KR102377848B1 - 기판 액처리 장치 - Google Patents

기판 액처리 장치 Download PDF

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Publication number
KR102377848B1
KR102377848B1 KR1020150113825A KR20150113825A KR102377848B1 KR 102377848 B1 KR102377848 B1 KR 102377848B1 KR 1020150113825 A KR1020150113825 A KR 1020150113825A KR 20150113825 A KR20150113825 A KR 20150113825A KR 102377848 B1 KR102377848 B1 KR 102377848B1
Authority
KR
South Korea
Prior art keywords
processing apparatus
liquid processing
substrate liquid
substrate
processing
Prior art date
Application number
KR1020150113825A
Other languages
English (en)
Other versions
KR20160025454A (ko
Inventor
겐토 구루스
유키요시 사이토
세이키 이시다
Original Assignee
도쿄엘렉트론가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20160025454A publication Critical patent/KR20160025454A/ko
Application granted granted Critical
Publication of KR102377848B1 publication Critical patent/KR102377848B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
KR1020150113825A 2014-08-27 2015-08-12 기판 액처리 장치 KR102377848B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2014172241 2014-08-27
JPJP-P-2014-172241 2014-08-27
JPJP-P-2015-072381 2015-03-31
JP2015072381A JP6359477B2 (ja) 2014-08-27 2015-03-31 基板液処理装置

Publications (2)

Publication Number Publication Date
KR20160025454A KR20160025454A (ko) 2016-03-08
KR102377848B1 true KR102377848B1 (ko) 2022-03-22

Family

ID=55403331

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150113825A KR102377848B1 (ko) 2014-08-27 2015-08-12 기판 액처리 장치

Country Status (4)

Country Link
US (1) US10290518B2 (ko)
JP (1) JP6359477B2 (ko)
KR (1) KR102377848B1 (ko)
TW (1) TWI629741B (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6953189B2 (ja) * 2016-06-13 2021-10-27 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
CN107768270B (zh) * 2016-08-16 2020-04-07 沈阳芯源微电子设备股份有限公司 一种防止反溅液体污染晶片的装置
JP6843606B2 (ja) * 2016-12-07 2021-03-17 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
JP6869093B2 (ja) 2017-04-27 2021-05-12 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置及び基板処理方法
JP6887912B2 (ja) * 2017-08-07 2021-06-16 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
KR102586053B1 (ko) * 2020-07-08 2023-10-10 세메스 주식회사 기판 처리 장치 및 방법
KR20230016859A (ko) * 2021-07-27 2023-02-03 삼성전자주식회사 기판 처리 장치 및 기판 처리 방법

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS505571B1 (ko) 1970-02-07 1975-03-05
JPH11297652A (ja) * 1998-04-14 1999-10-29 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2001191006A (ja) * 1999-10-26 2001-07-17 Tokyo Electron Ltd 液処理装置
JP4005335B2 (ja) * 2001-11-01 2007-11-07 住友精密工業株式会社 基板処理装置
JP2004265911A (ja) * 2003-02-03 2004-09-24 Personal Creation Ltd 基板の処理装置
JP4342324B2 (ja) * 2004-01-16 2009-10-14 大日本スクリーン製造株式会社 基板処理方法および基板処理装置
JP2005302746A (ja) * 2004-03-05 2005-10-27 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置
JP4446875B2 (ja) * 2004-06-14 2010-04-07 大日本スクリーン製造株式会社 基板処理装置
JP5005571B2 (ja) 2008-02-14 2012-08-22 東京エレクトロン株式会社 液処理装置
JP5743853B2 (ja) * 2010-12-28 2015-07-01 東京エレクトロン株式会社 液処理装置および液処理方法
KR102091291B1 (ko) * 2013-02-14 2020-03-19 가부시키가이샤 스크린 홀딩스 기판 처리 장치 및 기판 처리 방법
JP2014194965A (ja) * 2013-03-28 2014-10-09 Dainippon Screen Mfg Co Ltd 基板処理装置

Also Published As

Publication number Publication date
JP6359477B2 (ja) 2018-07-18
US20160064259A1 (en) 2016-03-03
KR20160025454A (ko) 2016-03-08
TW201624584A (zh) 2016-07-01
TWI629741B (zh) 2018-07-11
JP2016048775A (ja) 2016-04-07
US10290518B2 (en) 2019-05-14

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E701 Decision to grant or registration of patent right
GRNT Written decision to grant