TWI677547B - 黏接劑組成物及黏接片 - Google Patents

黏接劑組成物及黏接片 Download PDF

Info

Publication number
TWI677547B
TWI677547B TW105106960A TW105106960A TWI677547B TW I677547 B TWI677547 B TW I677547B TW 105106960 A TW105106960 A TW 105106960A TW 105106960 A TW105106960 A TW 105106960A TW I677547 B TWI677547 B TW I677547B
Authority
TW
Taiwan
Prior art keywords
meth
mass
adhesive composition
acrylic copolymer
acrylate
Prior art date
Application number
TW105106960A
Other languages
English (en)
Chinese (zh)
Other versions
TW201641649A (zh
Inventor
三村勇介
Yusuke Mimura
東出勇毅
Yuki HIGASHIDE
川口太郎
Taro KAWAGUCHI
中野宏人
Hiroto Nakano
Original Assignee
日商日本電石工業股份有限公司
Nippon Carbide Industries Co., Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商日本電石工業股份有限公司, Nippon Carbide Industries Co., Inc. filed Critical 日商日本電石工業股份有限公司
Publication of TW201641649A publication Critical patent/TW201641649A/zh
Application granted granted Critical
Publication of TWI677547B publication Critical patent/TWI677547B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/12—Esters of monohydric alcohols or phenols
    • C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
    • C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/29—Compounds containing one or more carbon-to-nitrogen double bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3472—Five-membered rings
    • C08K5/3475—Five-membered rings condensed with carbocyclic rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5435—Silicon-containing compounds containing oxygen containing oxygen in a ring
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/12—Esters of monohydric alcohols or phenols
    • C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
    • C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
    • C08F220/1804—C4-(meth)acrylate, e.g. butyl (meth)acrylate, isobutyl (meth)acrylate or tert-butyl (meth)acrylate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
TW105106960A 2015-03-30 2016-03-08 黏接劑組成物及黏接片 TWI677547B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015069045A JP6484484B2 (ja) 2015-03-30 2015-03-30 粘着剤組成物及び粘着シート
JP2015-069045 2015-03-30

Publications (2)

Publication Number Publication Date
TW201641649A TW201641649A (zh) 2016-12-01
TWI677547B true TWI677547B (zh) 2019-11-21

Family

ID=57082863

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105106960A TWI677547B (zh) 2015-03-30 2016-03-08 黏接劑組成物及黏接片

Country Status (4)

Country Link
JP (1) JP6484484B2 (ko)
KR (1) KR102488656B1 (ko)
CN (1) CN106010381B (ko)
TW (1) TWI677547B (ko)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2018061726A1 (ja) 2016-09-27 2019-01-17 日立オートモティブシステムズ株式会社 減衰力調整式緩衝器
WO2018116849A1 (ja) * 2016-12-22 2018-06-28 花王株式会社 吸収性シート及び吸収体
JP7104505B2 (ja) 2016-12-22 2022-07-21 花王株式会社 吸収体
CN111819259B (zh) * 2018-11-12 2021-03-16 日东电工株式会社 偏振膜、层叠偏振膜、图像显示面板、以及图像显示装置
JP7334604B2 (ja) * 2019-02-08 2023-08-29 日本カーバイド工業株式会社 偏光板用粘着剤組成物、粘着剤層付偏光板、及び、車載表示装置
CN111548761B (zh) * 2019-02-08 2023-08-18 日本电石工业株式会社 偏振片用粘合剂组合物、带有粘合剂层的偏振片和车载显示装置
JP2022179186A (ja) * 2021-05-21 2022-12-02 日東電工株式会社 粘着シートの製造方法、光学積層体の製造方法、及び画像表示装置の製造方法
JP2022179182A (ja) * 2021-05-21 2022-12-02 日東電工株式会社 粘着シート、光学積層体、画像表示装置及び粘着シートの製造方法
JP2022179183A (ja) * 2021-05-21 2022-12-02 日東電工株式会社 粘着シート、光学積層体及び画像表示装置
JP2022179185A (ja) * 2021-05-21 2022-12-02 日東電工株式会社 粘着シート、光学積層体及び画像表示装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011026425A (ja) * 2009-07-24 2011-02-10 Lintec Corp 粘着シート

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5110675B2 (ja) * 2004-04-07 2012-12-26 日東電工株式会社 粘着剤組成物、およびそれを用いてなる粘着シート類
JP2008222953A (ja) * 2007-03-15 2008-09-25 Lintec Corp 粘着シート
US20110122343A1 (en) * 2008-07-16 2011-05-26 Min Soo Park Pressure-sensitive adhesive composition, polarization plate, and liquid crystal display
US20110206927A1 (en) * 2008-07-31 2011-08-25 Lintec Corporation Adhesive sheet
JP5527881B2 (ja) * 2009-12-01 2014-06-25 リンテック株式会社 感圧接着剤組成物、感圧接着剤層及び感圧接着性積層体
JP5555043B2 (ja) 2010-04-26 2014-07-23 日本カーバイド工業株式会社 偏光板用粘着剤組成物、並びにそれを用いた粘着剤付偏光板及び液晶表示装置
KR101840072B1 (ko) * 2010-08-24 2018-03-19 닛뽕 카바이도 고교 가부시키가이샤 점착제 조성물
JP5518675B2 (ja) * 2010-10-29 2014-06-11 チェイル インダストリーズ インコーポレイテッド 粘着剤組成物
CN102464960B (zh) * 2010-10-29 2014-10-15 第一毛织株式会社 粘合剂组合物、光学元件、表面保护膜和粘合剂片
JP5617587B2 (ja) * 2010-12-13 2014-11-05 東洋インキＳｃホールディングス株式会社 感圧式接着剤、及びそれを用いた積層体
JP5777416B2 (ja) * 2011-06-13 2015-09-09 日本カーバイド工業株式会社 粘着剤組成物、それを用いた光学フィルム、および液晶表示装置
WO2013183563A1 (ja) * 2012-06-05 2013-12-12 日本カーバイド工業株式会社 偏光板用粘着剤組成物、粘着剤付偏光板、及び表示装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011026425A (ja) * 2009-07-24 2011-02-10 Lintec Corp 粘着シート

Also Published As

Publication number Publication date
CN106010381A (zh) 2016-10-12
JP2016188309A (ja) 2016-11-04
TW201641649A (zh) 2016-12-01
CN106010381B (zh) 2021-02-09
JP6484484B2 (ja) 2019-03-13
KR102488656B1 (ko) 2023-01-13
KR20160117205A (ko) 2016-10-10

Similar Documents

Publication Publication Date Title
TWI677547B (zh) 黏接劑組成物及黏接片
TWI809001B (zh) 重複彎曲裝置用黏著劑、黏著片、重複彎曲積層構件及重複彎曲裝置
JP5639448B2 (ja) アクリル系粘着剤組成物、アクリル系粘着剤及び粘着剤層付き光学部材
JP6139173B2 (ja) 粘着性組成物、粘着剤および粘着シート
JP6386408B2 (ja) 粘着剤組成物及び粘着シート
JP5435433B2 (ja) 偏光板用粘着剤組成物およびこれを利用した偏光板
JP6943726B2 (ja) 光学フィルム用粘着剤組成物、粘着剤層、光学部材、および画像表示装置
TW201406895A (zh) 偏光板用接著劑組成物、附設接著劑偏光板及顯示裝置
CN113383052A (zh) 光学膜粘合剂、粘合层、光学元件和图像显示装置
JP6738622B2 (ja) 粘着剤組成物及び粘着シート
JP2018095843A (ja) 光学フィルム用粘着剤組成物、粘着剤層、光学部材、および画像表示装置
JP6602201B2 (ja) 偏光板用粘着剤組成物、粘着剤付偏光板、及び表示装置
JP6096617B2 (ja) 粘着剤組成物及び光学機能性フィルム
JP6675242B2 (ja) 粘着剤組成物及び粘着剤層付偏光板
TWI661018B (zh) 黏接劑組成物及黏接片
JP6307192B2 (ja) 粘着性組成物、粘着剤および粘着シート
KR20190066527A (ko) 광학 필름용 점착제 조성물, 점착제층, 광학 부재 및 화상표시장치
JP2017160382A (ja) 粘着剤組成物及び粘着シート
JP2022125728A (ja) 粘着剤および粘着シート
JP2019014901A (ja) 粘着剤組成物及び粘着シート
JP7168148B2 (ja) 偏光板用粘着剤組成物及び粘着剤層付偏光板
JP7268278B2 (ja) 粘着剤組成物、粘着シート、及び光学部材
KR102650007B1 (ko) 편광판용 점착제 조성물 및 점착제층 부착 편광판
TW202400748A (zh) 光學薄膜用黏著劑組成物、黏著片、光學構件、及顯示裝置
TW202348762A (zh) 光學薄膜用黏著劑組成物、黏著片、光學構件、及顯示裝置