KR102039240B9 - 기판 처리 장치 - Google Patents

기판 처리 장치

Info

Publication number
KR102039240B9
KR102039240B9 KR1020180001221A KR20180001221A KR102039240B9 KR 102039240 B9 KR102039240 B9 KR 102039240B9 KR 1020180001221 A KR1020180001221 A KR 1020180001221A KR 20180001221 A KR20180001221 A KR 20180001221A KR 102039240 B9 KR102039240 B9 KR 102039240B9
Authority
KR
South Korea
Prior art keywords
processing apparatus
substrate processing
substrate
processing
Prior art date
Application number
KR1020180001221A
Other languages
English (en)
Other versions
KR102039240B1 (ko
KR20180082959A (ko
Inventor
마사오 츠지
후미히코 이케다
Original Assignee
가부시키가이샤 스크린 홀딩스
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=62868883&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=KR102039240(B9) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 가부시키가이샤 스크린 홀딩스 filed Critical 가부시키가이샤 스크린 홀딩스
Publication of KR20180082959A publication Critical patent/KR20180082959A/ko
Application granted granted Critical
Publication of KR102039240B1 publication Critical patent/KR102039240B1/ko
Publication of KR102039240B9 publication Critical patent/KR102039240B9/ko

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
    • B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
    • B05B13/0221—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work characterised by the means for moving or conveying the objects or other work, e.g. conveyor belts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
KR1020180001221A 2017-01-11 2018-01-04 기판 처리 장치 KR102039240B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017002682A JP2018113327A (ja) 2017-01-11 2017-01-11 基板処理装置
JPJP-P-2017-002682 2017-01-11

Publications (3)

Publication Number Publication Date
KR20180082959A KR20180082959A (ko) 2018-07-19
KR102039240B1 KR102039240B1 (ko) 2019-10-31
KR102039240B9 true KR102039240B9 (ko) 2022-01-11

Family

ID=62868883

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020180001221A KR102039240B1 (ko) 2017-01-11 2018-01-04 기판 처리 장치

Country Status (4)

Country Link
JP (1) JP2018113327A (ko)
KR (1) KR102039240B1 (ko)
CN (1) CN108296073B (ko)
TW (1) TWI670788B (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6896008B2 (ja) * 2019-03-19 2021-06-30 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP6916833B2 (ja) * 2019-04-18 2021-08-11 株式会社Ｓｃｒｅｅｎホールディングス 塗布装置および塗布方法
KR102363678B1 (ko) * 2019-10-01 2022-02-17 피에스케이홀딩스 (주) 기판 처리 장치 및 기판 처리 방법
JP2021150351A (ja) * 2020-03-17 2021-09-27 東レエンジニアリング株式会社 基板浮上搬送装置
KR20230119343A (ko) 2022-02-07 2023-08-16 주식회사 케이씨엠텍 수평이동식 기판 처리시스템

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4363046B2 (ja) * 2003-01-24 2009-11-11 東レ株式会社 塗布装置および塗布方法並びにディスプレイ用部材の製造方法
JP4490797B2 (ja) * 2004-01-23 2010-06-30 大日本スクリーン製造株式会社 基板処理装置
JP3836119B2 (ja) * 2004-11-29 2006-10-18 東京応化工業株式会社 塗布装置
JP4407970B2 (ja) * 2006-11-28 2010-02-03 東京エレクトロン株式会社 基板処理装置及び基板処理方法
JP5199792B2 (ja) * 2008-08-28 2013-05-15 株式会社Ｓｏｋｕｄｏ 基板処理ユニット、基板処理装置および基板処理方法
JP5303231B2 (ja) * 2008-09-30 2013-10-02 東京応化工業株式会社 塗布装置
JP5346643B2 (ja) * 2009-03-27 2013-11-20 大日本スクリーン製造株式会社 基板塗布装置および基板塗布方法
JP5081261B2 (ja) * 2010-02-24 2012-11-28 東京エレクトロン株式会社 塗布装置
JP5600624B2 (ja) * 2011-03-22 2014-10-01 東京エレクトロン株式会社 塗布膜形成装置及び塗布膜形成方法
JP6023440B2 (ja) * 2012-03-12 2016-11-09 東レエンジニアリング株式会社 塗布装置
JP5919113B2 (ja) * 2012-07-04 2016-05-18 東京エレクトロン株式会社 塗布処理装置、塗布処理方法、プログラム及びコンピュータ記憶媒体
JP2014069124A (ja) * 2012-09-28 2014-04-21 Tokyo Ohka Kogyo Co Ltd 塗布装置及び塗布方法
KR20140084735A (ko) * 2012-12-27 2014-07-07 세메스 주식회사 기판 처리 장치 및 방법
CN103728779A (zh) * 2013-12-30 2014-04-16 深圳市华星光电技术有限公司 配向膜涂布方法及装置
JP6389089B2 (ja) * 2014-09-18 2018-09-12 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
US9905813B2 (en) * 2015-06-29 2018-02-27 Samsung Display Co., Ltd. Organic light-emitting display device, organic layer depositing apparatus, and method of manufacturing organic light-emitting display device using the organic layer depositing apparatus
CN106000705B (zh) * 2016-07-12 2018-11-06 河北大学 一种用于制备薄膜的全自动脉冲喷涂装置及喷涂方法

Also Published As

Publication number Publication date
KR102039240B1 (ko) 2019-10-31
CN108296073A (zh) 2018-07-20
JP2018113327A (ja) 2018-07-19
TWI670788B (zh) 2019-09-01
TW201842604A (zh) 2018-12-01
CN108296073B (zh) 2020-09-29
KR20180082959A (ko) 2018-07-19

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Legal Events

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E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
Z072 Maintenance of patent after cancellation proceedings: certified copy of decision transmitted [new post grant opposition system as of 20170301]
Z131 Decision taken on request for patent cancellation [new post grant opposition system as of 20170301]