KR102377315B1 - 기판 처리 장치 - Google Patents
기판 처리 장치 Download PDFInfo
- Publication number
- KR102377315B1 KR102377315B1 KR1020210043880A KR20210043880A KR102377315B1 KR 102377315 B1 KR102377315 B1 KR 102377315B1 KR 1020210043880 A KR1020210043880 A KR 1020210043880A KR 20210043880 A KR20210043880 A KR 20210043880A KR 102377315 B1 KR102377315 B1 KR 102377315B1
- Authority
- KR
- South Korea
- Prior art keywords
- treating apparatus
- substrate treating
- substrate
- treating
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/002—Processes for applying liquids or other fluent materials the substrate being rotated
- B05D1/005—Spin coating
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/3092—Recovery of material; Waste processing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67178—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C15/00—Enclosures for apparatus; Booths
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020220032620A KR20220038043A (ko) | 2015-11-13 | 2022-03-16 | 기판 처리 장치 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015223003A JP6503281B2 (ja) | 2015-11-13 | 2015-11-13 | 基板処理装置 |
JPJP-P-2015-223003 | 2015-11-13 | ||
KR1020190173015A KR20190143442A (ko) | 2015-11-13 | 2019-12-23 | 기판 처리 장치 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020190173015A Division KR20190143442A (ko) | 2015-11-13 | 2019-12-23 | 기판 처리 장치 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020220032620A Division KR20220038043A (ko) | 2015-11-13 | 2022-03-16 | 기판 처리 장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20210040021A KR20210040021A (ko) | 2021-04-12 |
KR102377315B1 true KR102377315B1 (ko) | 2022-03-22 |
Family
ID=58689838
Family Applications (5)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020160150288A KR101938041B1 (ko) | 2015-11-13 | 2016-11-11 | 기판 처리 장치 |
KR1020190000781A KR102061995B1 (ko) | 2015-11-13 | 2019-01-03 | 기판 처리 장치 |
KR1020190173015A KR20190143442A (ko) | 2015-11-13 | 2019-12-23 | 기판 처리 장치 |
KR1020210043880A KR102377315B1 (ko) | 2015-11-13 | 2021-04-05 | 기판 처리 장치 |
KR1020220032620A KR20220038043A (ko) | 2015-11-13 | 2022-03-16 | 기판 처리 장치 |
Family Applications Before (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020160150288A KR101938041B1 (ko) | 2015-11-13 | 2016-11-11 | 기판 처리 장치 |
KR1020190000781A KR102061995B1 (ko) | 2015-11-13 | 2019-01-03 | 기판 처리 장치 |
KR1020190173015A KR20190143442A (ko) | 2015-11-13 | 2019-12-23 | 기판 처리 장치 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020220032620A KR20220038043A (ko) | 2015-11-13 | 2022-03-16 | 기판 처리 장치 |
Country Status (4)
Country | Link |
---|---|
US (4) | US10170349B2 (ko) |
JP (1) | JP6503281B2 (ko) |
KR (5) | KR101938041B1 (ko) |
TW (3) | TWI674621B (ko) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6503281B2 (ja) * | 2015-11-13 | 2019-04-17 | 株式会社Screenホールディングス | 基板処理装置 |
JP6870944B2 (ja) * | 2016-09-26 | 2021-05-12 | 株式会社Screenホールディングス | 基板処理装置 |
JP7194690B2 (ja) * | 2017-03-31 | 2022-12-22 | アーケマ・インコーポレイテッド | ガラス容器コーティング用モジュール式フード |
JP7221594B2 (ja) | 2018-03-26 | 2023-02-14 | 株式会社Screenホールディングス | 基板処理装置 |
JP6986623B2 (ja) * | 2018-03-26 | 2021-12-22 | 東京エレクトロン株式会社 | 基板処理装置、空調方法及び記憶媒体 |
JP7183567B2 (ja) | 2018-05-02 | 2022-12-06 | Tdk株式会社 | 循環式efem |
US11047050B2 (en) * | 2018-10-30 | 2021-06-29 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor tool having controllable ambient environment processing zones |
JP7221110B2 (ja) * | 2019-03-28 | 2023-02-13 | 株式会社Screenホールディングス | 基板処理装置 |
US20210242039A1 (en) * | 2020-02-04 | 2021-08-05 | Tokyo Electron Limited | Substrate processing system and method to reduce a number of external connectors provided on the system |
KR20220097680A (ko) * | 2020-12-30 | 2022-07-08 | 세메스 주식회사 | 노즐 대기 포트와 이를 포함하는 기판 처리 장치 및 이를 이용한 노즐 세정 방법 |
JP2022124070A (ja) * | 2021-02-15 | 2022-08-25 | 株式会社Screenホールディングス | 基板処理装置、および、筒状ガードの加工方法 |
KR20230092188A (ko) * | 2021-12-17 | 2023-06-26 | 삼성전자주식회사 | 기판 처리 장치 및 방법 |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3239472B2 (ja) * | 1992-09-04 | 2001-12-17 | ソニー株式会社 | 洗浄装置の給排気制御方法及び被洗浄物の洗浄方法 |
TW353777B (en) | 1996-11-08 | 1999-03-01 | Tokyo Electron Ltd | Treatment device |
JPH11168135A (ja) * | 1997-12-03 | 1999-06-22 | Toshiba Corp | 基板保管装置および基板保管方法 |
TW511169B (en) * | 2000-02-01 | 2002-11-21 | Tokyo Electron Ltd | Substrate processing apparatus and substrate processing method |
JP2002147811A (ja) * | 2000-11-08 | 2002-05-22 | Sharp Corp | クリーンルーム |
JP2003100620A (ja) * | 2001-09-27 | 2003-04-04 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JP2003347186A (ja) | 2002-05-23 | 2003-12-05 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JP4494840B2 (ja) * | 2003-06-27 | 2010-06-30 | 大日本スクリーン製造株式会社 | 異物除去装置、基板処理装置および基板処理方法 |
JP4381909B2 (ja) * | 2004-07-06 | 2009-12-09 | 大日本スクリーン製造株式会社 | 基板処理装置および基板処理方法 |
JP4471865B2 (ja) * | 2005-02-18 | 2010-06-02 | 東京エレクトロン株式会社 | 液処理装置及びその方法 |
US8353986B2 (en) * | 2005-03-31 | 2013-01-15 | Tokyo Electron Limited | Substrate processing apparatus |
US20080173238A1 (en) * | 2006-12-12 | 2008-07-24 | Hitachi Kokusai Electric Inc. | Substrate processing apparatus, method of manufacturing semiconductor device, and reaction vessel |
JP5006122B2 (ja) | 2007-06-29 | 2012-08-22 | 株式会社Sokudo | 基板処理装置 |
KR100944949B1 (ko) | 2007-10-10 | 2010-03-03 | 세메스 주식회사 | 제어유닛 및 이를 구비하는 기판 처리 장치 |
JP5160204B2 (ja) | 2007-11-30 | 2013-03-13 | 株式会社Sokudo | 基板処理装置 |
JP5179170B2 (ja) | 2007-12-28 | 2013-04-10 | 株式会社Sokudo | 基板処理装置 |
JP2010087116A (ja) | 2008-09-30 | 2010-04-15 | Sokudo Co Ltd | 基板処理装置 |
JP5280141B2 (ja) * | 2008-09-30 | 2013-09-04 | 株式会社Sokudo | 基板処理装置 |
JP5654862B2 (ja) | 2010-04-12 | 2015-01-14 | 株式会社日立国際電気 | 半導体装置の製造方法、基板処理方法及び基板処理装置 |
JP5146526B2 (ja) | 2010-12-28 | 2013-02-20 | 東京エレクトロン株式会社 | 液処理装置 |
JP5569508B2 (ja) | 2011-01-05 | 2014-08-13 | 東京エレクトロン株式会社 | 基板処理装置 |
JP5666361B2 (ja) | 2011-03-29 | 2015-02-12 | 株式会社Screenセミコンダクターソリューションズ | 基板処理装置 |
JP5673480B2 (ja) | 2011-10-14 | 2015-02-18 | 東京エレクトロン株式会社 | 基板処理装置 |
JP6320762B2 (ja) | 2014-01-15 | 2018-05-09 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
JP6503281B2 (ja) * | 2015-11-13 | 2019-04-17 | 株式会社Screenホールディングス | 基板処理装置 |
-
2015
- 2015-11-13 JP JP2015223003A patent/JP6503281B2/ja active Active
-
2016
- 2016-11-08 US US15/346,063 patent/US10170349B2/en active Active
- 2016-11-11 KR KR1020160150288A patent/KR101938041B1/ko active IP Right Grant
- 2016-11-11 TW TW108107582A patent/TWI674621B/zh active
- 2016-11-11 TW TW105136806A patent/TWI664662B/zh active
- 2016-11-11 TW TW107122853A patent/TWI674619B/zh active
-
2018
- 2018-11-29 US US16/203,885 patent/US10879091B2/en active Active
-
2019
- 2019-01-03 KR KR1020190000781A patent/KR102061995B1/ko active IP Right Grant
- 2019-12-23 KR KR1020190173015A patent/KR20190143442A/ko active Application Filing
-
2020
- 2020-11-24 US US17/102,615 patent/US11373889B2/en active Active
-
2021
- 2021-04-05 KR KR1020210043880A patent/KR102377315B1/ko active IP Right Grant
-
2022
- 2022-03-16 KR KR1020220032620A patent/KR20220038043A/ko not_active Application Discontinuation
- 2022-05-19 US US17/748,712 patent/US20220277971A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
TWI674619B (zh) | 2019-10-11 |
JP2017092339A (ja) | 2017-05-25 |
US20210082721A1 (en) | 2021-03-18 |
KR20190143442A (ko) | 2019-12-30 |
TWI674621B (zh) | 2019-10-11 |
KR20210040021A (ko) | 2021-04-12 |
US10879091B2 (en) | 2020-12-29 |
US11373889B2 (en) | 2022-06-28 |
KR20190003854A (ko) | 2019-01-09 |
TWI664662B (zh) | 2019-07-01 |
TW201921441A (zh) | 2019-06-01 |
US20220277971A1 (en) | 2022-09-01 |
KR102061995B1 (ko) | 2020-01-02 |
US20190096719A1 (en) | 2019-03-28 |
JP6503281B2 (ja) | 2019-04-17 |
US10170349B2 (en) | 2019-01-01 |
KR20220038043A (ko) | 2022-03-25 |
US20170136489A1 (en) | 2017-05-18 |
TW201835976A (zh) | 2018-10-01 |
TW201719723A (zh) | 2017-06-01 |
KR101938041B1 (ko) | 2019-01-14 |
KR20170056459A (ko) | 2017-05-23 |
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Legal Events
Date | Code | Title | Description |
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E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
A107 | Divisional application of patent | ||
GRNT | Written decision to grant |