SG10201508996WA - Roll-Type Processing Member, Pencil-Type Processing Member, And Substrate Processing Apparatus Including Any One Of These - Google Patents

Roll-Type Processing Member, Pencil-Type Processing Member, And Substrate Processing Apparatus Including Any One Of These

Info

Publication number
SG10201508996WA
SG10201508996WA SG10201508996WA SG10201508996WA SG10201508996WA SG 10201508996W A SG10201508996W A SG 10201508996WA SG 10201508996W A SG10201508996W A SG 10201508996WA SG 10201508996W A SG10201508996W A SG 10201508996WA SG 10201508996W A SG10201508996W A SG 10201508996WA
Authority
SG
Singapore
Prior art keywords
processing member
type processing
pencil
roll
apparatus including
Prior art date
Application number
SG10201508996WA
Inventor
Tomoatsu Ishibashi
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10201508996WA publication Critical patent/SG10201508996WA/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04Cleaning involving contact with liquid
    • B08B3/10Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning In General (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
SG10201508996WA 2014-10-31 2015-10-30 Roll-Type Processing Member, Pencil-Type Processing Member, And Substrate Processing Apparatus Including Any One Of These SG10201508996WA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014223754A JP6316730B2 (en) 2014-10-31 2014-10-31 A substrate processing apparatus including a roll member, a pencil member, and at least one of them

Publications (1)

Publication Number Publication Date
SG10201508996WA true SG10201508996WA (en) 2016-05-30

Family

ID=55853472

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201508996WA SG10201508996WA (en) 2014-10-31 2015-10-30 Roll-Type Processing Member, Pencil-Type Processing Member, And Substrate Processing Apparatus Including Any One Of These

Country Status (7)

Country Link
US (2) US10471481B2 (en)
JP (1) JP6316730B2 (en)
KR (1) KR102443489B1 (en)
CN (2) CN113276024B (en)
MY (1) MY178652A (en)
SG (1) SG10201508996WA (en)
TW (2) TWI670141B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6956578B2 (en) * 2017-09-19 2021-11-02 株式会社荏原製作所 Break-in device and break-in system
JP7224128B2 (en) * 2018-08-09 2023-02-17 株式会社荏原製作所 Substrate cleaning tool, substrate cleaning apparatus, substrate processing apparatus, substrate processing method, and substrate cleaning tool manufacturing method
WO2021117685A1 (en) * 2019-12-13 2021-06-17 株式会社荏原製作所 Substrate cleaning device, polishing device, buffing device, substrate cleaning method, substrate processing device, and machine learning device
CN112420574B (en) * 2020-11-25 2024-02-02 杭州众硅电子科技有限公司 Wafer processing device capable of isolating protection wafer
JP2022084287A (en) * 2020-11-26 2022-06-07 株式会社Screenホールディングス Lower surface brush, brush base, and substrate cleaning device
US20230178360A1 (en) * 2021-12-06 2023-06-08 Tung An Development Ltd. Device Having Cleaning Bodies

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2480023A (en) * 1948-05-28 1949-08-23 Knickerbocker Rubber Company Massage brush
US3583555A (en) * 1969-01-31 1971-06-08 George E Karsnak Cleaning apparatus for conveyor belts or the like
US4217737A (en) * 1979-04-16 1980-08-19 Merit Abrasive Products, Inc. Abrasive flap drum
JP3114156B2 (en) * 1994-06-28 2000-12-04 株式会社荏原製作所 Cleaning method and apparatus
EP1080797A3 (en) * 1994-06-28 2005-10-05 Ebara Corporation Method and apparatus for cleaning workpiece
JPH08141521A (en) 1994-11-24 1996-06-04 Sumitomo Metal Ind Ltd Washing apparatus
US5779526A (en) * 1996-02-27 1998-07-14 Gill; Gerald L. Pad conditioner
EP0837493B8 (en) * 1996-10-21 2007-11-07 Ebara Corporation Cleaning apparatus
US6502273B1 (en) * 1996-11-08 2003-01-07 Kanebo, Ltd. Cleaning sponge roller
WO1998020987A1 (en) 1996-11-08 1998-05-22 Kanebo Limited Sponge roller for cleaning
TW358764B (en) * 1997-07-07 1999-05-21 Super Silicon Crystal Res Inst A method of double-side lapping a wafer and an apparatus therefor
US6202658B1 (en) * 1998-11-11 2001-03-20 Applied Materials, Inc. Method and apparatus for cleaning the edge of a thin disc
JP4091187B2 (en) * 1998-12-08 2008-05-28 株式会社荏原製作所 Cleaning tool, substrate cleaning apparatus and substrate cleaning method
JP2000270929A (en) * 1999-03-26 2000-10-03 Shibaura Mechatronics Corp Washing brush
JP2000311878A (en) * 1999-04-27 2000-11-07 Dainippon Screen Mfg Co Ltd Substrate cleaning device
KR100613919B1 (en) * 1999-07-26 2006-08-18 동경 엘렉트론 주식회사 Substrate cleaning tool, appa ratus, and method
US6406358B1 (en) * 1999-08-05 2002-06-18 Micron Technology, Inc. Method and apparatus for cleaning a surface of a microelectronic substrate
US6467120B1 (en) * 1999-09-08 2002-10-22 International Business Machines Corporation Wafer cleaning brush profile modification
US6367613B1 (en) * 2000-04-28 2002-04-09 Preston D. Montgomery Belt cleaning sprocket
US6904637B2 (en) * 2001-10-03 2005-06-14 Applied Materials, Inc. Scrubber with sonic nozzle
JP2004273530A (en) * 2003-03-05 2004-09-30 Nec Kyushu Ltd Washing device and method therefor
WO2005016599A1 (en) * 2003-08-08 2005-02-24 Mykrolys Corporation Methods and materials for making a monolithic porous pad cast onto a rotatable base
CN1872546A (en) * 2005-05-26 2006-12-06 日东电工株式会社 Cleaning sheet and cleaning method for a screen printing plate
JP2007000860A (en) * 2005-05-26 2007-01-11 Nitto Denko Corp Cleaning sheet and cleaning method using the same
CN100449704C (en) * 2006-08-11 2009-01-07 中芯国际集成电路制造(上海)有限公司 Device for cleaning grinding head
KR101155623B1 (en) * 2010-01-08 2012-06-13 세메스 주식회사 Cleaning unit of substrate and apparatus for cleaning a substrate having the same
WO2013049207A2 (en) * 2011-09-26 2013-04-04 Entegris, Inc. Post-cmp cleaning apparatus and method
US9202723B2 (en) * 2011-11-29 2015-12-01 Illinois Tool Works, Inc. Brush with cantilevered nodules
US20130255721A1 (en) * 2012-04-03 2013-10-03 Illinois Tool Works Inc. Concave nodule sponge brush
JP6352158B2 (en) * 2014-11-20 2018-07-04 株式会社荏原製作所 Cleaning tool, manufacturing method of cleaning tool, and substrate cleaning apparatus

Also Published As

Publication number Publication date
JP6316730B2 (en) 2018-04-25
US10471481B2 (en) 2019-11-12
JP2016092158A (en) 2016-05-23
CN113276024A (en) 2021-08-20
US11642704B2 (en) 2023-05-09
TWI670141B (en) 2019-09-01
KR102443489B1 (en) 2022-09-15
TW201906689A (en) 2019-02-16
CN105575851B (en) 2021-08-27
TW201615340A (en) 2016-05-01
US20160126113A1 (en) 2016-05-05
MY178652A (en) 2020-10-20
CN113276024B (en) 2023-08-29
US20200030855A1 (en) 2020-01-30
CN105575851A (en) 2016-05-11
KR20160052343A (en) 2016-05-12
TWI678260B (en) 2019-12-01

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