TWI674640B - 半導體封裝體配置裝置、製造裝置、半導體封裝體的配置方法以及電子零件的製造方法 - Google Patents

半導體封裝體配置裝置、製造裝置、半導體封裝體的配置方法以及電子零件的製造方法 Download PDF

Info

Publication number
TWI674640B
TWI674640B TW107109755A TW107109755A TWI674640B TW I674640 B TWI674640 B TW I674640B TW 107109755 A TW107109755 A TW 107109755A TW 107109755 A TW107109755 A TW 107109755A TW I674640 B TWI674640 B TW I674640B
Authority
TW
Taiwan
Prior art keywords
semiconductor package
support base
resin sheet
opening
imaging
Prior art date
Application number
TW107109755A
Other languages
English (en)
Chinese (zh)
Other versions
TW201901836A (zh
Inventor
片岡昌一
Shoichi Kataoka
深井元樹
Motoki FUKAI
Original Assignee
日商Ｔｏｗａ股份有限公司
Towa Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商Ｔｏｗａ股份有限公司, Towa Corporation filed Critical 日商Ｔｏｗａ股份有限公司
Publication of TW201901836A publication Critical patent/TW201901836A/zh
Application granted granted Critical
Publication of TWI674640B publication Critical patent/TWI674640B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3212—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips or lead frames
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/02—Manufacture or treatment of conductive package substrates serving as an interconnection, e.g. of metal plates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Packaging Frangible Articles (AREA)
TW107109755A 2017-03-23 2018-03-22 半導體封裝體配置裝置、製造裝置、半導體封裝體的配置方法以及電子零件的製造方法 TWI674640B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-057479 2017-03-23
JP2017057479A JP6598811B2 (ja) 2017-03-23 2017-03-23 半導体パッケージ配置装置、製造装置、半導体パッケージの配置方法および電子部品の製造方法

Publications (2)

Publication Number Publication Date
TW201901836A TW201901836A (zh) 2019-01-01
TWI674640B true TWI674640B (zh) 2019-10-11

Family

ID=63706344

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107109755A TWI674640B (zh) 2017-03-23 2018-03-22 半導體封裝體配置裝置、製造裝置、半導體封裝體的配置方法以及電子零件的製造方法

Country Status (4)

Country Link
JP (1) JP6598811B2 (https=)
KR (1) KR102158028B1 (https=)
CN (1) CN108630552B (https=)
TW (1) TWI674640B (https=)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200303589A (en) * 2002-02-05 2003-09-01 Toray Eng Co Ltd Chip bonding method and apparatus
TW200939364A (en) * 2008-03-11 2009-09-16 Towa Corp Method and apparatus for cutting substrate
TW201332043A (zh) * 2011-12-02 2013-08-01 神戶製鋼所股份有限公司 貼合基板之旋轉偏移量計測裝置、貼合基板之旋轉偏移量計測方法及貼合基板之製造方法
TW201515797A (zh) * 2013-09-02 2015-05-01 東和股份有限公司 切斷裝置及切斷方法
TW201620666A (zh) * 2014-12-12 2016-06-16 Towa Corp 切斷裝置及切斷方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2770817B2 (ja) * 1996-06-19 1998-07-02 日本電気株式会社 チップマウント装置及び方法
US6428641B1 (en) * 1998-08-31 2002-08-06 Amkor Technology, Inc. Method for laminating circuit pattern tape on semiconductor wafer
JP3986196B2 (ja) 1999-02-17 2007-10-03 株式会社ルネサステクノロジ 光半導体装置の製造方法
JP2004335604A (ja) * 2003-05-02 2004-11-25 Seiko Epson Corp 半導体装置の製造方法および電子デバイスの製造方法
JP4538843B2 (ja) * 2004-03-05 2010-09-08 澁谷工業株式会社 ダイボンド用粘着テープの貼付方法
JP2006100762A (ja) * 2004-09-06 2006-04-13 Fuji Photo Film Co Ltd 固体撮像装置の製造方法
JP2010135574A (ja) * 2008-12-05 2010-06-17 Alpha- Design Kk 移載装置
JP2012013802A (ja) * 2010-06-29 2012-01-19 Hitachi High-Technologies Corp Ｆｐｄモジュールの位置決めマーク認識装置及びｆｐｄモジュールの組立装置
JP6149277B2 (ja) * 2011-03-30 2017-06-21 ボンドテック株式会社 電子部品実装方法、電子部品実装システムおよび基板
JP6017382B2 (ja) * 2013-07-29 2016-11-02 Ｔｏｗａ株式会社 個片化された電子部品の搬送装置及び搬送方法
JP6128337B2 (ja) * 2014-10-23 2017-05-17 パナソニックＩｐマネジメント株式会社 半導体装置の製造方法及び製造装置
KR101590593B1 (ko) * 2015-12-03 2016-02-02 제너셈(주) 반도체패키지의 스퍼터링 방법

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200303589A (en) * 2002-02-05 2003-09-01 Toray Eng Co Ltd Chip bonding method and apparatus
TW200939364A (en) * 2008-03-11 2009-09-16 Towa Corp Method and apparatus for cutting substrate
TW201332043A (zh) * 2011-12-02 2013-08-01 神戶製鋼所股份有限公司 貼合基板之旋轉偏移量計測裝置、貼合基板之旋轉偏移量計測方法及貼合基板之製造方法
TW201515797A (zh) * 2013-09-02 2015-05-01 東和股份有限公司 切斷裝置及切斷方法
TW201620666A (zh) * 2014-12-12 2016-06-16 Towa Corp 切斷裝置及切斷方法

Also Published As

Publication number Publication date
KR20180108434A (ko) 2018-10-04
CN108630552B (zh) 2021-08-03
JP2018160583A (ja) 2018-10-11
CN108630552A (zh) 2018-10-09
TW201901836A (zh) 2019-01-01
JP6598811B2 (ja) 2019-10-30
KR102158028B1 (ko) 2020-09-21

Similar Documents

Publication Publication Date Title
CN100590427C (zh) 图像检查装置以及采用该图像检查装置的图像检查方法
JP6056058B2 (ja) ３次元測定装置、３次元測定方法、プログラム及び基板の製造方法
TWI638426B (zh) Stripping device, stripping system, stripping method and information memory medium
CN110752176B (zh) 搬运机构、电子零件制造装置及电子零件的制造方法
TWI707444B (zh) 半導體封裝體配置裝置、製造裝置、半導體封裝體的配置方法以及電子零件的製造方法
JP4224268B2 (ja) 電子回路部品装着機、ならびにそれの装着位置精度検査方法および装置
TW201942967A (zh) 雷射加工裝置及雷射加工方法
CN103426787A (zh) 检查半导体封装的印刷电路板的方法
TWI674640B (zh) 半導體封裝體配置裝置、製造裝置、半導體封裝體的配置方法以及電子零件的製造方法
JP2002162370A (ja) 基板のｘ線検査方法及びそれに用いるｘ線検査装置
CN103718027A (zh) 外观检查装置
JP7191473B2 (ja) キーパターンの検出方法、及び装置
TW201743389A (zh) 用於重組晶圓之測試系統及其方法
JP4960266B2 (ja) 透明基板のエッジ位置検出方法及びエッジ位置検出装置
WO2013031058A1 (ja) 部品実装装置、ヘッド及び部品姿勢認識方法
KR102509440B1 (ko) 마이크로 비아홀 검사 장치
JP3933042B2 (ja) 撮像方法
JP2025158040A (ja) 半導体装置の製造方法及び半導体ウェハ用のシート
JP7182156B2 (ja) 実装システム、実装方法、及び実装用プログラム
TWM518775U (zh) 光罩檢測裝置
TW202307948A (zh) 加工裝置及振動檢測方法
TW202336892A (zh) 檢查裝置
JP3876200B2 (ja) 電子部品装着方法、電子部品装着装置、位置検出方法および位置決め装置
JP2006269952A (ja) 近接露光装置
JP2015075339A (ja) 平板基板の表面状態検査方法及びそれを用いた平板基板の表面状態検査装置