TWI678260B - 滾筒構件、鉛筆構件、以及包含前述二者至少任一方之基板處理裝置 - Google Patents

滾筒構件、鉛筆構件、以及包含前述二者至少任一方之基板處理裝置 Download PDF

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Publication number
TWI678260B
TWI678260B TW107140682A TW107140682A TWI678260B TW I678260 B TWI678260 B TW I678260B TW 107140682 A TW107140682 A TW 107140682A TW 107140682 A TW107140682 A TW 107140682A TW I678260 B TWI678260 B TW I678260B
Authority
TW
Taiwan
Prior art keywords
substrate
pencil
cleaning
polishing
gap
Prior art date
Application number
TW107140682A
Other languages
English (en)
Chinese (zh)
Other versions
TW201906689A (zh
Inventor
石橋知淳
Tomoatsu Ishibashi
Original Assignee
日商荏原製作所股份有限公司
Ebara Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商荏原製作所股份有限公司, Ebara Corporation filed Critical 日商荏原製作所股份有限公司
Publication of TW201906689A publication Critical patent/TW201906689A/zh
Application granted granted Critical
Publication of TWI678260B publication Critical patent/TWI678260B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning In General (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW107140682A 2014-10-31 2015-09-25 滾筒構件、鉛筆構件、以及包含前述二者至少任一方之基板處理裝置 TWI678260B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014223754A JP6316730B2 (ja) 2014-10-31 2014-10-31 ロール部材、ペンシル部材、及びそれらの少なくともいずれか一方を含む基板処理装置
JP2014-223754 2014-10-31

Publications (2)

Publication Number Publication Date
TW201906689A TW201906689A (zh) 2019-02-16
TWI678260B true TWI678260B (zh) 2019-12-01

Family

ID=55853472

Family Applications (2)

Application Number Title Priority Date Filing Date
TW107140682A TWI678260B (zh) 2014-10-31 2015-09-25 滾筒構件、鉛筆構件、以及包含前述二者至少任一方之基板處理裝置
TW104131754A TWI670141B (zh) 2014-10-31 2015-09-25 滾筒構件、以及基板洗淨方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW104131754A TWI670141B (zh) 2014-10-31 2015-09-25 滾筒構件、以及基板洗淨方法

Country Status (7)

Country Link
US (2) US10471481B2 (enExample)
JP (1) JP6316730B2 (enExample)
KR (1) KR102443489B1 (enExample)
CN (2) CN105575851B (enExample)
MY (1) MY178652A (enExample)
SG (1) SG10201508996WA (enExample)
TW (2) TWI678260B (enExample)

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* Cited by examiner, † Cited by third party
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JP6956578B2 (ja) * 2017-09-19 2021-11-02 株式会社荏原製作所 ブレークイン装置及びブレークインシステム
JP7224128B2 (ja) * 2018-08-09 2023-02-17 株式会社荏原製作所 基板用洗浄具、基板洗浄装置、基板処理装置、基板処理方法および基板用洗浄具の製造方法
JP7536039B2 (ja) * 2019-12-13 2024-08-19 株式会社荏原製作所 基板洗浄装置、研磨装置、バフ処理装置、基板洗浄方法、基板処理装置、および機械学習器
CN112420574B (zh) * 2020-11-25 2024-02-02 杭州众硅电子科技有限公司 一种可隔离防护晶圆的晶圆处理装置
JP7564693B2 (ja) 2020-11-26 2024-10-09 株式会社Ｓｃｒｅｅｎホールディングス 下面ブラシ、ブラシユニットおよび基板洗浄装置
JP7672908B2 (ja) * 2021-07-28 2025-05-08 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄装置および基板洗浄方法
US20230178360A1 (en) * 2021-12-06 2023-06-08 Tung An Development Ltd. Device Having Cleaning Bodies
WO2024124074A1 (en) * 2022-12-07 2024-06-13 Tech Core Pva, Llc Cylindrical brush and method of manufacture

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JP2014534615A (ja) * 2011-09-26 2014-12-18 インテグリス・インコーポレーテッド Ｃｍｐ後クリーニング装置および方法
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Also Published As

Publication number Publication date
JP2016092158A (ja) 2016-05-23
CN113276024B (zh) 2023-08-29
MY178652A (en) 2020-10-20
JP6316730B2 (ja) 2018-04-25
SG10201508996WA (en) 2016-05-30
US20200030855A1 (en) 2020-01-30
TW201615340A (zh) 2016-05-01
TW201906689A (zh) 2019-02-16
US11642704B2 (en) 2023-05-09
US10471481B2 (en) 2019-11-12
US20160126113A1 (en) 2016-05-05
KR102443489B1 (ko) 2022-09-15
KR20160052343A (ko) 2016-05-12
CN105575851A (zh) 2016-05-11
TWI670141B (zh) 2019-09-01
CN113276024A (zh) 2021-08-20
CN105575851B (zh) 2021-08-27

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