SG11202002299UA - Substrate processing device - Google Patents

Substrate processing device

Info

Publication number
SG11202002299UA
SG11202002299UA SG11202002299UA SG11202002299UA SG11202002299UA SG 11202002299U A SG11202002299U A SG 11202002299UA SG 11202002299U A SG11202002299U A SG 11202002299UA SG 11202002299U A SG11202002299U A SG 11202002299UA SG 11202002299U A SG11202002299U A SG 11202002299UA
Authority
SG
Singapore
Prior art keywords
processing device
substrate processing
substrate
processing
Prior art date
Application number
SG11202002299UA
Inventor
Koji Maeda
Mitsuhiko Inaba
Haiyang Xu
Tetsuya Yashima
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG11202002299UA publication Critical patent/SG11202002299UA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B15/00—Preventing escape of dirt or fumes from the area where they are produced; Collecting or removing dirt or fumes from that area
    • B08B15/002—Preventing escape of dirt or fumes from the area where they are produced; Collecting or removing dirt or fumes from that area using a central suction system, e.g. for collecting exhaust gases in workshops
    • B08B15/005—Preventing escape of dirt or fumes from the area where they are produced; Collecting or removing dirt or fumes from that area using a central suction system, e.g. for collecting exhaust gases in workshops comprising a stationary main duct with one or more branch units, the branch units being freely movable along a sealed longitudinal slit in the main duct
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
SG11202002299UA 2017-08-10 2018-08-09 Substrate processing device SG11202002299UA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017155213A JP6895341B2 (en) 2017-08-10 2017-08-10 Board processing equipment
PCT/JP2018/029961 WO2019031590A1 (en) 2017-08-10 2018-08-09 Substrate processing device

Publications (1)

Publication Number Publication Date
SG11202002299UA true SG11202002299UA (en) 2020-04-29

Family

ID=65271177

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202002299UA SG11202002299UA (en) 2017-08-10 2018-08-09 Substrate processing device

Country Status (5)

Country Link
US (1) US11869788B2 (en)
JP (1) JP6895341B2 (en)
CN (2) CN118213309A (en)
SG (1) SG11202002299UA (en)
WO (1) WO2019031590A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20240001407A1 (en) * 2020-11-11 2024-01-04 Ebara Corporation Transfer apparatus, cleaning module, and substrate processing apparatus
CN114990532B (en) * 2022-08-01 2022-11-25 江苏芯梦半导体设备有限公司 Full-automatic wafer loading and unloading system, loading and unloading method and chemical plating process system

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06163505A (en) * 1992-11-17 1994-06-10 Nippon Steel Corp Semiconductor substrate cleaning apparatus
JPH10284457A (en) * 1997-04-04 1998-10-23 Tokyo Electron Ltd Washing system
JPH11314703A (en) * 1998-04-30 1999-11-16 Ebara Corp Substrate storage device
JPH11330038A (en) * 1998-05-15 1999-11-30 Nisso Engineering Kk Chemical processing device for substrate and the like
JP4030654B2 (en) * 1998-06-02 2008-01-09 大日本スクリーン製造株式会社 Substrate transfer device
CN1141054C (en) 2001-08-28 2004-03-10 中国科学院地质与地球物理研究所 Pressure-sensitive wind-cooled mattress
JP4197103B2 (en) 2002-04-15 2008-12-17 株式会社荏原製作所 Polishing equipment
US7934513B2 (en) * 2003-10-08 2011-05-03 Semes Co., Ltd. Facility with multi-storied process chamber for cleaning substrates and method for cleaning substrates using the facility
WO2007099976A1 (en) * 2006-02-22 2007-09-07 Ebara Corporation Substrate treating device, substrate convey device, substrate grasping device, and chemical solution treating device
JP4767783B2 (en) 2006-07-26 2011-09-07 東京エレクトロン株式会社 Liquid processing equipment
JP2008042099A (en) * 2006-08-09 2008-02-21 Tokyo Seimitsu Co Ltd Cleaning device
US20080035181A1 (en) 2006-08-09 2008-02-14 Tokyo Seimitsu Co., Ltd. Cleaning apparatus
JP5744382B2 (en) 2008-07-24 2015-07-08 株式会社荏原製作所 Substrate processing apparatus and substrate processing method
US8795032B2 (en) 2008-06-04 2014-08-05 Ebara Corporation Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method
JP5474853B2 (en) * 2011-03-08 2014-04-16 東京エレクトロン株式会社 Liquid processing apparatus, liquid processing method, and recording medium on which a computer program for executing the liquid processing method is recorded
JP5673480B2 (en) * 2011-10-14 2015-02-18 東京エレクトロン株式会社 Substrate processing equipment
TWI653701B (en) * 2014-06-09 2019-03-11 日商荏原製作所股份有限公司 Substrate attaching and detaching portion for substrate holder, wet substrate processing device including the substrate attaching and detaching portion, substrate processing device, and substrate transfer method
CN205156576U (en) 2015-10-19 2016-04-13 深圳市沃特玛电池有限公司 Oven
JP2017103431A (en) * 2015-12-04 2017-06-08 株式会社荏原製作所 Exhaust device of substrate processing apparatus
CN205481036U (en) 2015-12-27 2016-08-17 杨峥雄 Circulation heat accumulating type combustion furnace (RTO) dashes and sweeps pipeline
JP6727044B2 (en) 2016-06-30 2020-07-22 株式会社荏原製作所 Substrate processing equipment
US10889438B2 (en) * 2017-02-07 2021-01-12 Murata Machinery, Ltd. Stocker

Also Published As

Publication number Publication date
CN111201596A (en) 2020-05-26
US11869788B2 (en) 2024-01-09
JP2019036573A (en) 2019-03-07
JP6895341B2 (en) 2021-06-30
CN118213309A (en) 2024-06-18
WO2019031590A1 (en) 2019-02-14
US20200388510A1 (en) 2020-12-10

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