SG11201606429YA - Bearing device and plasma processing apparatus - Google Patents
Bearing device and plasma processing apparatusInfo
- Publication number
- SG11201606429YA SG11201606429YA SG11201606429YA SG11201606429YA SG11201606429YA SG 11201606429Y A SG11201606429Y A SG 11201606429YA SG 11201606429Y A SG11201606429Y A SG 11201606429YA SG 11201606429Y A SG11201606429Y A SG 11201606429YA SG 11201606429Y A SG11201606429Y A SG 11201606429YA
- Authority
- SG
- Singapore
- Prior art keywords
- processing apparatus
- plasma processing
- bearing device
- bearing
- plasma
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/20—Means for supporting or positioning the objects or the material; Means for adjusting diaphragms or lenses associated with the support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32623—Mechanical discharge control means
- H01J37/32633—Baffles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32733—Means for moving the material to be treated
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
- H01J2237/2007—Holding mechanisms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/332—Coating
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Analytical Chemistry (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Plasma Technology (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410061908.3A CN104862660B (en) | 2014-02-24 | 2014-02-24 | Bogey and plasma processing device |
PCT/CN2014/094359 WO2015124025A1 (en) | 2014-02-24 | 2014-12-19 | Bearing device and plasma processing apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201606429YA true SG11201606429YA (en) | 2016-09-29 |
Family
ID=53877619
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201606429YA SG11201606429YA (en) | 2014-02-24 | 2014-12-19 | Bearing device and plasma processing apparatus |
Country Status (5)
Country | Link |
---|---|
US (1) | US11282680B2 (en) |
KR (1) | KR101937283B1 (en) |
CN (1) | CN104862660B (en) |
SG (1) | SG11201606429YA (en) |
WO (1) | WO2015124025A1 (en) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107731650B (en) * | 2016-08-10 | 2019-11-29 | 北京北方华创微电子装备有限公司 | Reaction chamber and semiconductor processing equipment |
CN107227448B (en) | 2017-06-30 | 2023-10-13 | 北京北方华创微电子装备有限公司 | Susceptor and physical vapor deposition apparatus |
WO2019022707A1 (en) * | 2017-07-24 | 2019-01-31 | Lam Research Corporation | Moveable edge ring designs |
US20190259635A1 (en) * | 2018-02-17 | 2019-08-22 | Applied Materials, Inc. | Process kit for processing reduced sized substrates |
CN108321103A (en) * | 2018-03-12 | 2018-07-24 | 中国电子科技集团公司第十三研究所 | Wafer jig and inductively coupled plasma etching system |
CN110364473B (en) * | 2018-04-11 | 2021-09-10 | 中芯国际集成电路制造(上海)有限公司 | Bearing device and packaging method |
CN110137115B (en) * | 2019-05-27 | 2021-01-26 | 北京半导体专用设备研究所(中国电子科技集团公司第四十五研究所) | Anti-drop device and wafer cleaning equipment |
CN110055508B (en) * | 2019-05-30 | 2021-11-23 | 武汉华星光电技术有限公司 | Base plate fixing device |
TWI721463B (en) * | 2019-06-21 | 2021-03-11 | 日月光半導體製造股份有限公司 | A ring-shaped object and a wafer clamping module |
TWM602283U (en) * | 2019-08-05 | 2020-10-01 | 美商蘭姆研究公司 | Edge ring with lift pin grooves for a substrate processing system |
KR102363678B1 (en) * | 2019-10-01 | 2022-02-17 | 피에스케이홀딩스 (주) | Substrate processing apparatus and substrate processing method |
CN111235535B (en) * | 2020-01-22 | 2021-11-16 | 北京北方华创微电子装备有限公司 | Process assembly of sputtering reaction chamber and sputtering reaction chamber thereof |
CN111863695A (en) * | 2020-07-31 | 2020-10-30 | 上海华力微电子有限公司 | Electrostatic chuck device and dry etching machine |
US20220049350A1 (en) * | 2020-08-13 | 2022-02-17 | Applied Materials, Inc. | Apparatus design for photoresist deposition |
CN213951334U (en) * | 2020-10-26 | 2021-08-13 | 北京北方华创微电子装备有限公司 | Wafer bearing mechanism and semiconductor process equipment |
US20220157572A1 (en) * | 2020-11-18 | 2022-05-19 | Applied Materials, Inc. | Deposition ring for thin substrate handling via edge clamping |
US11996315B2 (en) * | 2020-11-18 | 2024-05-28 | Applied Materials, Inc. | Thin substrate handling via edge clamping |
US20220178021A1 (en) * | 2020-12-08 | 2022-06-09 | Skytech Co., Ltd. | Wafer fixing mechanism and wafer pre-cleaning machine using the wafer fixing mechanism |
JP2024516149A (en) * | 2021-04-21 | 2024-04-12 | ラム リサーチ コーポレーション | Prevents backside deposition on substrate |
CN113327885B (en) * | 2021-05-26 | 2024-05-17 | 北京北方华创微电子装备有限公司 | Semiconductor process equipment and compression ring loading and unloading method |
CN115642112A (en) * | 2022-11-24 | 2023-01-24 | 西安奕斯伟材料科技有限公司 | Back sealing device and method for silicon wafer |
CN116752112B (en) * | 2023-08-17 | 2023-11-10 | 上海陛通半导体能源科技股份有限公司 | Radio frequency magnetron sputtering equipment |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5262029A (en) * | 1988-05-23 | 1993-11-16 | Lam Research | Method and system for clamping semiconductor wafers |
US5660699A (en) * | 1995-02-20 | 1997-08-26 | Kao Corporation | Electroplating apparatus |
US5922133A (en) * | 1997-09-12 | 1999-07-13 | Applied Materials, Inc. | Multiple edge deposition exclusion rings |
US6296712B1 (en) * | 1997-12-02 | 2001-10-02 | Applied Materials, Inc. | Chemical vapor deposition hardware and process |
JP4297609B2 (en) * | 1997-12-23 | 2009-07-15 | オー・ツェー・エリコン・バルザース・アクチェンゲゼルシャフト | Holding device |
US6096135A (en) * | 1998-07-21 | 2000-08-01 | Applied Materials, Inc. | Method and apparatus for reducing contamination of a substrate in a substrate processing system |
EP1006562A3 (en) * | 1998-12-01 | 2005-01-19 | Greene, Tweed Of Delaware, Inc. | Two-piece clamp ring for holding semiconductor wafer or other workpiece |
US6355108B1 (en) * | 1999-06-22 | 2002-03-12 | Applied Komatsu Technology, Inc. | Film deposition using a finger type shadow frame |
JP4405048B2 (en) * | 2000-07-11 | 2010-01-27 | Okiセミコンダクタ株式会社 | Alignment jig |
US6550484B1 (en) * | 2001-12-07 | 2003-04-22 | Novellus Systems, Inc. | Apparatus for maintaining wafer back side and edge exclusion during supercritical fluid processing |
US7927424B2 (en) * | 2002-04-22 | 2011-04-19 | Stmicroelectronics, Inc. | Padded clamp ring with edge exclusion for deposition of thick AlCu/AlSiCu/Cu metal alloy layers |
US7244336B2 (en) * | 2003-12-17 | 2007-07-17 | Lam Research Corporation | Temperature controlled hot edge ring assembly for reducing plasma reactor etch rate drift |
US7670436B2 (en) * | 2004-11-03 | 2010-03-02 | Applied Materials, Inc. | Support ring assembly |
US20070012558A1 (en) * | 2005-07-13 | 2007-01-18 | Applied Materials, Inc. | Magnetron sputtering system for large-area substrates |
US20070283884A1 (en) * | 2006-05-30 | 2007-12-13 | Applied Materials, Inc. | Ring assembly for substrate processing chamber |
JP2008305736A (en) * | 2007-06-11 | 2008-12-18 | Tokyo Electron Ltd | Plasma processing apparatus, method for using plasma processing apparatus, and method for cleaning plasma processing apparatus |
JP2011518428A (en) * | 2008-03-25 | 2011-06-23 | オー・ツェー・エリコン・バルザース・アクチェンゲゼルシャフト | Processing chamber |
US9123511B2 (en) * | 2008-05-02 | 2015-09-01 | Applied Materials, Inc. | Process kit for RF physical vapor deposition |
JP2009290087A (en) * | 2008-05-30 | 2009-12-10 | Tokyo Electron Ltd | Focus ring, and plasma processing apparatus |
WO2010101191A1 (en) * | 2009-03-03 | 2010-09-10 | 東京エレクトロン株式会社 | Placing table structure, film forming apparatus, and raw material recovery method |
KR101559913B1 (en) * | 2009-06-25 | 2015-10-27 | 삼성전자주식회사 | Plasma dry etching apparatus |
-
2014
- 2014-02-24 CN CN201410061908.3A patent/CN104862660B/en active Active
- 2014-12-19 KR KR1020167024430A patent/KR101937283B1/en active IP Right Grant
- 2014-12-19 WO PCT/CN2014/094359 patent/WO2015124025A1/en active Application Filing
- 2014-12-19 US US15/119,658 patent/US11282680B2/en active Active
- 2014-12-19 SG SG11201606429YA patent/SG11201606429YA/en unknown
Also Published As
Publication number | Publication date |
---|---|
US11282680B2 (en) | 2022-03-22 |
CN104862660B (en) | 2017-10-13 |
WO2015124025A1 (en) | 2015-08-27 |
CN104862660A (en) | 2015-08-26 |
KR20160119156A (en) | 2016-10-12 |
US20170011892A1 (en) | 2017-01-12 |
KR101937283B1 (en) | 2019-01-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
SG11201606429YA (en) | Bearing device and plasma processing apparatus | |
GB2558842B (en) | Processing apparatus and methods | |
IL249335A0 (en) | Material processing methods and related apparatus | |
SG11201704323XA (en) | Wafer processing device and method therefor | |
SG11201601305WA (en) | Image processing apparatus and image processing method | |
GB2533553B (en) | Image processing method and apparatus | |
HK1219315A1 (en) | Method for processing application and device thereof | |
SG10201508119XA (en) | Substrate processing apparatus and processing method | |
SG11201609143TA (en) | Plasma processing method and plasma processing apparatus | |
EP2945384A4 (en) | Image processing device and image processing method | |
HK1216560A1 (en) | Picture processing method and apparatus | |
SG11201702039YA (en) | Bearing apparatus and semiconductor processing device | |
EP3117949A4 (en) | Processing device and processing method | |
SG11201702404XA (en) | Plasma processing method and plasma processing apparatus | |
HK1211123A1 (en) | Business processing method and device thereof | |
EP2960010A4 (en) | Processing apparatus and burr removal device | |
EP3190830A4 (en) | Service processing method and device | |
SG10201504537YA (en) | Processing apparatus | |
SG10201505187TA (en) | Processing apparatus | |
EP3091708A4 (en) | Processing rule modification method, device and apparatus | |
HK1213353A1 (en) | Image processing method and device | |
GB2533597B (en) | Material processing apparatus and method | |
HK1221310A1 (en) | Method and device for processing java application java | |
GB201400779D0 (en) | Gas-treatment devices and apparatus | |
SI3028776T1 (en) | Delivery processing apparatus and delivery processing method |