CN108630552B - 半导体封装体配置装置、制造装置、配置方法及其应用 - Google Patents

半导体封装体配置装置、制造装置、配置方法及其应用 Download PDF

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Publication number
CN108630552B
CN108630552B CN201810227519.1A CN201810227519A CN108630552B CN 108630552 B CN108630552 B CN 108630552B CN 201810227519 A CN201810227519 A CN 201810227519A CN 108630552 B CN108630552 B CN 108630552B
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semiconductor package
support base
resin sheet
opening
imaging
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Chinese (zh)
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CN108630552A (zh
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片冈昌一
深井元树
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Towa Corp
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Towa Corp
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3212—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips or lead frames
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/02—Manufacture or treatment of conductive package substrates serving as an interconnection, e.g. of metal plates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Packaging Frangible Articles (AREA)
CN201810227519.1A 2017-03-23 2018-03-19 半导体封装体配置装置、制造装置、配置方法及其应用 Active CN108630552B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-057479 2017-03-23
JP2017057479A JP6598811B2 (ja) 2017-03-23 2017-03-23 半導体パッケージ配置装置、製造装置、半導体パッケージの配置方法および電子部品の製造方法

Publications (2)

Publication Number Publication Date
CN108630552A CN108630552A (zh) 2018-10-09
CN108630552B true CN108630552B (zh) 2021-08-03

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Country Link
JP (1) JP6598811B2 (https=)
KR (1) KR102158028B1 (https=)
CN (1) CN108630552B (https=)
TW (1) TWI674640B (https=)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000077571A (ja) * 1998-08-31 2000-03-14 Anam Semiconductor Inc ウェ―ハと回路パタ―ンテ―プのラミネ―ション方法
TW200303589A (en) * 2002-02-05 2003-09-01 Toray Eng Co Ltd Chip bonding method and apparatus
CN1542932A (zh) * 2003-05-02 2004-11-03 ������������ʽ���� 半导体装置的制造方法和电子设备的制造方法
JP2006100762A (ja) * 2004-09-06 2006-04-13 Fuji Photo Film Co Ltd 固体撮像装置の製造方法
CN1842908A (zh) * 2004-03-05 2006-10-04 东和株式会社 小片接合用粘接带的贴附方法和电子元件的安装方法
JP2010135574A (ja) * 2008-12-05 2010-06-17 Alpha- Design Kk 移載装置
CN102316713A (zh) * 2010-06-29 2012-01-11 株式会社日立高新技术 Fpd组件的定位标记识别装置和fpd组件的组装装置
CN105551930A (zh) * 2014-10-23 2016-05-04 松下知识产权经营株式会社 半导体装置的制造方法以及制造装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2770817B2 (ja) * 1996-06-19 1998-07-02 日本電気株式会社 チップマウント装置及び方法
JP3986196B2 (ja) 1999-02-17 2007-10-03 株式会社ルネサステクノロジ 光半導体装置の製造方法
JP2009218397A (ja) * 2008-03-11 2009-09-24 Towa Corp 基板の切断方法及び装置
JP6149277B2 (ja) * 2011-03-30 2017-06-21 ボンドテック株式会社 電子部品実装方法、電子部品実装システムおよび基板
JP5836223B2 (ja) * 2011-12-02 2015-12-24 株式会社神戸製鋼所 貼合基板の回転ズレ量計測装置、貼合基板の回転ズレ量計測方法、及び貼合基板の製造方法
JP6017382B2 (ja) * 2013-07-29 2016-11-02 Ｔｏｗａ株式会社 個片化された電子部品の搬送装置及び搬送方法
JP6218511B2 (ja) * 2013-09-02 2017-10-25 Ｔｏｗａ株式会社 切断装置及び切断方法
JP6444717B2 (ja) * 2014-12-12 2018-12-26 Ｔｏｗａ株式会社 切断装置及び切断方法
KR101590593B1 (ko) * 2015-12-03 2016-02-02 제너셈(주) 반도체패키지의 스퍼터링 방법

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000077571A (ja) * 1998-08-31 2000-03-14 Anam Semiconductor Inc ウェ―ハと回路パタ―ンテ―プのラミネ―ション方法
US6428641B1 (en) * 1998-08-31 2002-08-06 Amkor Technology, Inc. Method for laminating circuit pattern tape on semiconductor wafer
TW200303589A (en) * 2002-02-05 2003-09-01 Toray Eng Co Ltd Chip bonding method and apparatus
CN1542932A (zh) * 2003-05-02 2004-11-03 ������������ʽ���� 半导体装置的制造方法和电子设备的制造方法
CN1842908A (zh) * 2004-03-05 2006-10-04 东和株式会社 小片接合用粘接带的贴附方法和电子元件的安装方法
JP2006100762A (ja) * 2004-09-06 2006-04-13 Fuji Photo Film Co Ltd 固体撮像装置の製造方法
JP2010135574A (ja) * 2008-12-05 2010-06-17 Alpha- Design Kk 移載装置
CN102316713A (zh) * 2010-06-29 2012-01-11 株式会社日立高新技术 Fpd组件的定位标记识别装置和fpd组件的组装装置
CN105551930A (zh) * 2014-10-23 2016-05-04 松下知识产权经营株式会社 半导体装置的制造方法以及制造装置

Also Published As

Publication number Publication date
KR20180108434A (ko) 2018-10-04
JP2018160583A (ja) 2018-10-11
CN108630552A (zh) 2018-10-09
TWI674640B (zh) 2019-10-11
TW201901836A (zh) 2019-01-01
JP6598811B2 (ja) 2019-10-30
KR102158028B1 (ko) 2020-09-21

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