CN105914166B - 载荷测定装置以及载荷测定方法 - Google Patents

载荷测定装置以及载荷测定方法 Download PDF

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Publication number
CN105914166B
CN105914166B CN201610092048.9A CN201610092048A CN105914166B CN 105914166 B CN105914166 B CN 105914166B CN 201610092048 A CN201610092048 A CN 201610092048A CN 105914166 B CN105914166 B CN 105914166B
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CN
China
Prior art keywords
load
roller
cleaning
roll shape
substrate
Prior art date
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CN201610092048.9A
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English (en)
Chinese (zh)
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CN105914166A (zh
Inventor
田中英明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
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Ebara Corp
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Publication date
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Publication of CN105914166A publication Critical patent/CN105914166A/zh
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Publication of CN105914166B publication Critical patent/CN105914166B/zh
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
    • B08B1/14—Wipes; Absorbent members, e.g. swabs or sponges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • B08B1/34—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members rotating about an axis parallel to the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/04—Measuring force or stress, in general by measuring elastic deformation of gauges, e.g. of springs
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/04—Measuring force or stress, in general by measuring elastic deformation of gauges, e.g. of springs
    • G01L1/048—Measuring force or stress, in general by measuring elastic deformation of gauges, e.g. of springs of torsionally deformable elements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
    • G01L5/0061—Force sensors associated with industrial machines or actuators
    • G01L5/0076—Force sensors associated with manufacturing machines
    • G01L5/0085—Force sensors adapted for insertion between cooperating machine elements, e.g. for measuring the nip force between rollers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0412—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/27—Structural arrangements therefor

Landscapes

  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Force Measurement Appropriate To Specific Purposes (AREA)
CN201610092048.9A 2015-02-24 2016-02-19 载荷测定装置以及载荷测定方法 Active CN105914166B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015033910A JP6328577B2 (ja) 2015-02-24 2015-02-24 荷重測定装置および荷重測定方法
JP2015-033910 2015-02-24

Publications (2)

Publication Number Publication Date
CN105914166A CN105914166A (zh) 2016-08-31
CN105914166B true CN105914166B (zh) 2019-03-01

Family

ID=56690215

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610092048.9A Active CN105914166B (zh) 2015-02-24 2016-02-19 载荷测定装置以及载荷测定方法

Country Status (6)

Country Link
US (1) US9719869B2 (https=)
JP (1) JP6328577B2 (https=)
KR (1) KR102238958B1 (https=)
CN (1) CN105914166B (https=)
SG (1) SG10201601246RA (https=)
TW (1) TWI666712B (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6767834B2 (ja) 2016-09-29 2020-10-14 株式会社荏原製作所 基板洗浄装置及び基板処理装置
JP6792512B2 (ja) 2017-05-16 2020-11-25 株式会社荏原製作所 基板洗浄装置および基板処理装置
JP6823541B2 (ja) * 2017-05-30 2021-02-03 株式会社荏原製作所 キャリブレーション方法およびキャリブレーションプログラム
JP7079164B2 (ja) 2018-07-06 2022-06-01 株式会社荏原製作所 基板洗浄装置および基板洗浄方法
CN108955846A (zh) * 2018-08-14 2018-12-07 安徽中联九通机械设备有限公司 一种配料机控制系统
DE102020133121B4 (de) 2019-12-12 2024-06-20 Alfred Schöpf Verfahren und Vorrichtung zur Überlaufmessung einer Flüssigkeit über eine Überlaufkante eines Beckens
WO2022054605A1 (ja) * 2020-09-10 2022-03-17 東京エレクトロン株式会社 厚み測定装置及び厚み測定方法
JP7093390B2 (ja) * 2020-10-15 2022-06-29 株式会社荏原製作所 基板洗浄装置
CN117772662A (zh) * 2023-12-25 2024-03-29 北京晶亦精微科技股份有限公司 一种基板清洗装置以及清洗方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4425808A (en) * 1982-02-26 1984-01-17 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Thin film strain transducer
CN101218665A (zh) * 2005-09-15 2008-07-09 株式会社荏原制作所 清洁元件、基片清洁装置和基片处理装置

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US4248317A (en) * 1979-09-10 1981-02-03 Cardinal Scale Manufacturing Company Load cell apparatus
JPS61278724A (ja) * 1985-06-04 1986-12-09 Nippon Kokan Kk <Nkk> 脱水機圧力測定装置
JP3341872B2 (ja) * 1995-04-03 2002-11-05 大日本スクリーン製造株式会社 回転式基板洗浄装置
KR19980022571A (ko) * 1996-09-23 1998-07-06 김광호 반도체 스크러버(Scrubber)장비
JP3540524B2 (ja) * 1996-10-28 2004-07-07 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
JPH10189512A (ja) * 1996-12-26 1998-07-21 Sony Corp 基板洗浄装置
JP2000228382A (ja) * 1999-02-05 2000-08-15 Sony Corp ウエハ洗浄装置
US6579797B1 (en) * 2000-01-25 2003-06-17 Agere Systems Inc. Cleaning brush conditioning apparatus
JP2002051497A (ja) * 2000-07-28 2002-02-15 Mitsumi Electric Co Ltd モータ駆動軸の側圧機構及び側圧機構を備えたモータ
US7743449B2 (en) * 2002-06-28 2010-06-29 Lam Research Corporation System and method for a combined contact and non-contact wafer cleaning module
FR2931550B1 (fr) * 2008-05-20 2012-12-07 Commissariat Energie Atomique Dispositif pour la detection gravimetrique de particules en milieu fluide comprenant un oscillateur entre deux canaux fluidiques, procede de realisation et methode de mise en oeuvre du dispositif
US9312159B2 (en) * 2009-06-09 2016-04-12 Nikon Corporation Transport apparatus and exposure apparatus
US9254510B2 (en) * 2012-02-03 2016-02-09 Stmicroelectronics, Inc. Drying apparatus with exhaust control cap for semiconductor wafers and associated methods
JP5878441B2 (ja) * 2012-08-20 2016-03-08 株式会社荏原製作所 基板洗浄装置及び基板処理装置
JP6262983B2 (ja) * 2012-10-25 2018-01-17 株式会社荏原製作所 基板洗浄装置及び基板洗浄方法
JP6279276B2 (ja) * 2013-10-03 2018-02-14 株式会社荏原製作所 基板洗浄装置及び基板処理装置
US9127968B2 (en) * 2013-11-18 2015-09-08 Ford Global Technologies, Llc Flexible optical impact detection sensor for front rail mounted airbag
SG10201601095UA (en) * 2015-02-18 2016-09-29 Ebara Corp Substrate cleaning apparatus, substrate cleaning method, and substrate processing apparatus

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4425808A (en) * 1982-02-26 1984-01-17 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Thin film strain transducer
CN101218665A (zh) * 2005-09-15 2008-07-09 株式会社荏原制作所 清洁元件、基片清洁装置和基片处理装置

Also Published As

Publication number Publication date
CN105914166A (zh) 2016-08-31
US9719869B2 (en) 2017-08-01
KR20160103520A (ko) 2016-09-01
KR102238958B1 (ko) 2021-04-13
SG10201601246RA (en) 2016-09-29
TW201631680A (zh) 2016-09-01
TWI666712B (zh) 2019-07-21
US20160243592A1 (en) 2016-08-25
JP2016157778A (ja) 2016-09-01
JP6328577B2 (ja) 2018-05-23

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