CN113276024B - 笔部件以及基板处理装置 - Google Patents

笔部件以及基板处理装置 Download PDF

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Publication number
CN113276024B
CN113276024B CN202110546709.1A CN202110546709A CN113276024B CN 113276024 B CN113276024 B CN 113276024B CN 202110546709 A CN202110546709 A CN 202110546709A CN 113276024 B CN113276024 B CN 113276024B
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CN
China
Prior art keywords
substrate
cleaning
pen
slit
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202110546709.1A
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English (en)
Chinese (zh)
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CN113276024A (zh
Inventor
石桥知淳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
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Ebara Corp
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Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to CN202110546709.1A priority Critical patent/CN113276024B/zh
Publication of CN113276024A publication Critical patent/CN113276024A/zh
Application granted granted Critical
Publication of CN113276024B publication Critical patent/CN113276024B/zh
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning In General (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
CN202110546709.1A 2014-10-31 2015-10-29 笔部件以及基板处理装置 Active CN113276024B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110546709.1A CN113276024B (zh) 2014-10-31 2015-10-29 笔部件以及基板处理装置

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2014-223754 2014-10-31
JP2014223754A JP6316730B2 (ja) 2014-10-31 2014-10-31 ロール部材、ペンシル部材、及びそれらの少なくともいずれか一方を含む基板処理装置
CN202110546709.1A CN113276024B (zh) 2014-10-31 2015-10-29 笔部件以及基板处理装置
CN201510724374.2A CN105575851B (zh) 2014-10-31 2015-10-29 辊部件以及基板处理装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201510724374.2A Division CN105575851B (zh) 2014-10-31 2015-10-29 辊部件以及基板处理装置

Publications (2)

Publication Number Publication Date
CN113276024A CN113276024A (zh) 2021-08-20
CN113276024B true CN113276024B (zh) 2023-08-29

Family

ID=55853472

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201510724374.2A Active CN105575851B (zh) 2014-10-31 2015-10-29 辊部件以及基板处理装置
CN202110546709.1A Active CN113276024B (zh) 2014-10-31 2015-10-29 笔部件以及基板处理装置

Family Applications Before (1)

Application Number Title Priority Date Filing Date
CN201510724374.2A Active CN105575851B (zh) 2014-10-31 2015-10-29 辊部件以及基板处理装置

Country Status (7)

Country Link
US (2) US10471481B2 (enExample)
JP (1) JP6316730B2 (enExample)
KR (1) KR102443489B1 (enExample)
CN (2) CN105575851B (enExample)
MY (1) MY178652A (enExample)
SG (1) SG10201508996WA (enExample)
TW (2) TWI678260B (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6956578B2 (ja) * 2017-09-19 2021-11-02 株式会社荏原製作所 ブレークイン装置及びブレークインシステム
JP7224128B2 (ja) * 2018-08-09 2023-02-17 株式会社荏原製作所 基板用洗浄具、基板洗浄装置、基板処理装置、基板処理方法および基板用洗浄具の製造方法
US12485516B2 (en) 2019-12-13 2025-12-02 Ebara Corporation Substrate cleaning apparatus, polishing apparatus, buffing apparatus, substrate cleaning method, substrate processing apparatus, and machine learning apparatus
CN112420574B (zh) * 2020-11-25 2024-02-02 杭州众硅电子科技有限公司 一种可隔离防护晶圆的晶圆处理装置
JP7564693B2 (ja) * 2020-11-26 2024-10-09 株式会社Ｓｃｒｅｅｎホールディングス 下面ブラシ、ブラシユニットおよび基板洗浄装置
JP7672908B2 (ja) * 2021-07-28 2025-05-08 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄装置および基板洗浄方法
US20230178360A1 (en) * 2021-12-06 2023-06-08 Tung An Development Ltd. Device Having Cleaning Bodies
IL321257A (en) * 2022-12-07 2025-08-01 Tcnv Llc Cylindrical brush and method of manufacture

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5846335A (en) * 1994-06-28 1998-12-08 Ebara Corporation Method for cleaning workpiece
JP2000311878A (ja) * 1999-04-27 2000-11-07 Dainippon Screen Mfg Co Ltd 基板洗浄装置
US6554010B1 (en) * 1999-07-26 2003-04-29 Tokyo Electron Limited Substrate cleaning tool, having permeable cleaning head
CN101121247A (zh) * 2006-08-11 2008-02-13 中芯国际集成电路制造(上海)有限公司 研磨头的清洗装置

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US2480023A (en) * 1948-05-28 1949-08-23 Knickerbocker Rubber Company Massage brush
US3583555A (en) * 1969-01-31 1971-06-08 George E Karsnak Cleaning apparatus for conveyor belts or the like
US4217737A (en) * 1979-04-16 1980-08-19 Merit Abrasive Products, Inc. Abrasive flap drum
JP3114156B2 (ja) * 1994-06-28 2000-12-04 株式会社荏原製作所 洗浄方法および装置
JPH08141521A (ja) 1994-11-24 1996-06-04 Sumitomo Metal Ind Ltd 洗浄装置
US5779526A (en) * 1996-02-27 1998-07-14 Gill; Gerald L. Pad conditioner
DE69737926T2 (de) * 1996-10-21 2008-04-10 Ebara Corp. Reinigungsvorrichtung
JP3378015B2 (ja) 1996-11-08 2003-02-17 アイオン株式会社 洗浄用スポンジローラ
US6502273B1 (en) * 1996-11-08 2003-01-07 Kanebo, Ltd. Cleaning sponge roller
TW358764B (en) * 1997-07-07 1999-05-21 Super Silicon Crystal Res Inst A method of double-side lapping a wafer and an apparatus therefor
US6202658B1 (en) * 1998-11-11 2001-03-20 Applied Materials, Inc. Method and apparatus for cleaning the edge of a thin disc
JP4091187B2 (ja) * 1998-12-08 2008-05-28 株式会社荏原製作所 洗浄具、基板洗浄装置及び基板洗浄方法
JP2000270929A (ja) * 1999-03-26 2000-10-03 Shibaura Mechatronics Corp 洗浄用ブラシ
US6406358B1 (en) * 1999-08-05 2002-06-18 Micron Technology, Inc. Method and apparatus for cleaning a surface of a microelectronic substrate
US6467120B1 (en) * 1999-09-08 2002-10-22 International Business Machines Corporation Wafer cleaning brush profile modification
US6367613B1 (en) * 2000-04-28 2002-04-09 Preston D. Montgomery Belt cleaning sprocket
US6904637B2 (en) * 2001-10-03 2005-06-14 Applied Materials, Inc. Scrubber with sonic nozzle
JP2004273530A (ja) * 2003-03-05 2004-09-30 Nec Kyushu Ltd 洗浄装置およびその方法
US7984526B2 (en) * 2003-08-08 2011-07-26 Entegris, Inc. Methods and materials for making a monolithic porous pad cast onto a rotatable base
JP2007000860A (ja) * 2005-05-26 2007-01-11 Nitto Denko Corp 清浄用シート及びそれを用いた清浄方法
CN1872546A (zh) * 2005-05-26 2006-12-06 日东电工株式会社 清洁片及使用该清洁片的清洁方法
KR101155623B1 (ko) * 2010-01-08 2012-06-13 세메스 주식회사 기판 세정 유닛 및 이를 갖는 기판 세정 장치
TW201318779A (zh) * 2011-09-26 2013-05-16 Entegris Inc 清潔基板之刷具
US9202723B2 (en) * 2011-11-29 2015-12-01 Illinois Tool Works, Inc. Brush with cantilevered nodules
US20130255721A1 (en) * 2012-04-03 2013-10-03 Illinois Tool Works Inc. Concave nodule sponge brush
JP6352158B2 (ja) * 2014-11-20 2018-07-04 株式会社荏原製作所 洗浄具、洗浄具の製造方法、および、基板洗浄装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5846335A (en) * 1994-06-28 1998-12-08 Ebara Corporation Method for cleaning workpiece
JP2000311878A (ja) * 1999-04-27 2000-11-07 Dainippon Screen Mfg Co Ltd 基板洗浄装置
US6554010B1 (en) * 1999-07-26 2003-04-29 Tokyo Electron Limited Substrate cleaning tool, having permeable cleaning head
CN101121247A (zh) * 2006-08-11 2008-02-13 中芯国际集成电路制造(上海)有限公司 研磨头的清洗装置

Also Published As

Publication number Publication date
KR102443489B1 (ko) 2022-09-15
TW201906689A (zh) 2019-02-16
JP2016092158A (ja) 2016-05-23
US11642704B2 (en) 2023-05-09
CN105575851B (zh) 2021-08-27
US20160126113A1 (en) 2016-05-05
CN113276024A (zh) 2021-08-20
TW201615340A (zh) 2016-05-01
KR20160052343A (ko) 2016-05-12
TWI678260B (zh) 2019-12-01
CN105575851A (zh) 2016-05-11
MY178652A (en) 2020-10-20
US20200030855A1 (en) 2020-01-30
US10471481B2 (en) 2019-11-12
TWI670141B (zh) 2019-09-01
JP6316730B2 (ja) 2018-04-25
SG10201508996WA (en) 2016-05-30

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