MY178652A - Roll-type processing member, pencil-type processing member, and substrate processing apparatus including any one of these - Google Patents

Roll-type processing member, pencil-type processing member, and substrate processing apparatus including any one of these

Info

Publication number
MY178652A
MY178652A MYPI2015002682A MYPI2015002682A MY178652A MY 178652 A MY178652 A MY 178652A MY PI2015002682 A MYPI2015002682 A MY PI2015002682A MY PI2015002682 A MYPI2015002682 A MY PI2015002682A MY 178652 A MY178652 A MY 178652A
Authority
MY
Malaysia
Prior art keywords
roll
processing member
type processing
type
pencil
Prior art date
Application number
MYPI2015002682A
Other languages
English (en)
Inventor
Ishibashi Tomoatsu
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of MY178652A publication Critical patent/MY178652A/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04Cleaning involving contact with liquid
    • B08B3/10Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning In General (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
MYPI2015002682A 2014-10-31 2015-10-30 Roll-type processing member, pencil-type processing member, and substrate processing apparatus including any one of these MY178652A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014223754A JP6316730B2 (ja) 2014-10-31 2014-10-31 ロール部材、ペンシル部材、及びそれらの少なくともいずれか一方を含む基板処理装置

Publications (1)

Publication Number Publication Date
MY178652A true MY178652A (en) 2020-10-20

Family

ID=55853472

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2015002682A MY178652A (en) 2014-10-31 2015-10-30 Roll-type processing member, pencil-type processing member, and substrate processing apparatus including any one of these

Country Status (7)

Country Link
US (2) US10471481B2 (enExample)
JP (1) JP6316730B2 (enExample)
KR (1) KR102443489B1 (enExample)
CN (2) CN105575851B (enExample)
MY (1) MY178652A (enExample)
SG (1) SG10201508996WA (enExample)
TW (2) TWI678260B (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6956578B2 (ja) * 2017-09-19 2021-11-02 株式会社荏原製作所 ブレークイン装置及びブレークインシステム
JP7224128B2 (ja) * 2018-08-09 2023-02-17 株式会社荏原製作所 基板用洗浄具、基板洗浄装置、基板処理装置、基板処理方法および基板用洗浄具の製造方法
JP7536039B2 (ja) * 2019-12-13 2024-08-19 株式会社荏原製作所 基板洗浄装置、研磨装置、バフ処理装置、基板洗浄方法、基板処理装置、および機械学習器
CN112420574B (zh) * 2020-11-25 2024-02-02 杭州众硅电子科技有限公司 一种可隔离防护晶圆的晶圆处理装置
JP7564693B2 (ja) 2020-11-26 2024-10-09 株式会社Screenホールディングス 下面ブラシ、ブラシユニットおよび基板洗浄装置
JP7672908B2 (ja) * 2021-07-28 2025-05-08 株式会社Screenホールディングス 基板洗浄装置および基板洗浄方法
US20230178360A1 (en) * 2021-12-06 2023-06-08 Tung An Development Ltd. Device Having Cleaning Bodies
WO2024124074A1 (en) * 2022-12-07 2024-06-13 Tech Core Pva, Llc Cylindrical brush and method of manufacture

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2480023A (en) * 1948-05-28 1949-08-23 Knickerbocker Rubber Company Massage brush
US3583555A (en) * 1969-01-31 1971-06-08 George E Karsnak Cleaning apparatus for conveyor belts or the like
US4217737A (en) * 1979-04-16 1980-08-19 Merit Abrasive Products, Inc. Abrasive flap drum
JP3114156B2 (ja) * 1994-06-28 2000-12-04 株式会社荏原製作所 洗浄方法および装置
DE69522617T2 (de) * 1994-06-28 2002-07-04 Ebara Corp., Tokio/Tokyo Verfahren und Vorrichtung zum Reinigen von Werkstücken
JPH08141521A (ja) 1994-11-24 1996-06-04 Sumitomo Metal Ind Ltd 洗浄装置
US5779526A (en) * 1996-02-27 1998-07-14 Gill; Gerald L. Pad conditioner
EP0837493B8 (en) * 1996-10-21 2007-11-07 Ebara Corporation Cleaning apparatus
EP0937509A4 (en) 1996-11-08 2005-01-19 Aion Co Ltd SPONGE ROLLER TO CLEAN
US6502273B1 (en) * 1996-11-08 2003-01-07 Kanebo, Ltd. Cleaning sponge roller
TW358764B (en) * 1997-07-07 1999-05-21 Super Silicon Crystal Res Inst A method of double-side lapping a wafer and an apparatus therefor
US6202658B1 (en) * 1998-11-11 2001-03-20 Applied Materials, Inc. Method and apparatus for cleaning the edge of a thin disc
JP4091187B2 (ja) * 1998-12-08 2008-05-28 株式会社荏原製作所 洗浄具、基板洗浄装置及び基板洗浄方法
JP2000270929A (ja) * 1999-03-26 2000-10-03 Shibaura Mechatronics Corp 洗浄用ブラシ
JP2000311878A (ja) * 1999-04-27 2000-11-07 Dainippon Screen Mfg Co Ltd 基板洗浄装置
KR100613919B1 (ko) * 1999-07-26 2006-08-18 동경 엘렉트론 주식회사 기판세정구, 기판세정장치 및 기판세정방법
US6406358B1 (en) * 1999-08-05 2002-06-18 Micron Technology, Inc. Method and apparatus for cleaning a surface of a microelectronic substrate
US6467120B1 (en) * 1999-09-08 2002-10-22 International Business Machines Corporation Wafer cleaning brush profile modification
US6367613B1 (en) * 2000-04-28 2002-04-09 Preston D. Montgomery Belt cleaning sprocket
US6904637B2 (en) * 2001-10-03 2005-06-14 Applied Materials, Inc. Scrubber with sonic nozzle
JP2004273530A (ja) * 2003-03-05 2004-09-30 Nec Kyushu Ltd 洗浄装置およびその方法
KR101158137B1 (ko) * 2003-08-08 2012-06-19 엔테그리스, 아이엔씨. 회전식 기부 상에 주조된 일체형 다공성 패드를 제조하기위한 방법 및 재료
CN1872546A (zh) * 2005-05-26 2006-12-06 日东电工株式会社 清洁片及使用该清洁片的清洁方法
JP2007000860A (ja) * 2005-05-26 2007-01-11 Nitto Denko Corp 清浄用シート及びそれを用いた清浄方法
CN100449704C (zh) * 2006-08-11 2009-01-07 中芯国际集成电路制造(上海)有限公司 研磨头的清洗装置
KR101155623B1 (ko) * 2010-01-08 2012-06-13 세메스 주식회사 기판 세정 유닛 및 이를 갖는 기판 세정 장치
JP2014534615A (ja) * 2011-09-26 2014-12-18 インテグリス・インコーポレーテッド Cmp後クリーニング装置および方法
US9202723B2 (en) * 2011-11-29 2015-12-01 Illinois Tool Works, Inc. Brush with cantilevered nodules
US20130255721A1 (en) * 2012-04-03 2013-10-03 Illinois Tool Works Inc. Concave nodule sponge brush
JP6352158B2 (ja) * 2014-11-20 2018-07-04 株式会社荏原製作所 洗浄具、洗浄具の製造方法、および、基板洗浄装置

Also Published As

Publication number Publication date
JP2016092158A (ja) 2016-05-23
CN113276024B (zh) 2023-08-29
JP6316730B2 (ja) 2018-04-25
SG10201508996WA (en) 2016-05-30
US20200030855A1 (en) 2020-01-30
TW201615340A (zh) 2016-05-01
TW201906689A (zh) 2019-02-16
US11642704B2 (en) 2023-05-09
US10471481B2 (en) 2019-11-12
US20160126113A1 (en) 2016-05-05
TWI678260B (zh) 2019-12-01
KR102443489B1 (ko) 2022-09-15
KR20160052343A (ko) 2016-05-12
CN105575851A (zh) 2016-05-11
TWI670141B (zh) 2019-09-01
CN113276024A (zh) 2021-08-20
CN105575851B (zh) 2021-08-27

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