CN105575851B - 辊部件以及基板处理装置 - Google Patents

辊部件以及基板处理装置 Download PDF

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Publication number
CN105575851B
CN105575851B CN201510724374.2A CN201510724374A CN105575851B CN 105575851 B CN105575851 B CN 105575851B CN 201510724374 A CN201510724374 A CN 201510724374A CN 105575851 B CN105575851 B CN 105575851B
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China
Prior art keywords
substrate
cleaning
roller member
edge
slit
Prior art date
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CN201510724374.2A
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English (en)
Chinese (zh)
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CN105575851A (zh
Inventor
石桥知淳
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Ebara Corp
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Ebara Corp
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Publication date
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Priority to CN202110546709.1A priority Critical patent/CN113276024B/zh
Publication of CN105575851A publication Critical patent/CN105575851A/zh
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Publication of CN105575851B publication Critical patent/CN105575851B/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning In General (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
CN201510724374.2A 2014-10-31 2015-10-29 辊部件以及基板处理装置 Active CN105575851B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110546709.1A CN113276024B (zh) 2014-10-31 2015-10-29 笔部件以及基板处理装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014223754A JP6316730B2 (ja) 2014-10-31 2014-10-31 ロール部材、ペンシル部材、及びそれらの少なくともいずれか一方を含む基板処理装置
JP2014-223754 2014-10-31

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN202110546709.1A Division CN113276024B (zh) 2014-10-31 2015-10-29 笔部件以及基板处理装置

Publications (2)

Publication Number Publication Date
CN105575851A CN105575851A (zh) 2016-05-11
CN105575851B true CN105575851B (zh) 2021-08-27

Family

ID=55853472

Family Applications (2)

Application Number Title Priority Date Filing Date
CN202110546709.1A Active CN113276024B (zh) 2014-10-31 2015-10-29 笔部件以及基板处理装置
CN201510724374.2A Active CN105575851B (zh) 2014-10-31 2015-10-29 辊部件以及基板处理装置

Family Applications Before (1)

Application Number Title Priority Date Filing Date
CN202110546709.1A Active CN113276024B (zh) 2014-10-31 2015-10-29 笔部件以及基板处理装置

Country Status (7)

Country Link
US (2) US10471481B2 (enExample)
JP (1) JP6316730B2 (enExample)
KR (1) KR102443489B1 (enExample)
CN (2) CN113276024B (enExample)
MY (1) MY178652A (enExample)
SG (1) SG10201508996WA (enExample)
TW (2) TWI670141B (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6956578B2 (ja) * 2017-09-19 2021-11-02 株式会社荏原製作所 ブレークイン装置及びブレークインシステム
JP7224128B2 (ja) * 2018-08-09 2023-02-17 株式会社荏原製作所 基板用洗浄具、基板洗浄装置、基板処理装置、基板処理方法および基板用洗浄具の製造方法
KR20220113493A (ko) * 2019-12-13 2022-08-12 가부시키가이샤 에바라 세이사꾸쇼 기판 세정 장치, 연마 장치, 버프 처리 장치, 기판 세정 방법, 기판 처리 장치, 및 기계 학습기
CN112420574B (zh) * 2020-11-25 2024-02-02 杭州众硅电子科技有限公司 一种可隔离防护晶圆的晶圆处理装置
JP7564693B2 (ja) 2020-11-26 2024-10-09 株式会社Ｓｃｒｅｅｎホールディングス 下面ブラシ、ブラシユニットおよび基板洗浄装置
JP7672908B2 (ja) * 2021-07-28 2025-05-08 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄装置および基板洗浄方法
US20230178360A1 (en) * 2021-12-06 2023-06-08 Tung An Development Ltd. Device Having Cleaning Bodies
EP4630231A1 (en) * 2022-12-07 2025-10-15 Tcnv, Llc Cylindrical brush and method of manufacture

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5846335A (en) * 1994-06-28 1998-12-08 Ebara Corporation Method for cleaning workpiece
US5966765A (en) * 1996-10-21 1999-10-19 Ebara Corporation Cleaning apparatus
JP2000270929A (ja) * 1999-03-26 2000-10-03 Shibaura Mechatronics Corp 洗浄用ブラシ
JP2000311878A (ja) * 1999-04-27 2000-11-07 Dainippon Screen Mfg Co Ltd 基板洗浄装置
US20030061675A1 (en) * 2001-10-03 2003-04-03 Applied Materials. Inc Scrubber with sonic nozzle
CN1872546A (zh) * 2005-05-26 2006-12-06 日东电工株式会社 清洁片及使用该清洁片的清洁方法
US20130255721A1 (en) * 2012-04-03 2013-10-03 Illinois Tool Works Inc. Concave nodule sponge brush

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2480023A (en) * 1948-05-28 1949-08-23 Knickerbocker Rubber Company Massage brush
US3583555A (en) * 1969-01-31 1971-06-08 George E Karsnak Cleaning apparatus for conveyor belts or the like
US4217737A (en) * 1979-04-16 1980-08-19 Merit Abrasive Products, Inc. Abrasive flap drum
JP3114156B2 (ja) * 1994-06-28 2000-12-04 株式会社荏原製作所 洗浄方法および装置
JPH08141521A (ja) 1994-11-24 1996-06-04 Sumitomo Metal Ind Ltd 洗浄装置
US5779526A (en) * 1996-02-27 1998-07-14 Gill; Gerald L. Pad conditioner
EP0937509A4 (en) 1996-11-08 2005-01-19 Aion Co Ltd SPONGE ROLLER TO CLEAN
US6502273B1 (en) * 1996-11-08 2003-01-07 Kanebo, Ltd. Cleaning sponge roller
TW358764B (en) * 1997-07-07 1999-05-21 Super Silicon Crystal Res Inst A method of double-side lapping a wafer and an apparatus therefor
US6202658B1 (en) * 1998-11-11 2001-03-20 Applied Materials, Inc. Method and apparatus for cleaning the edge of a thin disc
JP4091187B2 (ja) * 1998-12-08 2008-05-28 株式会社荏原製作所 洗浄具、基板洗浄装置及び基板洗浄方法
KR100613919B1 (ko) * 1999-07-26 2006-08-18 동경 엘렉트론 주식회사 기판세정구, 기판세정장치 및 기판세정방법
US6406358B1 (en) * 1999-08-05 2002-06-18 Micron Technology, Inc. Method and apparatus for cleaning a surface of a microelectronic substrate
US6467120B1 (en) * 1999-09-08 2002-10-22 International Business Machines Corporation Wafer cleaning brush profile modification
US6367613B1 (en) * 2000-04-28 2002-04-09 Preston D. Montgomery Belt cleaning sprocket
JP2004273530A (ja) * 2003-03-05 2004-09-30 Nec Kyushu Ltd 洗浄装置およびその方法
EP1680260B1 (en) * 2003-08-08 2014-04-30 Entegris, Inc. Methods and materials for making a monolithic porous pad cast onto a rotatable base
JP2007000860A (ja) * 2005-05-26 2007-01-11 Nitto Denko Corp 清浄用シート及びそれを用いた清浄方法
CN100449704C (zh) * 2006-08-11 2009-01-07 中芯国际集成电路制造(上海)有限公司 研磨头的清洗装置
KR101155623B1 (ko) * 2010-01-08 2012-06-13 세메스 주식회사 기판 세정 유닛 및 이를 갖는 기판 세정 장치
TW201318779A (zh) * 2011-09-26 2013-05-16 Entegris Inc 清潔基板之刷具
US9202723B2 (en) * 2011-11-29 2015-12-01 Illinois Tool Works, Inc. Brush with cantilevered nodules
JP6352158B2 (ja) * 2014-11-20 2018-07-04 株式会社荏原製作所 洗浄具、洗浄具の製造方法、および、基板洗浄装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5846335A (en) * 1994-06-28 1998-12-08 Ebara Corporation Method for cleaning workpiece
US5966765A (en) * 1996-10-21 1999-10-19 Ebara Corporation Cleaning apparatus
JP2000270929A (ja) * 1999-03-26 2000-10-03 Shibaura Mechatronics Corp 洗浄用ブラシ
JP2000311878A (ja) * 1999-04-27 2000-11-07 Dainippon Screen Mfg Co Ltd 基板洗浄装置
US20030061675A1 (en) * 2001-10-03 2003-04-03 Applied Materials. Inc Scrubber with sonic nozzle
CN1872546A (zh) * 2005-05-26 2006-12-06 日东电工株式会社 清洁片及使用该清洁片的清洁方法
US20130255721A1 (en) * 2012-04-03 2013-10-03 Illinois Tool Works Inc. Concave nodule sponge brush

Also Published As

Publication number Publication date
US11642704B2 (en) 2023-05-09
TW201615340A (zh) 2016-05-01
TWI678260B (zh) 2019-12-01
CN105575851A (zh) 2016-05-11
MY178652A (en) 2020-10-20
KR20160052343A (ko) 2016-05-12
CN113276024B (zh) 2023-08-29
US20160126113A1 (en) 2016-05-05
KR102443489B1 (ko) 2022-09-15
JP6316730B2 (ja) 2018-04-25
TW201906689A (zh) 2019-02-16
SG10201508996WA (en) 2016-05-30
US10471481B2 (en) 2019-11-12
US20200030855A1 (en) 2020-01-30
CN113276024A (zh) 2021-08-20
JP2016092158A (ja) 2016-05-23
TWI670141B (zh) 2019-09-01

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