TWI670141B - 滾筒構件、以及基板洗淨方法 - Google Patents

滾筒構件、以及基板洗淨方法 Download PDF

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Publication number
TWI670141B
TWI670141B TW104131754A TW104131754A TWI670141B TW I670141 B TWI670141 B TW I670141B TW 104131754 A TW104131754 A TW 104131754A TW 104131754 A TW104131754 A TW 104131754A TW I670141 B TWI670141 B TW I670141B
Authority
TW
Taiwan
Prior art keywords
substrate
cleaning
roller member
protrusion
pencil
Prior art date
Application number
TW104131754A
Other languages
English (en)
Chinese (zh)
Other versions
TW201615340A (zh
Inventor
石橋知淳
Original Assignee
日商荏原製作所股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商荏原製作所股份有限公司 filed Critical 日商荏原製作所股份有限公司
Publication of TW201615340A publication Critical patent/TW201615340A/zh
Application granted granted Critical
Publication of TWI670141B publication Critical patent/TWI670141B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning In General (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW104131754A 2014-10-31 2015-09-25 滾筒構件、以及基板洗淨方法 TWI670141B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014-223754 2014-10-31
JP2014223754A JP6316730B2 (ja) 2014-10-31 2014-10-31 ロール部材、ペンシル部材、及びそれらの少なくともいずれか一方を含む基板処理装置

Publications (2)

Publication Number Publication Date
TW201615340A TW201615340A (zh) 2016-05-01
TWI670141B true TWI670141B (zh) 2019-09-01

Family

ID=55853472

Family Applications (2)

Application Number Title Priority Date Filing Date
TW107140682A TWI678260B (zh) 2014-10-31 2015-09-25 滾筒構件、鉛筆構件、以及包含前述二者至少任一方之基板處理裝置
TW104131754A TWI670141B (zh) 2014-10-31 2015-09-25 滾筒構件、以及基板洗淨方法

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW107140682A TWI678260B (zh) 2014-10-31 2015-09-25 滾筒構件、鉛筆構件、以及包含前述二者至少任一方之基板處理裝置

Country Status (7)

Country Link
US (2) US10471481B2 (enExample)
JP (1) JP6316730B2 (enExample)
KR (1) KR102443489B1 (enExample)
CN (2) CN105575851B (enExample)
MY (1) MY178652A (enExample)
SG (1) SG10201508996WA (enExample)
TW (2) TWI678260B (enExample)

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* Cited by examiner, † Cited by third party
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JP6956578B2 (ja) * 2017-09-19 2021-11-02 株式会社荏原製作所 ブレークイン装置及びブレークインシステム
JP7224128B2 (ja) * 2018-08-09 2023-02-17 株式会社荏原製作所 基板用洗浄具、基板洗浄装置、基板処理装置、基板処理方法および基板用洗浄具の製造方法
US12485516B2 (en) 2019-12-13 2025-12-02 Ebara Corporation Substrate cleaning apparatus, polishing apparatus, buffing apparatus, substrate cleaning method, substrate processing apparatus, and machine learning apparatus
CN112420574B (zh) * 2020-11-25 2024-02-02 杭州众硅电子科技有限公司 一种可隔离防护晶圆的晶圆处理装置
JP7564693B2 (ja) * 2020-11-26 2024-10-09 株式会社Ｓｃｒｅｅｎホールディングス 下面ブラシ、ブラシユニットおよび基板洗浄装置
JP7672908B2 (ja) * 2021-07-28 2025-05-08 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄装置および基板洗浄方法
US20230178360A1 (en) * 2021-12-06 2023-06-08 Tung An Development Ltd. Device Having Cleaning Bodies
IL321257A (en) * 2022-12-07 2025-08-01 Tcnv Llc Cylindrical brush and method of manufacture

Citations (1)

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TW200704479A (en) * 2005-05-26 2007-02-01 Nitto Denko Corp Cleaning sheet and cleaning method using same

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JP3114156B2 (ja) * 1994-06-28 2000-12-04 株式会社荏原製作所 洗浄方法および装置
JPH08141521A (ja) 1994-11-24 1996-06-04 Sumitomo Metal Ind Ltd 洗浄装置
US5779526A (en) * 1996-02-27 1998-07-14 Gill; Gerald L. Pad conditioner
DE69737926T2 (de) * 1996-10-21 2008-04-10 Ebara Corp. Reinigungsvorrichtung
JP3378015B2 (ja) 1996-11-08 2003-02-17 アイオン株式会社 洗浄用スポンジローラ
US6502273B1 (en) * 1996-11-08 2003-01-07 Kanebo, Ltd. Cleaning sponge roller
TW358764B (en) * 1997-07-07 1999-05-21 Super Silicon Crystal Res Inst A method of double-side lapping a wafer and an apparatus therefor
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JP4091187B2 (ja) * 1998-12-08 2008-05-28 株式会社荏原製作所 洗浄具、基板洗浄装置及び基板洗浄方法
JP2000270929A (ja) * 1999-03-26 2000-10-03 Shibaura Mechatronics Corp 洗浄用ブラシ
JP2000311878A (ja) * 1999-04-27 2000-11-07 Dainippon Screen Mfg Co Ltd 基板洗浄装置
KR100613919B1 (ko) * 1999-07-26 2006-08-18 동경 엘렉트론 주식회사 기판세정구, 기판세정장치 및 기판세정방법
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KR101155623B1 (ko) * 2010-01-08 2012-06-13 세메스 주식회사 기판 세정 유닛 및 이를 갖는 기판 세정 장치
TW201318779A (zh) * 2011-09-26 2013-05-16 Entegris Inc 清潔基板之刷具
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Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200704479A (en) * 2005-05-26 2007-02-01 Nitto Denko Corp Cleaning sheet and cleaning method using same

Also Published As

Publication number Publication date
KR102443489B1 (ko) 2022-09-15
TW201906689A (zh) 2019-02-16
JP2016092158A (ja) 2016-05-23
US11642704B2 (en) 2023-05-09
CN105575851B (zh) 2021-08-27
US20160126113A1 (en) 2016-05-05
CN113276024A (zh) 2021-08-20
TW201615340A (zh) 2016-05-01
KR20160052343A (ko) 2016-05-12
TWI678260B (zh) 2019-12-01
CN105575851A (zh) 2016-05-11
MY178652A (en) 2020-10-20
US20200030855A1 (en) 2020-01-30
US10471481B2 (en) 2019-11-12
CN113276024B (zh) 2023-08-29
JP6316730B2 (ja) 2018-04-25
SG10201508996WA (en) 2016-05-30

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