TWI696893B - 正型感光性樹脂組成物、乾式薄膜、硬化物及印刷配線板 - Google Patents
正型感光性樹脂組成物、乾式薄膜、硬化物及印刷配線板 Download PDFInfo
- Publication number
- TWI696893B TWI696893B TW105107404A TW105107404A TWI696893B TW I696893 B TWI696893 B TW I696893B TW 105107404 A TW105107404 A TW 105107404A TW 105107404 A TW105107404 A TW 105107404A TW I696893 B TWI696893 B TW I696893B
- Authority
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- Taiwan
- Prior art keywords
- photosensitive resin
- resin composition
- positive photosensitive
- group
- aromatic
- Prior art date
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Materials For Photolithography (AREA)
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015-052679 | 2015-03-16 | ||
JP2015052679 | 2015-03-16 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201704876A TW201704876A (zh) | 2017-02-01 |
TWI696893B true TWI696893B (zh) | 2020-06-21 |
Family
ID=56920084
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW105107404A TWI696893B (zh) | 2015-03-16 | 2016-03-10 | 正型感光性樹脂組成物、乾式薄膜、硬化物及印刷配線板 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6810024B2 (ja) |
KR (1) | KR102597875B1 (ja) |
CN (1) | CN107407875B (ja) |
TW (1) | TWI696893B (ja) |
WO (1) | WO2016147490A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7233189B2 (ja) * | 2018-09-21 | 2023-03-06 | 太陽ホールディングス株式会社 | 感光性樹脂組成物、ドライフィルム、硬化物および電子部品 |
WO2023243199A1 (ja) * | 2022-06-14 | 2023-12-21 | Jsr株式会社 | 感光性樹脂組成物、パターンを有する樹脂膜、パターンを有する樹脂膜の製造方法、および半導体回路基板 |
WO2023243198A1 (ja) * | 2022-06-14 | 2023-12-21 | Jsr株式会社 | 感光性樹脂組成物、パターンを有する樹脂膜、パターンを有する樹脂膜の製造方法、および半導体回路基板 |
WO2024100764A1 (ja) * | 2022-11-08 | 2024-05-16 | 株式会社レゾナック | 感光性樹脂組成物、硬化物、及び半導体素子 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200809402A (en) * | 2006-04-28 | 2008-02-16 | Asahi Chemical Ind | Photosensitive resin composition and photosensitive film |
TW200911882A (en) * | 2007-04-25 | 2009-03-16 | Nissan Chemical Ind Ltd | Polyimide precursor and polyimide, and image-forming underlayer application solution |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4093461A (en) | 1975-07-18 | 1978-06-06 | Gaf Corporation | Positive working thermally stable photoresist composition, article and method of using |
JP2003043686A (ja) * | 2001-08-03 | 2003-02-13 | Toray Ind Inc | ポジ型感光性樹脂前駆体組成物 |
JP2003076007A (ja) * | 2001-08-31 | 2003-03-14 | Toray Ind Inc | ポジ型感光性樹脂前駆体組成物 |
JP4250982B2 (ja) * | 2003-03-11 | 2009-04-08 | 日立化成デュポンマイクロシステムズ株式会社 | ポジ型感光性樹脂組成物、パターンの製造方法及び電子部品 |
JP4757741B2 (ja) * | 2005-08-24 | 2011-08-24 | 旭化成イーマテリアルズ株式会社 | 感光性樹脂組成物及びそれを用いた回路基板 |
JP5263464B2 (ja) | 2006-05-23 | 2013-08-14 | 日産化学工業株式会社 | 脂環式ポリイミド前駆体、ポジ型感光性樹脂組成物およびその硬化膜 |
JP4998679B2 (ja) * | 2006-05-23 | 2012-08-15 | 住友ベークライト株式会社 | ポリイミド前駆体共重合体、それを含むワニスおよびポジ型感光性樹脂組成物、ポリイミド共重合体、それを含む半導体素子の保護膜、ポリイミド共重合体含有膜の微細パターンの製造方法 |
WO2010071100A1 (ja) * | 2008-12-15 | 2010-06-24 | 東洋紡績株式会社 | ポジ型感光性ポリイミド樹脂組成物 |
JP5201155B2 (ja) * | 2009-01-27 | 2013-06-05 | 新日本理化株式会社 | ポリ(アミド酸―イミド)樹脂 |
JP5526766B2 (ja) * | 2009-12-25 | 2014-06-18 | Jsr株式会社 | 感放射線性樹脂組成物、層間絶縁膜及びその形成方法 |
JP2011227133A (ja) * | 2010-04-15 | 2011-11-10 | Asahi Kasei E-Materials Corp | 感光性樹脂組成物 |
KR20120111072A (ko) * | 2011-03-31 | 2012-10-10 | 금호석유화학 주식회사 | 디스플레이 장치용 감광성 수지 조성물 |
JP6190805B2 (ja) * | 2012-05-07 | 2017-08-30 | 旭化成株式会社 | ネガ型感光性樹脂組成物、硬化レリーフパターンの製造方法、及び半導体装置 |
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2015
- 2015-11-27 CN CN201580077368.0A patent/CN107407875B/zh active Active
- 2015-11-27 JP JP2017506024A patent/JP6810024B2/ja active Active
- 2015-11-27 KR KR1020177028769A patent/KR102597875B1/ko active IP Right Grant
- 2015-11-27 WO PCT/JP2015/083465 patent/WO2016147490A1/ja active Application Filing
-
2016
- 2016-03-10 TW TW105107404A patent/TWI696893B/zh active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200809402A (en) * | 2006-04-28 | 2008-02-16 | Asahi Chemical Ind | Photosensitive resin composition and photosensitive film |
TW200911882A (en) * | 2007-04-25 | 2009-03-16 | Nissan Chemical Ind Ltd | Polyimide precursor and polyimide, and image-forming underlayer application solution |
Also Published As
Publication number | Publication date |
---|---|
CN107407875A (zh) | 2017-11-28 |
TW201704876A (zh) | 2017-02-01 |
JP6810024B2 (ja) | 2021-01-06 |
WO2016147490A1 (ja) | 2016-09-22 |
KR20170128440A (ko) | 2017-11-22 |
KR102597875B1 (ko) | 2023-11-03 |
CN107407875B (zh) | 2021-08-24 |
JPWO2016147490A1 (ja) | 2017-12-28 |
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