JP6328577B2 - 荷重測定装置および荷重測定方法 - Google Patents

荷重測定装置および荷重測定方法 Download PDF

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Publication number
JP6328577B2
JP6328577B2 JP2015033910A JP2015033910A JP6328577B2 JP 6328577 B2 JP6328577 B2 JP 6328577B2 JP 2015033910 A JP2015033910 A JP 2015033910A JP 2015033910 A JP2015033910 A JP 2015033910A JP 6328577 B2 JP6328577 B2 JP 6328577B2
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Japan
Prior art keywords
load
roll
cleaning tool
substrate
roll cleaning
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Active
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JP2015033910A
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English (en)
Japanese (ja)
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JP2016157778A5 (enExample
JP2016157778A (ja
Inventor
田中　英明
英明 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
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Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to JP2015033910A priority Critical patent/JP6328577B2/ja
Priority to US15/045,643 priority patent/US9719869B2/en
Priority to KR1020160019058A priority patent/KR102238958B1/ko
Priority to CN201610092048.9A priority patent/CN105914166B/zh
Priority to SG10201601246RA priority patent/SG10201601246RA/en
Priority to TW105105095A priority patent/TWI666712B/zh
Publication of JP2016157778A publication Critical patent/JP2016157778A/ja
Publication of JP2016157778A5 publication Critical patent/JP2016157778A5/ja
Application granted granted Critical
Publication of JP6328577B2 publication Critical patent/JP6328577B2/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
    • B08B1/14—Wipes; Absorbent members, e.g. swabs or sponges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • B08B1/34—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members rotating about an axis parallel to the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/04—Measuring force or stress, in general by measuring elastic deformation of gauges, e.g. of springs
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/04—Measuring force or stress, in general by measuring elastic deformation of gauges, e.g. of springs
    • G01L1/048—Measuring force or stress, in general by measuring elastic deformation of gauges, e.g. of springs of torsionally deformable elements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
    • G01L5/0061—Force sensors associated with industrial machines or actuators
    • G01L5/0076—Force sensors associated with manufacturing machines
    • G01L5/0085—Force sensors adapted for insertion between cooperating machine elements, e.g. for measuring the nip force between rollers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Force Measurement Appropriate To Specific Purposes (AREA)
JP2015033910A 2015-02-24 2015-02-24 荷重測定装置および荷重測定方法 Active JP6328577B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2015033910A JP6328577B2 (ja) 2015-02-24 2015-02-24 荷重測定装置および荷重測定方法
US15/045,643 US9719869B2 (en) 2015-02-24 2016-02-17 Load measuring apparatus and load measuring method
KR1020160019058A KR102238958B1 (ko) 2015-02-24 2016-02-18 하중 측정 장치 및 하중 측정 방법
SG10201601246RA SG10201601246RA (en) 2015-02-24 2016-02-19 Load measuring apparatus and load measuring method
CN201610092048.9A CN105914166B (zh) 2015-02-24 2016-02-19 载荷测定装置以及载荷测定方法
TW105105095A TWI666712B (zh) 2015-02-24 2016-02-22 Load measuring device and load measuring method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015033910A JP6328577B2 (ja) 2015-02-24 2015-02-24 荷重測定装置および荷重測定方法

Publications (3)

Publication Number Publication Date
JP2016157778A JP2016157778A (ja) 2016-09-01
JP2016157778A5 JP2016157778A5 (enExample) 2017-12-21
JP6328577B2 true JP6328577B2 (ja) 2018-05-23

Family

ID=56690215

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015033910A Active JP6328577B2 (ja) 2015-02-24 2015-02-24 荷重測定装置および荷重測定方法

Country Status (6)

Country Link
US (1) US9719869B2 (enExample)
JP (1) JP6328577B2 (enExample)
KR (1) KR102238958B1 (enExample)
CN (1) CN105914166B (enExample)
SG (1) SG10201601246RA (enExample)
TW (1) TWI666712B (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6767834B2 (ja) 2016-09-29 2020-10-14 株式会社荏原製作所 基板洗浄装置及び基板処理装置
JP6792512B2 (ja) 2017-05-16 2020-11-25 株式会社荏原製作所 基板洗浄装置および基板処理装置
JP6823541B2 (ja) * 2017-05-30 2021-02-03 株式会社荏原製作所 キャリブレーション方法およびキャリブレーションプログラム
JP7079164B2 (ja) 2018-07-06 2022-06-01 株式会社荏原製作所 基板洗浄装置および基板洗浄方法
CN108955846A (zh) * 2018-08-14 2018-12-07 安徽中联九通机械设备有限公司 一种配料机控制系统
DE102020133121B4 (de) 2019-12-12 2024-06-20 Alfred Schöpf Verfahren und Vorrichtung zur Überlaufmessung einer Flüssigkeit über eine Überlaufkante eines Beckens
JP7093390B2 (ja) * 2020-10-15 2022-06-29 株式会社荏原製作所 基板洗浄装置
CN117772662A (zh) * 2023-12-25 2024-03-29 北京晶亦精微科技股份有限公司 一种基板清洗装置以及清洗方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4248317A (en) * 1979-09-10 1981-02-03 Cardinal Scale Manufacturing Company Load cell apparatus
US4425808A (en) * 1982-02-26 1984-01-17 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Thin film strain transducer
JPS61278724A (ja) * 1985-06-04 1986-12-09 Nippon Kokan Kk <Nkk> 脱水機圧力測定装置
JP3341872B2 (ja) * 1995-04-03 2002-11-05 大日本スクリーン製造株式会社 回転式基板洗浄装置
KR19980022571A (ko) * 1996-09-23 1998-07-06 김광호 반도체 스크러버(Scrubber)장비
JP3540524B2 (ja) * 1996-10-28 2004-07-07 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
JPH10189512A (ja) * 1996-12-26 1998-07-21 Sony Corp 基板洗浄装置
JP2000228382A (ja) * 1999-02-05 2000-08-15 Sony Corp ウエハ洗浄装置
US6579797B1 (en) * 2000-01-25 2003-06-17 Agere Systems Inc. Cleaning brush conditioning apparatus
JP2002051497A (ja) * 2000-07-28 2002-02-15 Mitsumi Electric Co Ltd モータ駆動軸の側圧機構及び側圧機構を備えたモータ
US7743449B2 (en) * 2002-06-28 2010-06-29 Lam Research Corporation System and method for a combined contact and non-contact wafer cleaning module
CN101218665B (zh) * 2005-09-15 2010-09-29 株式会社荏原制作所 清洁元件、基片清洁装置和基片处理装置
FR2931550B1 (fr) 2008-05-20 2012-12-07 Commissariat Energie Atomique Dispositif pour la detection gravimetrique de particules en milieu fluide comprenant un oscillateur entre deux canaux fluidiques, procede de realisation et methode de mise en oeuvre du dispositif
US9312159B2 (en) * 2009-06-09 2016-04-12 Nikon Corporation Transport apparatus and exposure apparatus
US9254510B2 (en) * 2012-02-03 2016-02-09 Stmicroelectronics, Inc. Drying apparatus with exhaust control cap for semiconductor wafers and associated methods
JP5878441B2 (ja) * 2012-08-20 2016-03-08 株式会社荏原製作所 基板洗浄装置及び基板処理装置
JP6262983B2 (ja) 2012-10-25 2018-01-17 株式会社荏原製作所 基板洗浄装置及び基板洗浄方法
JP6279276B2 (ja) * 2013-10-03 2018-02-14 株式会社荏原製作所 基板洗浄装置及び基板処理装置
US9266496B2 (en) * 2013-11-18 2016-02-23 Ford Global Technologies, Llc Flexible electro-resistive impact detection sensor for front rail mounted airbag
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Also Published As

Publication number Publication date
KR102238958B1 (ko) 2021-04-13
US9719869B2 (en) 2017-08-01
TW201631680A (zh) 2016-09-01
US20160243592A1 (en) 2016-08-25
JP2016157778A (ja) 2016-09-01
SG10201601246RA (en) 2016-09-29
CN105914166A (zh) 2016-08-31
KR20160103520A (ko) 2016-09-01
CN105914166B (zh) 2019-03-01
TWI666712B (zh) 2019-07-21

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