TWI696893B - 正型感光性樹脂組成物、乾式薄膜、硬化物及印刷配線板 - Google Patents

正型感光性樹脂組成物、乾式薄膜、硬化物及印刷配線板 Download PDF

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Publication number
TWI696893B
TWI696893B TW105107404A TW105107404A TWI696893B TW I696893 B TWI696893 B TW I696893B TW 105107404 A TW105107404 A TW 105107404A TW 105107404 A TW105107404 A TW 105107404A TW I696893 B TWI696893 B TW I696893B
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TW
Taiwan
Prior art keywords
photosensitive resin
resin composition
positive photosensitive
group
aromatic
Prior art date
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TW105107404A
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English (en)
Chinese (zh)
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TW201704876A (zh
Inventor
秋元真歩
三輪崇夫
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日商太陽控股股份有限公司
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Publication of TW201704876A publication Critical patent/TW201704876A/zh
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Materials For Photolithography (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
TW105107404A 2015-03-16 2016-03-10 正型感光性樹脂組成物、乾式薄膜、硬化物及印刷配線板 TWI696893B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015-052679 2015-03-16
JP2015052679 2015-03-16

Publications (2)

Publication Number Publication Date
TW201704876A TW201704876A (zh) 2017-02-01
TWI696893B true TWI696893B (zh) 2020-06-21

Family

ID=56920084

Family Applications (1)

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TW105107404A TWI696893B (zh) 2015-03-16 2016-03-10 正型感光性樹脂組成物、乾式薄膜、硬化物及印刷配線板

Country Status (5)

Country Link
JP (1) JP6810024B2 (ja)
KR (1) KR102597875B1 (ja)
CN (1) CN107407875B (ja)
TW (1) TWI696893B (ja)
WO (1) WO2016147490A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7233189B2 (ja) * 2018-09-21 2023-03-06 太陽ホールディングス株式会社 感光性樹脂組成物、ドライフィルム、硬化物および電子部品
WO2023243199A1 (ja) * 2022-06-14 2023-12-21 Jsr株式会社 感光性樹脂組成物、パターンを有する樹脂膜、パターンを有する樹脂膜の製造方法、および半導体回路基板
WO2023243198A1 (ja) * 2022-06-14 2023-12-21 Jsr株式会社 感光性樹脂組成物、パターンを有する樹脂膜、パターンを有する樹脂膜の製造方法、および半導体回路基板
WO2024100764A1 (ja) * 2022-11-08 2024-05-16 株式会社レゾナック 感光性樹脂組成物、硬化物、及び半導体素子

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200809402A (en) * 2006-04-28 2008-02-16 Asahi Chemical Ind Photosensitive resin composition and photosensitive film
TW200911882A (en) * 2007-04-25 2009-03-16 Nissan Chemical Ind Ltd Polyimide precursor and polyimide, and image-forming underlayer application solution

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US4093461A (en) 1975-07-18 1978-06-06 Gaf Corporation Positive working thermally stable photoresist composition, article and method of using
JP2003043686A (ja) * 2001-08-03 2003-02-13 Toray Ind Inc ポジ型感光性樹脂前駆体組成物
JP2003076007A (ja) * 2001-08-31 2003-03-14 Toray Ind Inc ポジ型感光性樹脂前駆体組成物
JP4250982B2 (ja) * 2003-03-11 2009-04-08 日立化成デュポンマイクロシステムズ株式会社 ポジ型感光性樹脂組成物、パターンの製造方法及び電子部品
JP4757741B2 (ja) * 2005-08-24 2011-08-24 旭化成イーマテリアルズ株式会社 感光性樹脂組成物及びそれを用いた回路基板
JP5263464B2 (ja) 2006-05-23 2013-08-14 日産化学工業株式会社 脂環式ポリイミド前駆体、ポジ型感光性樹脂組成物およびその硬化膜
JP4998679B2 (ja) * 2006-05-23 2012-08-15 住友ベークライト株式会社 ポリイミド前駆体共重合体、それを含むワニスおよびポジ型感光性樹脂組成物、ポリイミド共重合体、それを含む半導体素子の保護膜、ポリイミド共重合体含有膜の微細パターンの製造方法
WO2010071100A1 (ja) * 2008-12-15 2010-06-24 東洋紡績株式会社 ポジ型感光性ポリイミド樹脂組成物
JP5201155B2 (ja) * 2009-01-27 2013-06-05 新日本理化株式会社 ポリ（アミド酸―イミド）樹脂
JP5526766B2 (ja) * 2009-12-25 2014-06-18 Ｊｓｒ株式会社 感放射線性樹脂組成物、層間絶縁膜及びその形成方法
JP2011227133A (ja) * 2010-04-15 2011-11-10 Asahi Kasei E-Materials Corp 感光性樹脂組成物
KR20120111072A (ko) * 2011-03-31 2012-10-10 금호석유화학 주식회사 디스플레이 장치용 감광성 수지 조성물
JP6190805B2 (ja) * 2012-05-07 2017-08-30 旭化成株式会社 ネガ型感光性樹脂組成物、硬化レリーフパターンの製造方法、及び半導体装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200809402A (en) * 2006-04-28 2008-02-16 Asahi Chemical Ind Photosensitive resin composition and photosensitive film
TW200911882A (en) * 2007-04-25 2009-03-16 Nissan Chemical Ind Ltd Polyimide precursor and polyimide, and image-forming underlayer application solution

Also Published As

Publication number Publication date
CN107407875A (zh) 2017-11-28
TW201704876A (zh) 2017-02-01
JP6810024B2 (ja) 2021-01-06
WO2016147490A1 (ja) 2016-09-22
KR20170128440A (ko) 2017-11-22
KR102597875B1 (ko) 2023-11-03
CN107407875B (zh) 2021-08-24
JPWO2016147490A1 (ja) 2017-12-28

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