TWI670158B - 樹脂材料供給裝置及方法、樹脂成形裝置及樹脂成形品製造方法 - Google Patents

樹脂材料供給裝置及方法、樹脂成形裝置及樹脂成形品製造方法 Download PDF

Info

Publication number
TWI670158B
TWI670158B TW106120102A TW106120102A TWI670158B TW I670158 B TWI670158 B TW I670158B TW 106120102 A TW106120102 A TW 106120102A TW 106120102 A TW106120102 A TW 106120102A TW I670158 B TWI670158 B TW I670158B
Authority
TW
Taiwan
Prior art keywords
resin material
supply
groove
supplied
resin
Prior art date
Application number
TW106120102A
Other languages
English (en)
Chinese (zh)
Other versions
TW201813800A (zh
Inventor
林口慎也
Original Assignee
日商東和股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商東和股份有限公司 filed Critical 日商東和股份有限公司
Publication of TW201813800A publication Critical patent/TW201813800A/zh
Application granted granted Critical
Publication of TWI670158B publication Critical patent/TWI670158B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C31/00—Handling, e.g. feeding of the material to be shaped, storage of plastics material before moulding; Automation, i.e. automated handling lines in plastics processing plants, e.g. using manipulators or robots
    • B29C31/04—Feeding of the material to be moulded, e.g. into a mould cavity
    • B29C31/06—Feeding of the material to be moulded, e.g. into a mould cavity in measured doses, e.g. by weighting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B29C2043/181—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles encapsulated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B29C2043/3405—Feeding the material to the mould or the compression means using carrying means
    • B29C2043/3427—Feeding the material to the mould or the compression means using carrying means hopper, vessel, chute, tube, conveying screw, for material in discrete form, e.g. particles or powder or fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • B29C2043/5875—Measuring, controlling or regulating the material feed to the moulds or mould parts, e.g. controlling feed flow, velocity, weight, doses

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Robotics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Weight Measurement For Supplying Or Discharging Of Specified Amounts Of Material (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
TW106120102A 2016-10-11 2017-06-16 樹脂材料供給裝置及方法、樹脂成形裝置及樹脂成形品製造方法 TWI670158B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP2016-199931 2016-10-11
JP2016199931A JP6279047B1 (ja) 2016-10-11 2016-10-11 樹脂材料供給装置、樹脂材料供給方法、樹脂成形装置、及び樹脂成形品製造方法

Publications (2)

Publication Number Publication Date
TW201813800A TW201813800A (zh) 2018-04-16
TWI670158B true TWI670158B (zh) 2019-09-01

Family

ID=61195845

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106120102A TWI670158B (zh) 2016-10-11 2017-06-16 樹脂材料供給裝置及方法、樹脂成形裝置及樹脂成形品製造方法

Country Status (4)

Country Link
JP (1) JP6279047B1 (ja)
KR (1) KR102007566B1 (ja)
CN (1) CN107914355B (ja)
TW (1) TWI670158B (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6598918B2 (ja) * 2018-04-16 2019-10-30 Ｔｏｗａ株式会社 粉粒体供給装置、樹脂成形装置、粉粒体供給方法、および、樹脂成形品の製造方法
JP6894479B2 (ja) * 2018-04-16 2021-06-30 Ｔｏｗａ株式会社 粉粒体供給装置、樹脂成形装置、粉粒体供給方法、および、樹脂成形品の製造方法
JP7240300B2 (ja) * 2019-10-25 2023-03-15 Ｔｏｗａ株式会社 粉粒体供給装置、樹脂成形装置、及び樹脂成形品の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004325114A (ja) * 2003-04-22 2004-11-18 Murata Mfg Co Ltd 計量方法および計量装置
JP2012016883A (ja) * 2010-07-08 2012-01-26 Towa Corp 電子部品の圧縮成形方法及び成形装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3584343B2 (ja) 1995-06-21 2004-11-04 月島機械株式会社 粉体の供給方法および供給装置
JP3361464B2 (ja) * 1998-10-30 2003-01-07 株式会社日本製鋼所 金属射出成形機の材料供給装置
JP2004012216A (ja) * 2002-06-05 2004-01-15 Matsushita Electric Ind Co Ltd 粉粒状材料計量供給方法およびその装置
US20060144906A1 (en) * 2005-01-05 2006-07-06 Sheehan James F Ultrasonic welder with high-Q tool
JP4953619B2 (ja) 2005-11-04 2012-06-13 Ｔｏｗａ株式会社 電子部品の樹脂封止成形装置
JP5074062B2 (ja) * 2007-03-14 2012-11-14 住友重機械工業株式会社 樹脂計量供給装置
JP5153509B2 (ja) 2008-08-08 2013-02-27 Ｔｏｗａ株式会社 電子部品の圧縮成形方法及び金型装置
JP5081784B2 (ja) * 2008-10-09 2012-11-28 住友重機械工業株式会社 樹脂供給装置
JP5889773B2 (ja) * 2011-12-07 2016-03-22 花王株式会社 粉粒体の散布方法及び散布装置並びにそれを用いた発熱体の製造方法
JP6049597B2 (ja) * 2013-11-28 2016-12-21 Ｔｏｗａ株式会社 圧縮成形装置の樹脂材料供給方法及び供給機構、並びに圧縮成形方法及び圧縮成形装置
JP6104787B2 (ja) * 2013-12-18 2017-03-29 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形方法
JP6637301B2 (ja) * 2015-12-04 2020-01-29 日機装株式会社 粉体送給装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004325114A (ja) * 2003-04-22 2004-11-18 Murata Mfg Co Ltd 計量方法および計量装置
JP2012016883A (ja) * 2010-07-08 2012-01-26 Towa Corp 電子部品の圧縮成形方法及び成形装置

Also Published As

Publication number Publication date
JP2018062076A (ja) 2018-04-19
TW201813800A (zh) 2018-04-16
CN107914355B (zh) 2020-03-03
JP6279047B1 (ja) 2018-02-14
CN107914355A (zh) 2018-04-17
KR102007566B1 (ko) 2019-08-05
KR20180040086A (ko) 2018-04-19

Similar Documents

Publication Publication Date Title
TWI670158B (zh) 樹脂材料供給裝置及方法、樹脂成形裝置及樹脂成形品製造方法
CN103921384B (zh) 电子部件的压缩成形方法及模具装置
TWI543278B (zh) 壓縮成形裝置之樹脂材料供給方法及供給機構、以及壓縮成形方法及壓縮成形裝置
TWI673155B (zh) 吐出裝置、吐出方法、樹脂成形裝置和樹脂成形品的製造方法
JPH10305439A (ja) 樹脂モールド方法及び樹脂モールド装置
SG181252A1 (en) Resin molding machine
WO2014185202A1 (ja) 樹脂モールド装置および樹脂モールド方法
CN107972220B (zh) 树脂材料供给装置及方法、树脂成形装置及树脂成形品制造方法
TW202019656A (zh) 樹脂成形裝置及樹脂成形品的製造方法
TW202003192A (zh) 樹脂成形裝置及樹脂成形品的製造方法
KR20190015091A (ko) 수지 성형 장치 및 수지 성형품 제조 방법
JP7444453B2 (ja) 樹脂封止装置及び樹脂封止方法
TWI810451B (zh) 成形模具、樹脂成形裝置及樹脂成形品的製造方法
TWI680044B (zh) 樹脂成形裝置及樹脂成形品製造方法
TW201943611A (zh) 粉粒體供給裝置、樹脂成形裝置、粉粒體供給方法、及樹脂成形品的製造方法
TWI578459B (zh) 壓縮成形裝置之樹脂材料供給裝置及方法、壓縮成形裝置及方法
KR20200132664A (ko) 성형형, 수지 성형 장치 및 수지 성형품의 제조 방법
TWI652157B (zh) 壓縮成形裝置之樹脂材料供應裝置及壓縮成形裝置
TWI652156B (zh) 壓縮成形裝置之樹脂材料供應方法及供應裝置以及壓縮成形方法及壓縮成形裝置
JP4851948B2 (ja) 樹脂供給機構
TW202202311A (zh) 樹脂材料供給裝置、樹脂成形裝置及樹脂成形品的製法
TW202118610A (zh) 樹脂材料供給裝置、樹脂成形裝置及樹脂成形品的製造方法
JP2022013023A (ja) 樹脂成形装置及び樹脂成形品の製造方法