TWI682455B - 基板洗淨裝置及基板洗淨方法 - Google Patents

基板洗淨裝置及基板洗淨方法 Download PDF

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Publication number
TWI682455B
TWI682455B TW107146417A TW107146417A TWI682455B TW I682455 B TWI682455 B TW I682455B TW 107146417 A TW107146417 A TW 107146417A TW 107146417 A TW107146417 A TW 107146417A TW I682455 B TWI682455 B TW I682455B
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TW
Taiwan
Prior art keywords
substrate
liquid
processing liquid
removal liquid
solute
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TW107146417A
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English (en)
Chinese (zh)
Other versions
TW201921481A (zh
Inventor
吉田幸史
樋口鮎美
山口直子
Original Assignee
日商斯庫林集團股份有限公司
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Publication of TW201921481A publication Critical patent/TW201921481A/zh
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Publication of TWI682455B publication Critical patent/TWI682455B/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0014—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by incorporation in a layer which is removed with the contaminants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/10—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H10P70/15—Cleaning before device manufacture, i.e. Begin-Of-Line process by wet cleaning only
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0432—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7626—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft

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  • Cleaning Or Drying Semiconductors (AREA)
TW107146417A 2017-01-05 2017-12-29 基板洗淨裝置及基板洗淨方法 TWI682455B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2017-000676 2017-01-05
JP2017000676 2017-01-05
JP2017241845A JP6951229B2 (ja) 2017-01-05 2017-12-18 基板洗浄装置および基板洗浄方法
JP2017-241845 2017-12-18

Publications (2)

Publication Number Publication Date
TW201921481A TW201921481A (zh) 2019-06-01
TWI682455B true TWI682455B (zh) 2020-01-11

Family

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Family Applications (2)

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TW107146417A TWI682455B (zh) 2017-01-05 2017-12-29 基板洗淨裝置及基板洗淨方法
TW106146531A TWI651763B (zh) 2017-01-05 2017-12-29 基板洗淨裝置及基板洗淨方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW106146531A TWI651763B (zh) 2017-01-05 2017-12-29 基板洗淨裝置及基板洗淨方法

Country Status (5)

Country Link
US (1) US11413662B2 (https=)
JP (1) JP6951229B2 (https=)
KR (2) KR102285776B1 (https=)
CN (1) CN110121762B (https=)
TW (2) TWI682455B (https=)

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* Cited by examiner, † Cited by third party
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CN116646279A (zh) * 2017-01-05 2023-08-25 株式会社斯库林集团 基板清洗装置及基板清洗方法
TWI755609B (zh) 2017-09-22 2022-02-21 日商斯庫林集團股份有限公司 基板洗淨方法及基板洗淨裝置
JP7126429B2 (ja) * 2018-11-22 2022-08-26 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP2020096115A (ja) 2018-12-14 2020-06-18 メルク、パテント、ゲゼルシャフト、ミット、ベシュレンクテル、ハフツングＭｅｒｃｋ Ｐａｔｅｎｔ ＧｍｂＨ 基板洗浄液、これを用いる洗浄された基板の製造方法およびデバイスの製造方法
JP7116676B2 (ja) * 2018-12-14 2022-08-10 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP2020094152A (ja) 2018-12-14 2020-06-18 メルク、パテント、ゲゼルシャフト、ミット、ベシュレンクテル、ハフツングＭｅｒｃｋ Ｐａｔｅｎｔ ＧｍｂＨ 基板洗浄液、これを用いる洗浄された基板の製造方法およびデバイスの製造方法
JP7191748B2 (ja) * 2019-03-25 2022-12-19 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP7344049B2 (ja) 2019-08-29 2023-09-13 株式会社Ｓｃｒｅｅｎホールディングス 半導体装置形成方法および基板処理装置
JP2021190637A (ja) 2020-06-03 2021-12-13 メルク、パテント、ゲゼルシャフト、ミット、ベシュレンクテル、ハフツングMerck Patent GmbH 基板洗浄液、これを用いる洗浄された基板の製造方法およびデバイスの製造方法
KR102615758B1 (ko) 2021-05-10 2023-12-19 세메스 주식회사 기판 처리 장치 및 방법
KR102712483B1 (ko) * 2021-12-28 2024-10-04 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
JP2024109321A (ja) 2023-02-01 2024-08-14 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11101970A (ja) * 1997-09-29 1999-04-13 Advanced Display Inc 基板洗浄方法
TW201234454A (en) * 2010-12-27 2012-08-16 Tokyo Electron Ltd Liquid treatment device, liquid treatment method, and storage medium containing program for implementing liquid treatment method
TW201436010A (zh) * 2013-03-01 2014-09-16 栗田工業股份有限公司 半導體基板洗淨系統及半導體基板的洗淨方法
JP2015095583A (ja) * 2013-11-13 2015-05-18 東京エレクトロン株式会社 基板洗浄方法、基板洗浄システムおよび記憶媒体

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KR101811066B1 (ko) * 2011-07-12 2017-12-20 도쿄엘렉트론가부시키가이샤 액처리 장치 및 액처리 방법
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WO2017056746A1 (ja) * 2015-09-30 2017-04-06 Jsr株式会社 半導体基板洗浄用膜形成組成物及び半導体基板の洗浄方法
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Publication number Priority date Publication date Assignee Title
JPH11101970A (ja) * 1997-09-29 1999-04-13 Advanced Display Inc 基板洗浄方法
TW201234454A (en) * 2010-12-27 2012-08-16 Tokyo Electron Ltd Liquid treatment device, liquid treatment method, and storage medium containing program for implementing liquid treatment method
TW201436010A (zh) * 2013-03-01 2014-09-16 栗田工業股份有限公司 半導體基板洗淨系統及半導體基板的洗淨方法
JP2015095583A (ja) * 2013-11-13 2015-05-18 東京エレクトロン株式会社 基板洗浄方法、基板洗浄システムおよび記憶媒体

Also Published As

Publication number Publication date
KR20200133020A (ko) 2020-11-25
JP2018110220A (ja) 2018-07-12
KR102182951B1 (ko) 2020-11-25
KR102285776B1 (ko) 2021-08-03
JP6951229B2 (ja) 2021-10-20
US11413662B2 (en) 2022-08-16
TW201921481A (zh) 2019-06-01
US20200086360A1 (en) 2020-03-19
TWI651763B (zh) 2019-02-21
KR20190085110A (ko) 2019-07-17
CN110121762B (zh) 2023-06-16
TW201834012A (zh) 2018-09-16
CN110121762A (zh) 2019-08-13

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