TWI666712B - 負荷測定裝置以及負荷測定方法 - Google Patents

負荷測定裝置以及負荷測定方法 Download PDF

Info

Publication number
TWI666712B
TWI666712B TW105105095A TW105105095A TWI666712B TW I666712 B TWI666712 B TW I666712B TW 105105095 A TW105105095 A TW 105105095A TW 105105095 A TW105105095 A TW 105105095A TW I666712 B TWI666712 B TW I666712B
Authority
TW
Taiwan
Prior art keywords
load
roller
cleaning member
roll
substrate
Prior art date
Application number
TW105105095A
Other languages
English (en)
Chinese (zh)
Other versions
TW201631680A (zh
Inventor
Hideaki Tanaka
田中英明
Original Assignee
Ebara Corporation
日商荏原製作所股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corporation, 日商荏原製作所股份有限公司 filed Critical Ebara Corporation
Publication of TW201631680A publication Critical patent/TW201631680A/zh
Application granted granted Critical
Publication of TWI666712B publication Critical patent/TWI666712B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
    • B08B1/14—Wipes; Absorbent members, e.g. swabs or sponges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • B08B1/34—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members rotating about an axis parallel to the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/04—Measuring force or stress, in general by measuring elastic deformation of gauges, e.g. of springs
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/04—Measuring force or stress, in general by measuring elastic deformation of gauges, e.g. of springs
    • G01L1/048—Measuring force or stress, in general by measuring elastic deformation of gauges, e.g. of springs of torsionally deformable elements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
    • G01L5/0061—Force sensors associated with industrial machines or actuators
    • G01L5/0076—Force sensors associated with manufacturing machines
    • G01L5/0085—Force sensors adapted for insertion between cooperating machine elements, e.g. for measuring the nip force between rollers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0412—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/27—Structural arrangements therefor

Landscapes

  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Force Measurement Appropriate To Specific Purposes (AREA)
TW105105095A 2015-02-24 2016-02-22 負荷測定裝置以及負荷測定方法 TWI666712B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015033910A JP6328577B2 (ja) 2015-02-24 2015-02-24 荷重測定装置および荷重測定方法
JP2015-033910 2015-02-24

Publications (2)

Publication Number Publication Date
TW201631680A TW201631680A (zh) 2016-09-01
TWI666712B true TWI666712B (zh) 2019-07-21

Family

ID=56690215

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105105095A TWI666712B (zh) 2015-02-24 2016-02-22 負荷測定裝置以及負荷測定方法

Country Status (6)

Country Link
US (1) US9719869B2 (https=)
JP (1) JP6328577B2 (https=)
KR (1) KR102238958B1 (https=)
CN (1) CN105914166B (https=)
SG (1) SG10201601246RA (https=)
TW (1) TWI666712B (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6767834B2 (ja) 2016-09-29 2020-10-14 株式会社荏原製作所 基板洗浄装置及び基板処理装置
JP6792512B2 (ja) 2017-05-16 2020-11-25 株式会社荏原製作所 基板洗浄装置および基板処理装置
JP6823541B2 (ja) * 2017-05-30 2021-02-03 株式会社荏原製作所 キャリブレーション方法およびキャリブレーションプログラム
JP7079164B2 (ja) 2018-07-06 2022-06-01 株式会社荏原製作所 基板洗浄装置および基板洗浄方法
CN108955846A (zh) * 2018-08-14 2018-12-07 安徽中联九通机械设备有限公司 一种配料机控制系统
DE102020133121B4 (de) 2019-12-12 2024-06-20 Alfred Schöpf Verfahren und Vorrichtung zur Überlaufmessung einer Flüssigkeit über eine Überlaufkante eines Beckens
WO2022054605A1 (ja) * 2020-09-10 2022-03-17 東京エレクトロン株式会社 厚み測定装置及び厚み測定方法
JP7093390B2 (ja) * 2020-10-15 2022-06-29 株式会社荏原製作所 基板洗浄装置
CN117772662A (zh) * 2023-12-25 2024-03-29 北京晶亦精微科技股份有限公司 一种基板清洗装置以及清洗方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4248317A (en) * 1979-09-10 1981-02-03 Cardinal Scale Manufacturing Company Load cell apparatus
JPH08267023A (ja) * 1995-04-03 1996-10-15 Dainippon Screen Mfg Co Ltd 回転式基板洗浄装置
JP2002051497A (ja) * 2000-07-28 2002-02-15 Mitsumi Electric Co Ltd モータ駆動軸の側圧機構及び側圧機構を備えたモータ
WO2010143744A1 (en) * 2009-06-09 2010-12-16 Nikon Corporation Transport apparatus and exposure apparatus
JP2014038983A (ja) * 2012-08-20 2014-02-27 Ebara Corp 基板洗浄装置及び基板処理装置

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4425808A (en) * 1982-02-26 1984-01-17 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Thin film strain transducer
JPS61278724A (ja) * 1985-06-04 1986-12-09 Nippon Kokan Kk <Nkk> 脱水機圧力測定装置
KR19980022571A (ko) * 1996-09-23 1998-07-06 김광호 반도체 스크러버(Scrubber)장비
JP3540524B2 (ja) * 1996-10-28 2004-07-07 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
JPH10189512A (ja) * 1996-12-26 1998-07-21 Sony Corp 基板洗浄装置
JP2000228382A (ja) * 1999-02-05 2000-08-15 Sony Corp ウエハ洗浄装置
US6579797B1 (en) * 2000-01-25 2003-06-17 Agere Systems Inc. Cleaning brush conditioning apparatus
US7743449B2 (en) * 2002-06-28 2010-06-29 Lam Research Corporation System and method for a combined contact and non-contact wafer cleaning module
KR20080044825A (ko) * 2005-09-15 2008-05-21 가부시키가이샤 에바라 세이사꾸쇼 세정부재, 기판세정장치 및 기판처리장치
FR2931550B1 (fr) * 2008-05-20 2012-12-07 Commissariat Energie Atomique Dispositif pour la detection gravimetrique de particules en milieu fluide comprenant un oscillateur entre deux canaux fluidiques, procede de realisation et methode de mise en oeuvre du dispositif
US9254510B2 (en) * 2012-02-03 2016-02-09 Stmicroelectronics, Inc. Drying apparatus with exhaust control cap for semiconductor wafers and associated methods
JP6262983B2 (ja) * 2012-10-25 2018-01-17 株式会社荏原製作所 基板洗浄装置及び基板洗浄方法
JP6279276B2 (ja) * 2013-10-03 2018-02-14 株式会社荏原製作所 基板洗浄装置及び基板処理装置
US9127968B2 (en) * 2013-11-18 2015-09-08 Ford Global Technologies, Llc Flexible optical impact detection sensor for front rail mounted airbag
SG10201601095UA (en) * 2015-02-18 2016-09-29 Ebara Corp Substrate cleaning apparatus, substrate cleaning method, and substrate processing apparatus

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4248317A (en) * 1979-09-10 1981-02-03 Cardinal Scale Manufacturing Company Load cell apparatus
JPH08267023A (ja) * 1995-04-03 1996-10-15 Dainippon Screen Mfg Co Ltd 回転式基板洗浄装置
JP2002051497A (ja) * 2000-07-28 2002-02-15 Mitsumi Electric Co Ltd モータ駆動軸の側圧機構及び側圧機構を備えたモータ
WO2010143744A1 (en) * 2009-06-09 2010-12-16 Nikon Corporation Transport apparatus and exposure apparatus
JP2014038983A (ja) * 2012-08-20 2014-02-27 Ebara Corp 基板洗浄装置及び基板処理装置

Also Published As

Publication number Publication date
CN105914166B (zh) 2019-03-01
CN105914166A (zh) 2016-08-31
US9719869B2 (en) 2017-08-01
KR20160103520A (ko) 2016-09-01
KR102238958B1 (ko) 2021-04-13
SG10201601246RA (en) 2016-09-29
TW201631680A (zh) 2016-09-01
US20160243592A1 (en) 2016-08-25
JP2016157778A (ja) 2016-09-01
JP6328577B2 (ja) 2018-05-23

Similar Documents

Publication Publication Date Title
TWI666712B (zh) 負荷測定裝置以及負荷測定方法
KR102401524B1 (ko) 기판 세정 장치 및 기판 세정 장치에 의해 실행되는 방법
CN101045230B (zh) 基板处理装置以及基板处理方法
JP3328426B2 (ja) 洗浄装置
KR100892809B1 (ko) 기판처리장치 및 기판처리방법
CN110651356B (zh) 清洗装置、基板处理装置、清洗装置的维护方法、以及计算机可读取记录介质
CN112735940B (zh) 一种可动态调整的晶圆清洗方法
JP2015012200A (ja) 基板処理装置
US20070006895A1 (en) Substrate cleaning brush, and substrate treatment apparatus and substrate treatment method using the same
JP2012009692A (ja) ドレス方法、研磨方法および研磨装置
JP6895565B2 (ja) 基板洗浄装置および基板洗浄装置で実行される方法
JP2020021863A (ja) 基板処理方法および基板処理装置
JP2008137118A (ja) 欠陥修正装置および欠陥修正方法
JP4719052B2 (ja) 基板処理装置および基板処理方法
JP2010129704A (ja) 基板処理装置のロール間隙調整方法
JP2007165794A (ja) 基板処理装置および基板処理方法
JP4320618B2 (ja) スクラブ洗浄装置
JP6736713B2 (ja) 基板洗浄装置および基板洗浄装置で実行される方法
US20250083200A1 (en) Abrasion detection device, abrasion detection method, substrate cleaning device, and substrate cleaning method
JP2007294490A (ja) 基板の洗浄装置およびこれを用いた基板の洗浄方法
KR20090015290A (ko) 브러시 위치 조정 장치 및 이를 갖는 기판 세정 장치
JP2025165658A (ja) ウェーハの洗浄方法および洗浄装置
JP2015196124A (ja) ロールスポンジホルダー、ロールスポンジの製造方法、基板洗浄装置及び基板処理装置