Classifications

• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B08—CLEANING
  • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
  • B08B1/00—Cleaning by methods involving the use of tools
  • B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
  • B08B1/14—Wipes; Absorbent members, e.g. swabs or sponges
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B08—CLEANING
  • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
  • B08B1/00—Cleaning by methods involving the use of tools
  • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
  • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
  • B08B1/34—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members rotating about an axis parallel to the surface
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B08—CLEANING
  • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
  • B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
  • G01L1/00—Measuring force or stress, in general
  • G01L1/04—Measuring force or stress, in general by measuring elastic deformation of gauges, e.g. of springs
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
  • G01L1/00—Measuring force or stress, in general
  • G01L1/04—Measuring force or stress, in general by measuring elastic deformation of gauges, e.g. of springs
  • G01L1/048—Measuring force or stress, in general by measuring elastic deformation of gauges, e.g. of springs of torsionally deformable elements
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
  • G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
  • G01L5/0061—Force sensors associated with industrial machines or actuators
  • G01L5/0076—Force sensors associated with manufacturing machines
  • G01L5/0085—Force sensors adapted for insertion between cooperating machine elements, e.g. for measuring the nip force between rollers
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/67005—Apparatus not specifically provided for elsewhere
  • H01L21/67011—Apparatus for manufacture or treatment
  • H01L21/67017—Apparatus for fluid treatment
  • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
  • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
  • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
  • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements

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• Engineering & Computer Science (AREA)
• Physics & Mathematics (AREA)
• General Physics & Mathematics (AREA)
• Chemical & Material Sciences (AREA)
• Analytical Chemistry (AREA)
• Manufacturing & Machinery (AREA)
• Computer Hardware Design (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Power Engineering (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• Cleaning Or Drying Semiconductors (AREA)
• Force Measurement Appropriate To Specific Purposes (AREA)

Applications Claiming Priority (2)

Publications (2)

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Family Applications (1)

Country Status (6)

Families Citing this family (8)

Citations (5)

Family Cites Families (15)

• 2015
  • 2015-02-24 JP JP2015033910A patent/JP6328577B2/ja active Active
• 2016
  • 2016-02-17 US US15/045,643 patent/US9719869B2/en active Active
  • 2016-02-18 KR KR1020160019058A patent/KR102238958B1/ko active Active
  • 2016-02-19 CN CN201610092048.9A patent/CN105914166B/zh active Active
  • 2016-02-19 SG SG10201601246RA patent/SG10201601246RA/en unknown
  • 2016-02-22 TW TW105105095A patent/TWI666712B/zh active

Patent Citations (5)

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