KR102158028B1 - 반도체 패키지 배치 장치, 제조 장치, 반도체 패키지의 배치 방법 및 전자 부품의 제조 방법 - Google Patents

반도체 패키지 배치 장치, 제조 장치, 반도체 패키지의 배치 방법 및 전자 부품의 제조 방법 Download PDF

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KR102158028B1
KR102158028B1 KR1020180024116A KR20180024116A KR102158028B1 KR 102158028 B1 KR102158028 B1 KR 102158028B1 KR 1020180024116 A KR1020180024116 A KR 1020180024116A KR 20180024116 A KR20180024116 A KR 20180024116A KR 102158028 B1 KR102158028 B1 KR 102158028B1
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KR20180108434A (ko
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쇼이치 카타오카
모토키 후카이
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토와 가부시기가이샤
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H01L21/68—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/07—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers Not used, see H10P72/00
    • H01L21/67092—
    • H01L21/67242—
    • H01L21/67721—
    • H01L23/00—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3212—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips or lead frames
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/02—Manufacture or treatment of conductive package substrates serving as an interconnection, e.g. of metal plates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Packaging Frangible Articles (AREA)
KR1020180024116A 2017-03-23 2018-02-28 반도체 패키지 배치 장치, 제조 장치, 반도체 패키지의 배치 방법 및 전자 부품의 제조 방법 Active KR102158028B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017057479A JP6598811B2 (ja) 2017-03-23 2017-03-23 半導体パッケージ配置装置、製造装置、半導体パッケージの配置方法および電子部品の製造方法
JPJP-P-2017-057479 2017-03-23

Publications (2)

Publication Number Publication Date
KR20180108434A KR20180108434A (ko) 2018-10-04
KR102158028B1 true KR102158028B1 (ko) 2020-09-21

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KR1020180024116A Active KR102158028B1 (ko) 2017-03-23 2018-02-28 반도체 패키지 배치 장치, 제조 장치, 반도체 패키지의 배치 방법 및 전자 부품의 제조 방법

Country Status (4)

Country Link
JP (1) JP6598811B2 (https=)
KR (1) KR102158028B1 (https=)
CN (1) CN108630552B (https=)
TW (1) TWI674640B (https=)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000243762A (ja) 1999-02-17 2000-09-08 Hitachi Ltd 光半導体装置の製造方法およびそれに使用するペレットボンディング装置
JP2010135574A (ja) * 2008-12-05 2010-06-17 Alpha- Design Kk 移載装置
WO2012133760A1 (ja) * 2011-03-30 2012-10-04 ボンドテック株式会社 電子部品実装方法、電子部品実装システムおよび基板
JP2015026789A (ja) * 2013-07-29 2015-02-05 Ｔｏｗａ株式会社 個片化された電子部品の搬送装置及び搬送方法
KR101590593B1 (ko) * 2015-12-03 2016-02-02 제너셈(주) 반도체패키지의 스퍼터링 방법

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2770817B2 (ja) * 1996-06-19 1998-07-02 日本電気株式会社 チップマウント装置及び方法
US6428641B1 (en) * 1998-08-31 2002-08-06 Amkor Technology, Inc. Method for laminating circuit pattern tape on semiconductor wafer
JP2003303854A (ja) * 2002-02-05 2003-10-24 Toray Eng Co Ltd チップ実装方法およびそれを用いた装置
JP2004335604A (ja) * 2003-05-02 2004-11-25 Seiko Epson Corp 半導体装置の製造方法および電子デバイスの製造方法
JP4538843B2 (ja) * 2004-03-05 2010-09-08 澁谷工業株式会社 ダイボンド用粘着テープの貼付方法
JP2006100762A (ja) * 2004-09-06 2006-04-13 Fuji Photo Film Co Ltd 固体撮像装置の製造方法
JP2009218397A (ja) * 2008-03-11 2009-09-24 Towa Corp 基板の切断方法及び装置
JP2012013802A (ja) * 2010-06-29 2012-01-19 Hitachi High-Technologies Corp Ｆｐｄモジュールの位置決めマーク認識装置及びｆｐｄモジュールの組立装置
JP5836223B2 (ja) * 2011-12-02 2015-12-24 株式会社神戸製鋼所 貼合基板の回転ズレ量計測装置、貼合基板の回転ズレ量計測方法、及び貼合基板の製造方法
JP6218511B2 (ja) * 2013-09-02 2017-10-25 Ｔｏｗａ株式会社 切断装置及び切断方法
JP6128337B2 (ja) * 2014-10-23 2017-05-17 パナソニックＩｐマネジメント株式会社 半導体装置の製造方法及び製造装置
JP6444717B2 (ja) * 2014-12-12 2018-12-26 Ｔｏｗａ株式会社 切断装置及び切断方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000243762A (ja) 1999-02-17 2000-09-08 Hitachi Ltd 光半導体装置の製造方法およびそれに使用するペレットボンディング装置
JP2010135574A (ja) * 2008-12-05 2010-06-17 Alpha- Design Kk 移載装置
WO2012133760A1 (ja) * 2011-03-30 2012-10-04 ボンドテック株式会社 電子部品実装方法、電子部品実装システムおよび基板
JP2015026789A (ja) * 2013-07-29 2015-02-05 Ｔｏｗａ株式会社 個片化された電子部品の搬送装置及び搬送方法
KR101590593B1 (ko) * 2015-12-03 2016-02-02 제너셈(주) 반도체패키지의 스퍼터링 방법

Also Published As

Publication number Publication date
KR20180108434A (ko) 2018-10-04
CN108630552B (zh) 2021-08-03
JP2018160583A (ja) 2018-10-11
CN108630552A (zh) 2018-10-09
TWI674640B (zh) 2019-10-11
TW201901836A (zh) 2019-01-01
JP6598811B2 (ja) 2019-10-30

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