having a smooth surface. In the gravure printing method in which the printing speed is relatively fast and the tact time of the printing and drying steps is short, the time from the printing to the drying is shortened, and the time for leveling the printing film is also shortened. Therefore, in order to obtain a printing film having excellent surface smoothness, it is preferable to uniformly transfer from a plate by a conductive paste, and a film having a smooth surface immediately after the transfer is formed.

以往,已進行各種使用在凹版印刷法之改良導電糊的提案。例如將凹版印刷法應用在MLCC時,有提案揭示使用石油系溶劑或醇系溶劑,用以抑制因溶劑引起陶瓷生坯片膨潤和再溶解(薄片浸蝕)(例如參照前述專利文獻1)。又,在抑制薄片浸蝕時,有提案揭示考慮印刷塗膜的乾燥速度而使用1-對薄荷烯(1-p-menthene)、對薄荷烷(p-menthane)等的溶劑(例如參照專利文獻2)。In the past, various proposals have been made to improve the conductive paste in the gravure printing method. For example, when the gravure printing method is applied to the MLCC, it has been proposed to use a petroleum solvent or an alcohol solvent to suppress swelling and redissolution of the ceramic green sheet by the solvent (see, for example, Patent Document 1). In addition, when suppressing the etch of the sheet, it is proposed to use a solvent such as 1-p-menthene or p-menthane in consideration of the drying speed of the printing coating film (for example, refer to Patent Document 2). ).

又,在製造MLCC等的積層陶瓷零件時,將導電糊印刷在陶瓷生坯片後,將以陶瓷原料作為主成分之糊劑印刷在導體圖案的形成部以外的部位而使陶瓷生坯片的表面平坦化時,有提案揭示藉由使糊劑中除了含有乙基纖維素樹脂以外,亦含有數量平均分子量為300~5,000的萜烯樹脂,來形成具有優異的柔軟性之印刷膜(例如參照專利文獻3)。在凹版印刷,係使用低黏度且經抑制觸變性之導電糊,來使其容易地從印刷版被轉印至被印刷體,但是從此種導電糊所生成的印刷膜,在陶瓷糊劑印刷時,當印刷版接觸時容易產生導體圖案破損・脫落。因此希望藉由提高印刷膜的柔軟性,來抑制該破損、脫落。In the case of producing a laminated ceramic component such as MLCC, the conductive paste is printed on the ceramic green sheet, and the paste containing the ceramic raw material as a main component is printed on a portion other than the portion where the conductor pattern is formed, thereby making the ceramic green sheet. When the surface is flattened, it is proposed to form a printed film having excellent flexibility by using a terpene resin having a number average molecular weight of 300 to 5,000 in addition to the ethyl cellulose resin in the paste (for example, reference) Patent Document 3). In gravure printing, a low-viscosity and thixotropy-resistant conductive paste is used to easily transfer it from a printing plate to a to-be-printed body, but a printed film formed from such a conductive paste is printed in a ceramic paste. When the printing plate is in contact, the conductor pattern is likely to be damaged or peeled off. Therefore, it is desirable to suppress the damage and fall off by improving the flexibility of the printed film.

而且,以藉由製版側的變更來改善糊劑轉印性作為目的,有提案揭示一種使用對水之接觸角為50∘以上的被膜覆蓋槽溝內而成之製版(例如參照專利文獻4)。依照該製版,因為藉由使用全氟烷氧基樹脂等覆蓋槽溝,與水的接觸角增大為50∘以上,一般認為糊劑與製版的濕潤性降低且轉印性提升。In addition, it is proposed to improve the paste transfer property by the change of the plate-making side, and it is proposed to use a film having a contact angle of 50 Å or more in water to cover the groove (for example, see Patent Document 4). . According to the plate making, since the groove is covered with a perfluoroalkoxy resin or the like, the contact angle with water is increased to 50 Å or more, and it is considered that the wettability of the paste and the plate is lowered and the transfer property is improved.

如此,就抑制薄片浸蝕和提高印刷膜強度的觀點等而言,已有各種使用在凹版印刷法之導電糊的改良和製版的改良之各種提案。但是該等無法使用於以1(μm)以下之較薄的膜厚來形成連續膜。又,即便以成為同樣的接觸角之方式調製導電糊,導電性粉末的種類、粒徑等、媒液(Vehicle)等的組成有差異時,轉印性為不同而未必能夠得到良好的結果,亦再次試驗而清楚明白上述結果。As described above, various proposals for improvement of the conductive paste by the gravure printing method and improvement of the plate making have been made from the viewpoints of suppressing the etching of the sheet and improving the strength of the printed film. However, these cannot be used to form a continuous film with a thin film thickness of 1 (μm) or less. In addition, when the conductive paste is prepared so as to have the same contact angle, the type of the conductive powder, the particle diameter, and the like, and the composition of the vehicle or the like is different, the transfer property is different, and it is not always possible to obtain good results. The results were also clearly understood again.

本發明係以上述情況作為背景而進行,其目的係提供一種能夠形成適合於小型高容量MLCC的內部電極之連續且較薄的導體膜之凹版印刷用導電糊、及該導體膜的形成方法。The present invention has been made in view of the above circumstances, and an object thereof is to provide a conductive paste for gravure printing capable of forming a continuous and thin conductor film suitable for an internal electrode of a small-sized high-capacity MLCC, and a method of forming the conductor film.

為了達成如此的目的,作為第1發明的要旨,係一種含有導電性粉末、黏著劑、及有機溶劑之凹版印刷用導電糊,其在25(℃)且剪切速度40(1/s)之黏度設作x(Pa・s)、算術平均粗糙度Ra為0.010(μm)以下之水平的試驗面在25(℃)滴下10(μL)時的接觸角設作y(∘),此時x、y滿足下式(1)。 y<17.6x+19.1  (但是,x≦3.0、y<40)・・・(1)In order to achieve such an object, the conductive paste for gravure printing containing a conductive powder, an adhesive, and an organic solvent is at 25 (° C.) and a shear rate of 40 (1/s). The contact angle at which the viscosity is set to x (Pa·s) and the arithmetic mean roughness Ra is 0.010 (μm) or less is set to y (∘) at a drop rate of 10 (μL) at 25 (° C.), at this time, x y satisfies the following formula (1). y<17.6x+19.1 (however, x≦3.0, y<40)・(・)

又,為了達成前述目的,作為第2發明的要旨,係一種包含下列步驟之導體膜的形成方法:調製含有導電性粉末、黏著劑、及有機溶劑之導電糊之步驟;將該導電糊填充在凹版印刷製版的凹處並轉印至被印刷面之印刷步驟;及藉由對所形成的印刷膜施行煅燒處理而在該被印刷面形成導體膜之煅燒步驟;其中,前述調製導電糊之步驟,係在滿足下述情況下進行前述導電糊之調製:在25(℃)且剪切速度40(1/s)之黏度x(Pa・s)、使用與前述凹版印刷製版的最外周面相同材料且以成為相同表面狀態的方式水平配置的試驗面時之接觸角y(∘),所述x、y滿足前述(1)式。 發明效果In order to achieve the above object, a second aspect of the invention provides a method for forming a conductor film comprising the steps of: preparing a conductive paste containing a conductive powder, an adhesive, and an organic solvent; and filling the conductive paste with a step of printing a concave portion of the gravure printing plate and transferring it to the surface to be printed; and a calcining step of forming a conductor film on the printed surface by performing a calcination treatment on the formed printing film; wherein the step of preparing the conductive paste The above-mentioned conductive paste is prepared by the following: the viscosity x (Pa·s) at 25 (° C.) and the shear rate of 40 (1/s) is the same as the outermost peripheral surface of the gravure printing plate. The contact angle y (∘) at the time of the test surface in which the material is horizontally disposed in the same surface state, and x and y satisfy the above formula (1). Effect of the invention

依照前述第1發明,因為凹版印刷用導電糊其黏度x(Pa・s)、相對於算術平均粗糙度Ra為0.010(μm)以下的試驗面之接觸角y(∘)係滿足前述(1)式,所以使用該導電糊而在被印刷面施行凹版印刷時,導電糊係迅速地且均勻地從凹版印刷製版被轉印至該被印刷面。藉此,因為從剛轉印後糊劑表面就成為平滑面,因而容易在保持連續性的狀態下將膜厚薄化,所以使用該導電糊時,能夠形成適合於小型高容量MLCC的內部電極之連續且較薄的膜厚之導體膜。According to the first aspect of the invention, the contact angle y (∘) of the test surface with respect to the arithmetic mean roughness Ra of 0.010 (μm) or less is satisfied by the above-mentioned (1) because the viscosity of the conductive paste for gravure printing is (Pa·s). Therefore, when the conductive paste is used to perform gravure printing on the surface to be printed, the conductive paste is quickly and uniformly transferred from the gravure plate to the to-be-printed surface. In this way, since the surface of the paste immediately after the transfer becomes a smooth surface, it is easy to reduce the film thickness while maintaining the continuity. Therefore, when the conductive paste is used, an internal electrode suitable for a small-sized high-capacity MLCC can be formed. A continuous and thin film thickness of the conductor film.

又,依照前述第2發明,使用凹版印刷法形成導體膜時,在調製導電糊之步驟,係在滿足下述情況下進行前述導電糊之調製:在40(1/s)之黏度x(Pa・s)、使用與凹版印刷製版的最外周面相同材料且以成為相同表面狀態的方式水平配置的試驗面滴下10(μL)時之接觸角y(∘),所述x、y滿足前述(1)式。因此,在印刷步驟,使用該導電糊而施行凹版印刷時,導電糊會迅速地且均勻地被轉印至被印刷面。藉此,因為從剛轉印後糊劑表面就成為平滑面,因而容易在保持連續性的狀態下將膜厚薄化,所以能夠形成適合於小型高容量MLCC的內部電極之連續且較薄的膜厚之導體膜。又,在本案,「製版的最外周面」係意指在製版形成印刷圖案前在圓筒面上之面。Further, according to the second invention, when the conductor film is formed by the gravure printing method, the step of preparing the conductive paste is performed by adjusting the conductive paste under the following conditions: viscosity at 40 (1/s) x (Pa) s), using the same material as the outermost peripheral surface of the gravure printing plate and dropping the contact angle y (∘) at 10 (μL) on the test surface horizontally arranged to have the same surface state, the x, y satisfying the above ( 1). Therefore, in the printing step, when the conductive paste is used for gravure printing, the conductive paste is quickly and uniformly transferred to the surface to be printed. As a result, since the surface of the paste becomes a smooth surface immediately after the transfer, it is easy to reduce the film thickness while maintaining the continuity. Therefore, it is possible to form a continuous and thin film suitable for the internal electrodes of the small-sized high-capacity MLCC. Thick conductor film. Further, in the present case, "the outermost surface of the plate making" means the surface on the cylindrical surface before the printing pattern is formed.

順便提一下,以往,以從凹版印刷製版被均勻地轉印至被印刷面作為目的,已嘗試導電糊的有機組成之最佳化、流變學的最佳化等,但是如前述,該等嘗試並未獲得充分的結果。相對於此,本申請發明係發現不僅是製版與導電糊的濕潤性亦即接觸角的大小,而且導電糊的黏度亦與轉印性有關聯。藉由黏度與接觸角係滿足前述(1)式的方式進行調製,亦即,藉由在與黏度的關係將接觸角設為一定値以下,導電糊能夠從凹版印刷製版均勻地被轉印至被印刷面且從剛轉印後膜表面變為平滑。By the way, in order to uniformly transfer the gravure printing plate to the surface to be printed, the organic composition of the conductive paste has been optimized, and the rheology has been optimized, but as described above, The attempt did not yield sufficient results. On the other hand, the invention of the present application found that not only the wettability of the plate-making and the conductive paste, that is, the contact angle, but also the viscosity of the conductive paste is related to the transfer property. The viscosity is adjusted by the contact angle system satisfying the above formula (1), that is, by setting the contact angle to a certain value or less in relation to the viscosity, the conductive paste can be uniformly transferred from the gravure printing plate to The surface to be printed is smoothed from the surface of the film immediately after transfer.

又,在第1發明,試驗面的表面粗糙度係算術平均粗糙度Ra必須為0.010(μm)以下。因為凹版印刷製版的最外周面的表面粗糙度係通常Ra為0.010(μm)以下,所以使用上述試驗面之評價,係能夠視為使用通常的凹版印刷製版的最外周面之評價。Further, in the first invention, the surface roughness of the test surface is required to be equal to or less than 0.015 (μm) in arithmetic mean roughness Ra. Since the surface roughness of the outermost peripheral surface of the gravure printing plate is usually Ra of 0.010 (μm) or less, evaluation using the above test surface can be considered as evaluation using the outermost peripheral surface of a usual gravure printing plate.

而且,在本案,黏度x(Pa・s)係使用在25(℃)且剪切速度40(1/s)之靜黏度。因為該條件係考慮凹版印刷進行時的室溫、及在凹版印刷時導電糊被轉印至被印刷面時作用在該導電糊的應力等而決定,所以藉由使用該値,導電糊的黏度及接觸角與轉印性之間的相關性係能夠穩定地得到。又,黏度測定係能夠使用市售的黏度計而進行。Further, in the present case, the viscosity x (Pa·s) is a static viscosity at 25 (° C.) and a shear rate of 40 (1/s). This condition is determined by considering the room temperature at the time of gravure printing and the stress acting on the conductive paste when the conductive paste is transferred to the surface to be printed during gravure printing. Therefore, the viscosity of the conductive paste is used by using the crucible. And the correlation between the contact angle and the transfer property can be stably obtained. Further, the viscosity measurement can be carried out using a commercially available viscometer.

又,在本案,接觸角y(∘)係測定於25(℃)滴下10(μL)至水平面之液滴所測得的値。因為該條件係考慮凹版印刷進行時的室溫、及MLCC的內部電極形成時被轉印的導電糊劑之量等而決定,所以藉由使用該値,導電糊的黏度及接觸角與轉印性之間的相關性係能夠穩定地得到。又,導電糊的滴下係例如能夠使用微吸量管而進行,接觸角的測定係能夠使用市售的接觸角計而使用。Further, in the present case, the contact angle y (∘) is measured by measuring the enthalpy measured by dropping 10 (μL) to the liquid level at 25 (°C). Since this condition is determined by considering the room temperature at the time of gravure printing and the amount of the conductive paste transferred at the time of formation of the internal electrode of the MLCC, the viscosity and contact angle of the conductive paste and the transfer are used by using the crucible. The correlation between sexes can be obtained stably. Further, the dropping of the conductive paste can be performed, for example, using a micropipette, and the contact angle can be measured using a commercially available contact angle meter.

而且,前述(1)式係在x≦3.0、y<40的範圍成立。大於該等範圍之黏度及接觸角的範圍時,即便滿足y<17.6x+19.1亦無法得到良好的轉印性。Further, the above formula (1) is established in the range of x≦3.0 and y<40. When it is larger than the range of the viscosity and the contact angle of the above range, good transferability cannot be obtained even if y<17.6x+19.1 is satisfied.

依照本申請發明,藉由使用如上述規定的方法來測定黏度及接觸角且以該値為滿足前述(1)式的方式來調製導電糊,導電糊如前述能夠得到從凹版印刷製版被均勻地轉印至被印刷面且從剛轉印後膜表面成為平滑之效果。亦即,只有具有接觸角為一定値以上之濕潤性時,無法經常得到良好的轉印性,黏度越小,必須越減小接觸角、亦即必須容易濕潤。According to the invention of the present application, the conductive paste is prepared by using the method specified above, and the conductive paste is prepared in such a manner that the above formula (1) is satisfied, and the conductive paste can be uniformly obtained from the gravure printing plate as described above. Transferred to the surface to be printed and smoothed from the surface of the film immediately after transfer. That is, when the wettability of the contact angle is not more than 値, it is not always possible to obtain good transferability, and the smaller the viscosity, the smaller the contact angle must be, that is, it must be easily wetted.

又,針對接觸角與轉印性之關係,在前述專利文獻4,係揭示接觸角較大者轉印性良好且必須為50∘以上,但是太大時,有糊劑不容易進入槽溝之情形。但是,依照本發明者等的研究結果,為了得到良好的轉印性,接觸角係以較小者為佳,而且如前述(1)式所顯示,在導電糊與製版之間測定時,必須成為40∘以下。雖然上述專利文獻4的記載,以「50∘以上且不可太大」為佳,但是依照本發明者等,係得到與其為相反的結果。又,雖然在上述專利文獻4,係藉由對水之値來限定限接觸角,但是這是藉由對水之接觸角之値來間接地限定槽溝的表面狀態,而未考慮實際上係因所使用的糊劑之物性而適當的接觸角為不同。Further, in the relationship between the contact angle and the transfer property, Patent Document 4 discloses that the transfer angle is large and the transfer property is good and must be 50 Å or more. However, when it is too large, the paste does not easily enter the groove. situation. However, according to the results of studies by the inventors of the present invention, in order to obtain good transferability, the contact angle is preferably smaller, and as shown in the above formula (1), when measured between the conductive paste and the plate making, it is necessary to measure Become 40 ∘ or less. In the above-described Patent Document 4, it is preferable to use "50 Å or more and not too large". However, according to the present inventors, the result is reversed. Further, although in the above Patent Document 4, the contact angle is limited by the enthalpy of water, this is indirectly restricting the surface state of the groove by the contact angle with water, without considering the actual system. The appropriate contact angle differs depending on the physical properties of the paste used.

在此,較佳是在前述第1發明之前述試驗面、或在前述第2發明之前述凹版印刷製版的最外周面及前述試驗面之任一者均是鍍經施行Cr或鍍Ni者。為了提高與導電糊的濕潤性,凹版印刷製版係以經施行鍍Cr或鍍Ni者為佳。因而,在試驗面亦以仿照其而使用經施行鍍Cr或鍍Ni者為佳。又,為了提高濕潤性而減少接觸角,係以施行鍍敷為佳,試驗面的鍍敷種類,係與凹版印刷製版的鍍敷種類一致為佳。但是,因為即便是鍍敷種類有差異亦能夠得到同樣的接觸角,所以不必使的鍍敷種類一致。Here, it is preferable that either the test surface of the first invention or the outermost peripheral surface of the gravure printing plate of the second invention and the test surface are plated with Cr or Ni plating. In order to improve the wettability with the conductive paste, it is preferred that the gravure printing plate is subjected to Cr plating or Ni plating. Therefore, it is preferable to use Cr or Ni plating on the test surface in the same manner. Moreover, in order to improve the wettability and reduce the contact angle, it is preferable to perform plating, and the type of plating of the test surface is preferably the same as the type of plating of the gravure printing plate. However, since the same contact angle can be obtained even if there is a difference in the type of plating, it is not necessary to match the types of plating.

又,較佳是在前述(1)式,黏度x(Pa・s)的範圍為0.1≦x≦3.0。如前述(1)式所顯示,因為黏度越低,被容許的接觸角y的上限値越低,所以調製能夠滿足(1)式之導電糊係變為困難。因此,黏度係以設作0.1(Pa・s)以上為佳。Further, in the above formula (1), the viscosity x (Pa·s) is preferably in the range of 0.1 ≦ x ≦ 3.0. As shown in the above formula (1), the lower the viscosity, the lower the upper limit 値 of the allowable contact angle y, so that it becomes difficult to prepare the conductive paste which satisfies the formula (1). Therefore, the viscosity is preferably 0.1 (Pa·s) or more.

又,較佳是在前述(1)式,接觸角y(∘)的範圍為10<y<40。接觸角y為10∘以下時,因為濕潤性變成太高,反而無法得到良好的轉印性。Further, in the above formula (1), the range of the contact angle y (∘) is preferably 10 < y < 40. When the contact angle y is 10 Å or less, the wettability becomes too high, and on the contrary, good transferability cannot be obtained.

而且,較佳是黏度x及接觸角y為滿足y>8.8x+12.4・・・(2)者。雖然接觸角y越小,濕潤性越高而操作性變差,但是因為黏度x越低,能夠容許y至越小的值為止,所以較佳是滿足上述式(2)。Further, it is preferable that the viscosity x and the contact angle y satisfy y>8.8x+12.4 (2). The smaller the contact angle y, the higher the wettability and the lower the workability. However, since the viscosity x is lower, the value of y can be allowed to be smaller, so that the above formula (2) is preferably satisfied.

又,較佳是前述導電糊係用以印刷塗布在陶瓷生坯片來形成導體膜而使用者。本發明的導電糊,係不被用途限定,但是能夠適合使用在將導體膜形成在陶瓷製的絕緣體上之情況。特別是在生坯片上進行印刷塗布時,在施行煅燒處理而生成絕緣體時,亦可同時藉由煅燒而生成導體膜,在製造成本面具有優點。Further, it is preferable that the conductive paste is used for printing and coating a ceramic green sheet to form a conductor film. The conductive paste of the present invention is not limited by use, but can be suitably used in the case where a conductor film is formed on a ceramic insulator. In particular, when printing is applied to a green sheet, when a firing treatment is performed to form an insulator, a conductor film can be simultaneously formed by firing, which is advantageous in terms of production cost.

而且,較佳是前述導電糊係用以形成MLCC的內部電極而使用者。如前述,使用本發明的導電糊時,因為能夠容易地在保持連續性的狀態下使膜厚薄化,所以適合於小型高容量MLCC的內部電極。Further, it is preferable that the conductive paste is used to form an internal electrode of the MLCC. As described above, when the conductive paste of the present invention is used, since the film thickness can be easily reduced while maintaining continuity, it is suitable for an internal electrode of a small-sized high-capacity MLCC.

又,較佳是前述導電性粉末為鎳粉末。例如在MLCC的內部電極用途,藉由將印刷有導電糊之陶瓷生坯片進行層積且施行煅燒處理,因為在從陶瓷生坯片生成介電體層之同時生成內部電極,所以導電性粉末係被要求具有耐熱性。因此,作為本發明的導電糊之導電性粉末,係以具有耐熱性之金屬、例如Pt、Pd、Ag-Pd、Ag、Ni、Cu等為佳,但是就製造成本面而言,係以廉價的卑金屬材料為佳,從耐熱性、導電性、價格面而言,特別是以鎳為佳。導電性粉末的平均粒徑,係能夠在可得到導電糊所需要的特性之範圍適當地決定,例如1.0(μm)以下,以0.01~0.50(μm)的範圍為佳,以0.05~0.30(μm)的範圍為更佳。Further, it is preferable that the conductive powder is nickel powder. For example, in the internal electrode application of the MLCC, a ceramic green sheet printed with a conductive paste is laminated and subjected to a calcination treatment, since an internal electrode is formed while a dielectric layer is formed from the ceramic green sheet, the conductive powder is It is required to have heat resistance. Therefore, the conductive powder of the conductive paste of the present invention is preferably a metal having heat resistance such as Pt, Pd, Ag-Pd, Ag, Ni, Cu, etc., but is inexpensive in terms of manufacturing cost. The base metal material is preferred, and in terms of heat resistance, electrical conductivity, and price, nickel is particularly preferred. The average particle diameter of the conductive powder can be appropriately determined in the range of characteristics required for obtaining the conductive paste, and is, for example, 1.0 (μm) or less, preferably 0.01 to 0.50 (μm), and 0.05 to 0.30 (μm). The range is better.

而且,較佳是前述黏著劑為聚乙烯基丁縮醛、聚乙烯醇、丙烯酸系樹脂、環氧系樹脂、酚系樹脂、醇酸系樹脂、纖維素系高分子、松香系樹脂等。作為本發明的導電糊之黏著劑,能夠適當地選自在能夠實現所需要的黏度和接觸角的範圍通常被使用者,但是就塗膜形成能力(亦即對基板之附著性)和在煅燒時之分解性而言,係以上述物為佳。Further, the adhesive is preferably polyvinyl butyral, polyvinyl alcohol, acrylic resin, epoxy resin, phenol resin, alkyd resin, cellulose polymer, rosin resin or the like. The adhesive for the conductive paste of the present invention can be suitably selected from those which are usually in a range capable of achieving a desired viscosity and contact angle, but in terms of coating film forming ability (i.e., adhesion to a substrate) and at the time of calcination In terms of decomposability, it is preferred to use the above substances.

又,較佳是前述有機溶劑,係只要能夠適合於將導電性粉末及黏著劑樹脂成分溶解或分散,就沒有特別限制。作為一個例子,係可舉出萜品醇(terpineol)等的醇類系溶劑、異莰基乙酸酯等的萜烯系溶劑、乙二醇等的二醇系溶劑、二乙二醇一丁醚(丁基卡必醇)等的二醇醚系溶劑、酯系溶劑、甲苯、二甲苯等的烴系溶劑、其它礦油精等具有高沸點之有機溶劑。因為該等有機溶劑不容易將陶瓷生坯片中的丁縮醛系樹脂和丙烯酸系樹脂的黏著劑溶解而不容易產生所謂薄片浸蝕,乃是較佳。Moreover, it is preferable that the organic solvent is not particularly limited as long as it can be suitably dissolved or dispersed in the conductive powder and the adhesive resin component. Examples of the solvent include an alcohol solvent such as terpineol, a terpene solvent such as isodecyl acetate, a glycol solvent such as ethylene glycol, and diethylene glycol monobutylate. A glycol ether solvent such as ether (butyl carbitol), an ester solvent, a hydrocarbon solvent such as toluene or xylene, or an organic solvent having a high boiling point such as other mineral spirits. Since these organic solvents do not easily dissolve the butyral resin and the acrylic resin adhesive in the ceramic green sheet, it is preferable that so-called sheet etching is likely to occur.

而且,較佳是前述導電糊係如通常所進行地,含有應用其之陶瓷生坯片的構成成分(共有材料)。例如MLCC的介電體層係由鈦酸鋇所構成時,係以含有鈦酸鋇粉末為佳。因為本發明的導電糊,係能夠容易地形成較薄的內部電極,係以共有材料的平均粒徑係以較小為佳,例如0.5(μm)以下,以0.005~0.2(μm)的範圍為佳,以0.01~0.1(μm)的範圍為更佳。Further, it is preferable that the conductive paste contains a constituent component (common material) of a ceramic green sheet to which the conductive paste is applied as usual. For example, when the dielectric layer of MLCC is composed of barium titanate, it is preferred to contain barium titanate powder. Since the conductive paste of the present invention can easily form a thin internal electrode, the average particle diameter of the shared material is preferably small, for example, 0.5 (μm) or less, and 0.005 to 0.2 (μm) is Preferably, the range of 0.01 to 0.1 (μm) is more preferable.

又,前述導電糊的成分比率係沒有特別限定,能夠以滿足前述(1)式和(2)式的方式而適當地決定,例如以質量比計,係以含有30~60(%)的前述導電性粉末、1~5(%)的前述黏著劑、35~65(%)的前述有機溶劑、以及0~20(%)的共有材料之組成為佳。又,含有共有材料時,係以1~20(%)的範圍為佳。In addition, the component ratio of the conductive paste is not particularly limited, and can be appropriately determined so as to satisfy the above formulas (1) and (2). For example, the mass ratio is 30 to 60% by weight. The composition of the conductive powder, 1 to 5 (%) of the above-mentioned adhesive, 35 to 65 (%) of the organic solvent, and 0 to 20 (%) of the common material is preferable. Moreover, when a shared material is contained, it is preferable that it is the range of 1-20 (%).

較佳實施例之詳細說明 以下,詳細地說明本發明的一實施例。又,在以下所說明的實施例,係只要未特別地預先告知,就能夠適當地使用以往通常被採用之結構。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment of the present invention will be described in detail. Further, in the embodiments described below, it is possible to appropriately use a configuration that has been conventionally employed as long as it is not specifically notified in advance.

本實施例的導電糊係製造如前述圖1,在製造MLCC10時,係為了利用凹版印刷法來形成當作內部電極之導體層14而使用。在本實施例,介電體層12的一層之厚度尺寸,係例如10(μm)以下,例如0.1~3(μm)的範圍內,例如1(μm)左右,導體層14的一層之厚度尺寸,係例如10(μm)以下,例如0.1~3(μm)的範圍內,例如0.5(μm)左右。The conductive paste of the present embodiment was produced as shown in Fig. 1 described above in order to form the conductor layer 14 as an internal electrode by the gravure printing method when the MLCC 10 was produced. In the present embodiment, the thickness dimension of one layer of the dielectric layer 12 is, for example, 10 (μm) or less, for example, 0.1 to 3 (μm), for example, about 1 (μm), and the thickness of one layer of the conductor layer 14 is For example, it is 10 (μm) or less, for example, in the range of 0.1 to 3 (μm), for example, about 0.5 (μm).

上述的導體層14係例如由鎳所形成者,上述的介電體層12係例如由鈦酸鋇所形成者。在製造此種MLCC10時,係依照預先規定的調配方法將導電性粉末、陶瓷粉末、黏著劑、及有機溶劑混合而調製導電糊劑,藉由凹版印刷而印刷塗布在另外準備之用以構成介電體層12之陶瓷生坯片的一面。將塗布有導體糊之陶瓷生坯片層積壓黏後,藉由施行煅燒處理,在生成由陶瓷生坯片所生成的介電體層12之同時,由導體糊劑生成導體層14,隨後,藉由使用浸漬等方法來形成外部電極16,而得到前述圖1所顯示之MLCC10。The conductor layer 14 described above is formed, for example, of nickel, and the dielectric layer 12 described above is formed, for example, of barium titanate. When the MLCC 10 is produced, the conductive powder, the ceramic powder, the adhesive, and the organic solvent are mixed in accordance with a predetermined mixing method to prepare a conductive paste, which is printed and coated by gravure printing to form a separate medium. One side of the ceramic green sheet of the electric layer 12. After laminating and bonding the ceramic green sheets coated with the conductor paste, the dielectric layer 12 formed of the ceramic green sheets is formed by the calcination treatment, and the conductor layer 14 is formed from the conductor paste, and then borrowed. The external electrode 16 is formed by a method such as immersion to obtain the MLCC 10 shown in Fig. 1 described above.

上述的導電性粉末,係例如平均粒徑為1(μm)以下,例如0.13~0.18(μm)的範圍內之鎳粉末,例如以30~60(wt%)左右的比率被混合在導電糊中。又,上述的陶瓷粉末,係例如平均粒徑為0.1(μm)以下,例如10~20(nm)的範圍內的鈦酸鋇粉末、亦即構成介電體層12之鈦酸鋇的共有材料,例如以鎳比為10~15(wt%)左右的比率被混合在導電糊中。又,上述的黏著劑係例如乙基纖維素、聚乙烯基丁縮醛,上述的有機溶劑係以二氫萜品醇、乙酸異莰酯、丙酸薄荷酯(menthanol propionate)作為主溶劑。該等係各自使用1~5(%)、30~65(%)左右的比率。The conductive powder is, for example, a nickel powder having an average particle diameter of 1 (μm) or less, for example, 0.13 to 0.18 (μm), for example, mixed in a conductive paste at a ratio of about 30 to 60 (wt%). . Further, the ceramic powder is, for example, a barium titanate powder having an average particle diameter of 0.1 (μm) or less, for example, 10 to 20 (nm), that is, a common material of barium titanate constituting the dielectric layer 12. For example, it is mixed in a conductive paste at a ratio of a nickel ratio of about 10 to 15 (wt%). Further, the above-mentioned adhesive is, for example, ethyl cellulose or polyvinyl butyral, and the above organic solvent is dihydroterpineol, isodecyl acetate or menthone propionate as a main solvent. Each of these systems uses a ratio of about 1 to 5 (%) and 30 to 65 (%).

在本實施例,上述導電糊的組成係以其黏度、及滴下至使用與凹版印刷版的最外周面相同材料且經調製成為相同表面狀態的試驗面時之接觸角係為滿足前述(1)式(再揭示)的方式調製。黏度係使用例如流變計(HAAKE製Rheostress 6000)所測得的値且使用在25(℃)、剪切速度40(1/s)的條件下1分鐘後的靜黏度。又,接觸角係在25(℃)使用微吸量管滴下10(μL)至被水平地配置之試驗面,且例如使用FACE接觸角計(共和界面化學股份公司製CA-DT)所測定的接觸角。接觸角係例如測定5次之平均値。 y<17.6x+19.1  (但是,x≦3.0、y<40)・・・(1)In the present embodiment, the composition of the conductive paste is such that the contact angle thereof is such that the viscosity thereof and the test surface which is dropped to the same surface as the outermost peripheral surface of the intaglio printing plate and are prepared to have the same surface state satisfy the above (1). Mode (re-disclosed) mode modulation. The viscosity is a static viscosity measured by using, for example, a rheometer (Rheostress 6000 manufactured by HAAKE) and using a condition of 25 (° C.) and a shear rate of 40 (1/s) for 1 minute. Further, the contact angle was dropped by 10 (μL) to the horizontally arranged test surface at 25 (° C.) using a micropipette, and was measured, for example, using a FACE contact angle meter (CA-DT manufactured by Kyowa Interface Chemical Co., Ltd.). Contact angle. The contact angle is, for example, an average of five measurements. y<17.6x+19.1 (however, x≦3.0, y<40)・(・)

又,上述的試驗面係例如凹版印刷製版為鍍Cr版之情況,例如Cr板,其表面係被精加工成為算術平均粗糙度Ra為0.010(μm)以下之平滑性非常高的狀態。又,使用與製版同樣地經施行鍍Cr之板來代替Cr板亦無妨。在本實施例,係使用例如從凹版印刷製版之未形成圖案的部分將其表面材剝下者。試驗用平面基板的大小係例如5(cm)×3(cm)。In addition, when the test surface is, for example, a gravure printing plate is a Cr plated plate, for example, a Cr plate has a surface which is finished to have a state in which the arithmetic mean roughness Ra is 0.010 (μm) or less and the smoothness is extremely high. Further, it is also possible to use a Cr-plated plate instead of the Cr plate in the same manner as the plate making. In the present embodiment, the surface material is peeled off, for example, from the unpatterned portion of the gravure printing plate. The size of the test planar substrate is, for example, 5 (cm) × 3 (cm).

將如此進行而調製的導電糊使用凹版印刷法而印刷塗布在陶瓷生坯片之結果,所形成的印刷膜之乾燥膜厚為0.5(μm)左右且具有表面粗糙度Ra為0.020(μm)以下的平滑表面,藉由將其煅燒而得到平滑的連續膜。藉由得到該水準的平滑性,而能夠更有助於提升電容器特性、及可靠性。The conductive paste prepared in this manner is printed and applied on the ceramic green sheet by gravure printing, and the formed film has a dry film thickness of about 0.5 (μm) and a surface roughness Ra of 0.020 (μm) or less. The smooth surface is obtained by calcining it to obtain a smooth continuous film. By obtaining the smoothness of the level, it is possible to further improve the capacitor characteristics and reliability.

下述的表1,係在上述導體層14的印刷塗布步驟,將導電糊劑組成進行各種變更且以黏度與接觸角的各種組合來進行評價印刷性之結果彙總而成者。在表1,「Ni粒徑」、「BT粒徑」係各自為鎳粉末的平均粒徑、鈦酸鋇粉末的平均粒徑。又,「BT量」係鈦酸鋇粉末對Ni之質量比。又,「MC」係鎳粉末對糊劑全體之質量比。「40(1/s)黏度」係如前述使用流變計所測定的靜黏度。又,「與Cr板的接觸角」、「鍍Cr製版印刷體Ra」係各自使用鍍Cr製版而施行凹版印刷時之評價數據,前者係導電糊與Cr板的接觸角之測定値,後者係使用該導電糊且印刷塗布在鍍Cr製版而成的印刷膜之乾燥後的表面粗糙度。表面粗糙度係使用干渉顯微鏡(Nikon LV150 ECLIPSE)且在倍率10倍、測定範圍50(μm)×1000(μm)、測定數12所測得的算術平均粗糙度Ra。又,「與Ni板的接觸角」、「鍍Ni製版印刷體Ra」係各自使用鍍Ni製版而施行凹版印刷時之評價數據。In the printing and coating step of the conductor layer 14 described above, the conductive paste composition was variously changed, and the results of evaluating the printability by various combinations of the viscosity and the contact angle were summarized. In Table 1, "Ni particle diameter" and "BT particle diameter" are each an average particle diameter of a nickel powder and an average particle diameter of a barium titanate powder. Further, the "BT amount" is a mass ratio of barium titanate powder to Ni. Further, "MC" is a mass ratio of nickel powder to the entire paste. "40 (1/s) viscosity" is the static viscosity measured by the rheometer described above. In addition, the "contact angle with the Cr plate" and the "Cr-plated plate-printing body Ra" are evaluation data when gravure printing is performed using a Cr-plated plate. The former is a measurement of the contact angle between the conductive paste and the Cr plate, and the latter is The surface roughness of the printed film formed by plating with Cr was printed and applied using the conductive paste. The surface roughness was a dry average microscope (Nikon LV150 ECLIPSE) and the arithmetic mean roughness Ra measured at a magnification of 10 times, a measurement range of 50 (μm) × 1000 (μm), and a measurement number of 12. In addition, the "contact angle with the Ni plate" and the "Ni plated printing plate Ra" are evaluation data when gravure printing is performed using a Ni plate.

[表1] [Table 1]

在上述表1,印刷體的表面粗糙度Ra為0.020(μm)以下者為印刷性良好者,亦即實施例。在圖2,係顯示上述評價結果之圖表。在圖2,「◆」為實施例,「口」為比較例。實施例1~11係位於比圖2內所圖示的(1)式更下側,為滿足其之導電糊。比較例1~8係位於比(1)式更上側或比黏度3.0(Pa・s)更右側,為不滿足其之本發明的範圍外之比較例的導電糊。In the above Table 1, the surface roughness Ra of the printed material is not more than 0.020 (μm), which is a good printability, that is, an embodiment. In Fig. 2, a graph showing the above evaluation results is shown. In Fig. 2, "◆" is an example, and "mouth" is a comparative example. Examples 1 to 11 are located on the lower side than the formula (1) shown in Fig. 2, and are conductive pastes satisfying the same. In Comparative Examples 1 to 8, the conductive paste was placed on the upper side of the formula (1) or on the right side of the viscosity of 3.0 (Pa·s), and was a conductive paste of a comparative example which did not satisfy the range of the present invention.

如上述評價結果所顯示,在黏度為0.1~3.0(Pa・s)、接觸角為14~39(∘),藉由滿足前述(1)式黏度及接觸角,能夠得到印刷體的表面粗糙度為0.003~0.016(μm)之非常良好的結果。因此,使用此種導電糊而形成MLCC10的內部電極(導體層14)時,能夠從凹版印刷製版而在被印刷面得到良好的轉印性,該結果,因為能夠容易地得到較薄且表面平滑的連續膜,所以能夠以較高的製造產率得到小型、高容量的MLCC10。又,實施例11係對鍍Ni製版亦進行評價,能夠得到與鍍Cr製版時同程度的良好結果。以滿足(1)式的方式調製導電糊時,鍍Cr製版、鍍Ni製版的任一者均同樣地能夠得到較薄且表面平滑的連續膜。As shown in the above evaluation results, the surface roughness of the printed body can be obtained by satisfying the viscosity and contact angle of the above formula (1) at a viscosity of 0.1 to 3.0 (Pa·s) and a contact angle of 14 to 39 (∘). Very good results from 0.003 to 0.016 (μm). Therefore, when the internal electrode (conductor layer 14) of the MLCC 10 is formed by using such a conductive paste, it is possible to obtain good transferability from the gravure printing plate to the printed surface, and as a result, it is possible to easily obtain a thinner and smooth surface. The continuous film allows a small, high-capacity MLCC10 to be obtained at a high manufacturing yield. Further, in Example 11, the Ni-plated plate was also evaluated, and good results were obtained in the same degree as in the case of Cr-plating. When the conductive paste is prepared in such a manner as to satisfy the formula (1), any of the Cr-plated plate and the Ni-plated plate can be similarly obtained as a continuous film having a thin surface and a smooth surface.

相對於此,比較例1~6係即便在黏度為0.2~3.0(Pa・s)的範圍,由於接觸角較大而為22~72(∘),因為成為不滿足前述(1)式之黏度與接觸角的組合,所以從凹版印刷製版的轉印性較差且印刷體的表面粗糙度Ra成為0.021~0.194(μm)之較大値。該表面粗糙度Ra的大小,係表示印刷膜表面凹凸的大小,因為導體層14的厚度尺寸係非常薄而為0.5(μm)左右,所以如上述的較大的凹凸,係意味著印刷膜無法得到連續性。亦即,比較例的導電糊係難以得到較薄且表面平滑的連續膜。On the other hand, in Comparative Examples 1 to 6, even in the range of 0.2 to 3.0 (Pa·s), the contact angle is 22 to 72 (∘), because the viscosity of the above formula (1) is not satisfied. Since it is combined with the contact angle, the transfer property from the gravure printing plate is inferior and the surface roughness Ra of the printed body is larger than 0.021 to 0.194 (μm). The size of the surface roughness Ra indicates the size of the unevenness on the surface of the printed film. Since the thickness of the conductor layer 14 is very thin and is about 0.5 (μm), the large unevenness as described above means that the printed film cannot be printed. Get continuity. That is, it is difficult to obtain a continuous film having a thin surface and a smooth surface in the conductive paste of the comparative example.

又,比較例7、8之黏度係非常高而為5.3~6.9(Pa・s),接觸角為51~61(∘)且位於前述(1)式的下側。但是,使用該等而進行凹版印刷時,印刷膜的表面粗糙度Ra係較大的値而為0.036~0.095(μm),與比較例1~6同樣地無法得到連續膜。即便位於(1)式的下側,黏度大於3.0(Pa・s)時轉印性較差。Further, the viscosity of Comparative Examples 7 and 8 was very high, and was 5.3 to 6.9 (Pa·s), and the contact angle was 51 to 61 (∘) and was located on the lower side of the above formula (1). However, when gravure printing was performed using these, the surface roughness Ra of the printing film was large, and it was 0.036 to 0.095 (μm), and a continuous film could not be obtained similarly to the comparative examples 1 to 6. Even when it is located on the lower side of the type (1), the transferability is poor when the viscosity is more than 3.0 (Pa·s).

如上述,依照本實施例,因為導電糊劑係黏度x(Pa・s)、及對算術平均粗糙度Ra為0.010(μm)以下的試驗面之接觸角y(∘)為滿足前述(1)式,所以使用該導電糊而在陶瓷生坯片上施行凹版印刷時,導電糊係能夠從凹版印刷製版迅速地且均勻地被轉印。藉此,因為從剛轉印後糊劑表面就成為平滑面且因為在保持連續性的狀態下容易地將膜厚薄化,所以能夠形成適合於小型高容量MLCC10的內部電極之連續且較薄的膜厚之導體膜14。As described above, according to the present embodiment, the contact angle y(∘) of the test surface of the conductive paste is 0 (Pa·s) and the arithmetic mean roughness Ra is 0.010 (μm) or less to satisfy the above (1). In the formula, when the conductive paste is used to perform gravure printing on the ceramic green sheet, the conductive paste can be quickly and uniformly transferred from the gravure printing plate. With this, since the surface of the paste immediately after the transfer becomes a smooth surface and the film thickness is easily thinned while maintaining the continuity, it is possible to form a continuous and thin inner electrode suitable for the small-sized high-capacity MLCC 10. The film thickness 14 of the conductor film.

又,導電糊劑的黏度和接觸角,係藉由變更Ni粒徑、BT粒徑、Ni量、BT量、或變更黏著劑及有機溶劑的種類和量而適當地調整即可。In addition, the viscosity and the contact angle of the conductive paste may be appropriately adjusted by changing the Ni particle diameter, the BT particle diameter, the Ni amount, the BT amount, or the type and amount of the adhesive and the organic solvent.

而且,依照上述表1及圖2,較佳黏度的下限値為0.1(Pa・s)。使導電糊劑成為比其更低的黏度係困難的。又,接觸角的下限値為10(∘)。接觸角為10(∘)以下時,因為濕潤性變成太高,反而無法得到良好的轉印性。Further, according to Table 1 and Figure 2 above, the lower limit 较佳 of the preferred viscosity is 0.1 (Pa·s). It is difficult to make the conductive paste a lower viscosity than the conductive paste. Further, the lower limit 接触 of the contact angle is 10 (∘). When the contact angle is 10 (∘) or less, the wettability becomes too high, and on the contrary, good transferability cannot be obtained.

又,黏度x及接觸角y係位於比圖2的(2)式更上面、亦即滿足y>8.8x+12.4為佳。接觸角y越小,濕潤性變高而操作性變差,黏度x越低,能夠容許接觸角y至較小的值為止。Further, the viscosity x and the contact angle y are preferably higher than the formula (2) of Fig. 2, that is, y > 8.8 x + 12.4. The smaller the contact angle y, the higher the wettability and the worse the workability, and the lower the viscosity x, the allowable contact angle y to a small value.

以上,參照圖式而詳細地說明,但是本發明亦能夠進一步實施另外的態樣,在不脫離其主旨的範圍能夠施行各種變更。The present invention has been described in detail with reference to the drawings. However, the present invention can be further modified and various modifications can be made without departing from the spirit and scope of the invention.

10‧‧‧MLCC
12‧‧‧介電體層
14‧‧‧導體層
16‧‧‧外部電極
10‧‧‧MLCC
12‧‧‧ dielectric layer
14‧‧‧Conductor layer
16‧‧‧External electrode

圖1係顯示本發明的一實施例的導電糊係被應用在內部電極之MLCC的剖面之圖。 圖2係顯示本發明的一實施例的導電糊黏度與接觸角的關係之圖表。Fig. 1 is a view showing a cross section of an MLCC in which an electroconductive paste is applied to an internal electrode according to an embodiment of the present invention. Fig. 2 is a graph showing the relationship between the viscosity of the conductive paste and the contact angle in an embodiment of the present invention.

Claims (4)

一種導電糊,係含有導電性粉末、黏著劑、及有機溶劑之凹版印刷用導電糊,其特徵在於: 在25(℃)且剪切速度40(1/s)之黏度設作x(Pa・s)、以80(μm)之邊界值評價長度1.0(mm)之算術平均粗糙度Ra為0.010(μm)以下之水平的試驗面滴下10(μL)時的接觸角設作y(∘),此時x、y滿足下式, y<17.6x+19.1  (但是,x≦3.0、y<40)。The conductive paste is a conductive paste for gravure printing containing a conductive powder, an adhesive, and an organic solvent, and has a viscosity of 25 (° C.) and a shear rate of 40 (1/s) as x (Pa· s), the contact angle at which the arithmetic mean roughness Ra of the length 1.0 (mm) is equal to or less than 0.010 (μm) is 10 (μL) at a level of 80 (μm), and the contact angle is set to y (∘), At this time, x and y satisfy the following formula, y<17.6x+19.1 (however, x≦3.0, y<40). 如請求項1之導電糊,其中前述試驗面係經施行鍍Cr或鍍Ni者。The conductive paste of claim 1, wherein the test surface is subjected to Cr plating or Ni plating. 一種導體膜的形成方法,其特徵在於包含下列步驟: 調製含有導電性粉末、黏著劑、及有機溶劑之導電糊之步驟;將該導電糊填充在凹版印刷製版的凹處並轉印至被印刷面之印刷步驟;及藉由對所形成的印刷膜施行煅燒處理而在該被印刷面形成導體膜之煅燒步驟; 其中,前述調製導電糊之步驟,係在滿足下述情況下進行前述導電糊之調製:在25(℃)且剪切速度40(1/s)之黏度x(Pa・s)、使用與前述凹版印刷製版的最外周面相同材料且以成為相同表面狀態的方式水平配置的試驗面滴下10(μL)時之接觸角y(∘),所述x、y滿足y<17.6x+19.1  (但是,x≦3.0、y<40)。A method for forming a conductor film, comprising the steps of: preparing a conductive paste containing a conductive powder, an adhesive, and an organic solvent; filling the conductive paste in a recess of the gravure printing plate and transferring it to be printed a printing step of forming a conductive film on the surface to be printed by performing a calcination treatment on the formed printing film; wherein the step of preparing the conductive paste is carried out under the following conditions: Modulation: a viscosity x (Pa·s) at a shear rate of 40 (1/s) at 25 (° C.), using the same material as the outermost peripheral surface of the gravure printing plate, and horizontally arranged to have the same surface state. The contact angle y (∘) at 10 (μL) of the test surface was dropped, and x and y satisfy y<17.6x+19.1 (however, x≦3.0, y<40). 如請求項3之導體膜的形成方法,其中前述凹版印刷製版的最外周面及前述試驗面係經施行鍍Cr或鍍Ni者。The method for forming a conductor film according to claim 3, wherein the outermost peripheral surface of the gravure printing plate and the test surface are subjected to Cr plating or Ni plating.
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