KR102597875B1 - 포지티브형 감광성 수지 조성물, 드라이 필름, 경화물 및 프린트 배선판 - Google Patents

포지티브형 감광성 수지 조성물, 드라이 필름, 경화물 및 프린트 배선판 Download PDF

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Publication number
KR102597875B1
KR102597875B1 KR1020177028769A KR20177028769A KR102597875B1 KR 102597875 B1 KR102597875 B1 KR 102597875B1 KR 1020177028769 A KR1020177028769 A KR 1020177028769A KR 20177028769 A KR20177028769 A KR 20177028769A KR 102597875 B1 KR102597875 B1 KR 102597875B1
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KR
South Korea
Prior art keywords
photosensitive resin
resin composition
positive photosensitive
group
polyamic acid
Prior art date
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KR1020177028769A
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English (en)
Korean (ko)
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KR20170128440A (ko
Inventor
마호 아키모토
다카오 미와
Original Assignee
다이요 홀딩스 가부시키가이샤
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Publication of KR20170128440A publication Critical patent/KR20170128440A/ko
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Publication of KR102597875B1 publication Critical patent/KR102597875B1/ko

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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/039Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/022Quinonediazides
    • G03F7/023Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Materials For Photolithography (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
KR1020177028769A 2015-03-16 2015-11-27 포지티브형 감광성 수지 조성물, 드라이 필름, 경화물 및 프린트 배선판 KR102597875B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2015-052679 2015-03-16
JP2015052679 2015-03-16
PCT/JP2015/083465 WO2016147490A1 (ja) 2015-03-16 2015-11-27 ポジ型感光性樹脂組成物、ドライフィルム、硬化物およびプリント配線板

Publications (2)

Publication Number Publication Date
KR20170128440A KR20170128440A (ko) 2017-11-22
KR102597875B1 true KR102597875B1 (ko) 2023-11-03

Family

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Family Applications (1)

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KR1020177028769A KR102597875B1 (ko) 2015-03-16 2015-11-27 포지티브형 감광성 수지 조성물, 드라이 필름, 경화물 및 프린트 배선판

Country Status (5)

Country Link
JP (1) JP6810024B2 (ja)
KR (1) KR102597875B1 (ja)
CN (1) CN107407875B (ja)
TW (1) TWI696893B (ja)
WO (1) WO2016147490A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7233189B2 (ja) * 2018-09-21 2023-03-06 太陽ホールディングス株式会社 感光性樹脂組成物、ドライフィルム、硬化物および電子部品
WO2023243199A1 (ja) * 2022-06-14 2023-12-21 Jsr株式会社 感光性樹脂組成物、パターンを有する樹脂膜、パターンを有する樹脂膜の製造方法、および半導体回路基板
WO2023243198A1 (ja) * 2022-06-14 2023-12-21 Jsr株式会社 感光性樹脂組成物、パターンを有する樹脂膜、パターンを有する樹脂膜の製造方法、および半導体回路基板
WO2024100764A1 (ja) * 2022-11-08 2024-05-16 株式会社レゾナック 感光性樹脂組成物、硬化物、及び半導体素子

Citations (4)

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JP2003076007A (ja) 2001-08-31 2003-03-14 Toray Ind Inc ポジ型感光性樹脂前駆体組成物
JP2007314583A (ja) 2006-05-23 2007-12-06 Nissan Chem Ind Ltd 脂環式ポリイミド前駆体、ポジ型感光性樹脂組成物およびその硬化膜
JP2010196041A (ja) * 2009-01-27 2010-09-09 New Japan Chem Co Ltd ポリ(アミド酸―イミド)樹脂
JP2011227133A (ja) * 2010-04-15 2011-11-10 Asahi Kasei E-Materials Corp 感光性樹脂組成物

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US4093461A (en) 1975-07-18 1978-06-06 Gaf Corporation Positive working thermally stable photoresist composition, article and method of using
JP2003043686A (ja) * 2001-08-03 2003-02-13 Toray Ind Inc ポジ型感光性樹脂前駆体組成物
JP4250982B2 (ja) * 2003-03-11 2009-04-08 日立化成デュポンマイクロシステムズ株式会社 ポジ型感光性樹脂組成物、パターンの製造方法及び電子部品
JP4757741B2 (ja) * 2005-08-24 2011-08-24 旭化成イーマテリアルズ株式会社 感光性樹脂組成物及びそれを用いた回路基板
US8187788B2 (en) * 2006-04-28 2012-05-29 Asahi Kasei Kabushiki Kaisha Photosensitive resin composition and photosensitive film
JP4998679B2 (ja) * 2006-05-23 2012-08-15 住友ベークライト株式会社 ポリイミド前駆体共重合体、それを含むワニスおよびポジ型感光性樹脂組成物、ポリイミド共重合体、それを含む半導体素子の保護膜、ポリイミド共重合体含有膜の微細パターンの製造方法
US8703863B2 (en) * 2007-04-25 2014-04-22 Nissan Chemical Industries, Ltd. Polyimide precursor, polyimide, and coating solution for under layer film for image formation
WO2010071100A1 (ja) * 2008-12-15 2010-06-24 東洋紡績株式会社 ポジ型感光性ポリイミド樹脂組成物
JP5526766B2 (ja) * 2009-12-25 2014-06-18 Jsr株式会社 感放射線性樹脂組成物、層間絶縁膜及びその形成方法
KR20120111072A (ko) * 2011-03-31 2012-10-10 금호석유화학 주식회사 디스플레이 장치용 감광성 수지 조성물
KR101719045B1 (ko) * 2012-05-07 2017-03-22 아사히 가세이 이-매터리얼즈 가부시키가이샤 네거티브형 감광성 수지 조성물, 경화 릴리프 패턴의 제조 방법, 및 반도체 장치

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003076007A (ja) 2001-08-31 2003-03-14 Toray Ind Inc ポジ型感光性樹脂前駆体組成物
JP2007314583A (ja) 2006-05-23 2007-12-06 Nissan Chem Ind Ltd 脂環式ポリイミド前駆体、ポジ型感光性樹脂組成物およびその硬化膜
JP2010196041A (ja) * 2009-01-27 2010-09-09 New Japan Chem Co Ltd ポリ(アミド酸―イミド)樹脂
JP2011227133A (ja) * 2010-04-15 2011-11-10 Asahi Kasei E-Materials Corp 感光性樹脂組成物

Also Published As

Publication number Publication date
JP6810024B2 (ja) 2021-01-06
JPWO2016147490A1 (ja) 2017-12-28
CN107407875B (zh) 2021-08-24
KR20170128440A (ko) 2017-11-22
WO2016147490A1 (ja) 2016-09-22
TW201704876A (zh) 2017-02-01
TWI696893B (zh) 2020-06-21
CN107407875A (zh) 2017-11-28

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