TWI683774B - 平板玻璃的製造方法及製造裝置 - Google Patents
平板玻璃的製造方法及製造裝置 Download PDFInfo
- Publication number
- TWI683774B TWI683774B TW105137482A TW105137482A TWI683774B TW I683774 B TWI683774 B TW I683774B TW 105137482 A TW105137482 A TW 105137482A TW 105137482 A TW105137482 A TW 105137482A TW I683774 B TWI683774 B TW I683774B
- Authority
- TW
- Taiwan
- Prior art keywords
- flat glass
- processing
- glass
- end surface
- conveyor belt
- Prior art date
Links
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/06—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving conveyor belts, a sequence of travelling work-tables or the like
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
- B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/24—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/08—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass
- B24B9/10—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass of plate glass
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B35/00—Transporting of glass products during their manufacture, e.g. hot glass lenses, prisms
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015236792A JP6562305B2 (ja) | 2015-12-03 | 2015-12-03 | 板ガラスの製造方法及び製造装置 |
JP2015-236792 | 2015-12-03 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201730082A TW201730082A (zh) | 2017-09-01 |
TWI683774B true TWI683774B (zh) | 2020-02-01 |
Family
ID=58797122
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW105137482A TWI683774B (zh) | 2015-12-03 | 2016-11-16 | 平板玻璃的製造方法及製造裝置 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6562305B2 (ja) |
KR (1) | KR102493145B1 (ja) |
CN (1) | CN108025415B (ja) |
TW (1) | TWI683774B (ja) |
WO (1) | WO2017094462A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201843118A (zh) * | 2017-05-02 | 2018-12-16 | 日商日本電氣硝子股份有限公司 | 板玻璃的製造方法以及製造裝置 |
CN108057636A (zh) * | 2017-12-14 | 2018-05-22 | 北京铂阳顶荣光伏科技有限公司 | 全自动检测基板尺寸设备、基板检测线及其检测方法 |
CN109227257B (zh) * | 2018-12-12 | 2019-03-22 | 山东创惠电子科技有限责任公司 | 一种玻璃面板抛光机床及抛光方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0258334U (ja) * | 1988-10-19 | 1990-04-26 | ||
TW200408595A (en) * | 2002-11-19 | 2004-06-01 | Murata Machinery Ltd | Carrier system |
CN101925526A (zh) * | 2008-01-28 | 2010-12-22 | 松下电器产业株式会社 | 基板检测装置和基板传送设备 |
TW201242718A (en) * | 2011-02-01 | 2012-11-01 | Asahi Glass Co Ltd | Method and apparatus for grinding corners of glass plate |
JP2013169622A (ja) * | 2012-02-21 | 2013-09-02 | Bando Kiko Co Ltd | ガラス板の両サイド加工装置 |
CN204643248U (zh) * | 2015-02-06 | 2015-09-16 | Juki株式会社 | 基板输送装置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4002405A1 (de) * | 1989-04-06 | 1990-10-11 | Thielenhaus Ernst Kg | Werkzeugmaschine, insbes. feinschleifmaschine |
JPH1149529A (ja) * | 1998-03-27 | 1999-02-23 | Bando Kiko Kk | ガラス板の加工装置 |
JP2002066919A (ja) * | 2000-09-04 | 2002-03-05 | Marugen Tekkosho:Kk | プリント基板の研磨装置およびその方法 |
JP4566472B2 (ja) * | 2001-07-23 | 2010-10-20 | カワサキプラントシステムズ株式会社 | 板ガラスの割断機構およびトリミング装置 |
JP4192568B2 (ja) * | 2002-11-19 | 2008-12-10 | 村田機械株式会社 | 搬送システム |
CN1626310A (zh) * | 2003-12-09 | 2005-06-15 | 三星康宁精密琉璃株式会社 | 玻璃基板边缘研磨系统及其方法 |
JP5434014B2 (ja) | 2008-08-22 | 2014-03-05 | 坂東機工株式会社 | ガラス板の加工方法及びガラス板加工装置 |
CN204325124U (zh) * | 2014-11-28 | 2015-05-13 | 鹤壁万里建材有限公司 | 泡沫玻璃打磨切割装置 |
-
2015
- 2015-12-03 JP JP2015236792A patent/JP6562305B2/ja active Active
-
2016
- 2016-11-09 KR KR1020187004034A patent/KR102493145B1/ko active IP Right Grant
- 2016-11-09 WO PCT/JP2016/083236 patent/WO2017094462A1/ja active Application Filing
- 2016-11-09 CN CN201680052737.5A patent/CN108025415B/zh active Active
- 2016-11-16 TW TW105137482A patent/TWI683774B/zh active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0258334U (ja) * | 1988-10-19 | 1990-04-26 | ||
TW200408595A (en) * | 2002-11-19 | 2004-06-01 | Murata Machinery Ltd | Carrier system |
CN101925526A (zh) * | 2008-01-28 | 2010-12-22 | 松下电器产业株式会社 | 基板检测装置和基板传送设备 |
TW201242718A (en) * | 2011-02-01 | 2012-11-01 | Asahi Glass Co Ltd | Method and apparatus for grinding corners of glass plate |
JP2013169622A (ja) * | 2012-02-21 | 2013-09-02 | Bando Kiko Co Ltd | ガラス板の両サイド加工装置 |
CN204643248U (zh) * | 2015-02-06 | 2015-09-16 | Juki株式会社 | 基板输送装置 |
Also Published As
Publication number | Publication date |
---|---|
KR20180091806A (ko) | 2018-08-16 |
CN108025415A (zh) | 2018-05-11 |
JP6562305B2 (ja) | 2019-08-21 |
JP2017100260A (ja) | 2017-06-08 |
TW201730082A (zh) | 2017-09-01 |
KR102493145B1 (ko) | 2023-01-30 |
WO2017094462A1 (ja) | 2017-06-08 |
CN108025415B (zh) | 2020-03-17 |
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