SG10201601246RA - Load measuring apparatus and load measuring method - Google Patents

Load measuring apparatus and load measuring method

Info

Publication number
SG10201601246RA
SG10201601246RA SG10201601246RA SG10201601246RA SG10201601246RA SG 10201601246R A SG10201601246R A SG 10201601246RA SG 10201601246R A SG10201601246R A SG 10201601246RA SG 10201601246R A SG10201601246R A SG 10201601246RA SG 10201601246R A SG10201601246R A SG 10201601246RA
Authority
SG
Singapore
Prior art keywords
load measuring
measuring apparatus
measuring method
load
measuring
Prior art date
Application number
SG10201601246RA
Other languages
English (en)
Inventor
Hideaki Tanaka
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10201601246RA publication Critical patent/SG10201601246RA/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00Cleaning by methods involving the use of tools
    • B08B1/10Cleaning by methods involving the use of tools characterised by the type of cleaning tool
    • B08B1/14Wipes; Absorbent members, e.g. swabs or sponges
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00Cleaning by methods involving the use of tools
    • B08B1/30Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • B08B1/34Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members rotating about an axis parallel to the surface
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B13/00Accessories or details of general applicability for machines or apparatus for cleaning
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00Measuring force or stress, in general
    • G01L1/04Measuring force or stress, in general by measuring elastic deformation of gauges, e.g. of springs
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00Measuring force or stress, in general
    • G01L1/04Measuring force or stress, in general by measuring elastic deformation of gauges, e.g. of springs
    • G01L1/048Measuring force or stress, in general by measuring elastic deformation of gauges, e.g. of springs of torsionally deformable elements
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L5/00Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
    • G01L5/0061Force sensors associated with industrial machines or actuators
    • G01L5/0076Force sensors associated with manufacturing machines
    • G01L5/0085Force sensors adapted for insertion between cooperating machine elements, e.g. for measuring the nip force between rollers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Force Measurement Appropriate To Specific Purposes (AREA)
SG10201601246RA 2015-02-24 2016-02-19 Load measuring apparatus and load measuring method SG10201601246RA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015033910A JP6328577B2 (ja) 2015-02-24 2015-02-24 荷重測定装置および荷重測定方法

Publications (1)

Publication Number Publication Date
SG10201601246RA true SG10201601246RA (en) 2016-09-29

Family

ID=56690215

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201601246RA SG10201601246RA (en) 2015-02-24 2016-02-19 Load measuring apparatus and load measuring method

Country Status (6)

Country Link
US (1) US9719869B2 (enExample)
JP (1) JP6328577B2 (enExample)
KR (1) KR102238958B1 (enExample)
CN (1) CN105914166B (enExample)
SG (1) SG10201601246RA (enExample)
TW (1) TWI666712B (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6767834B2 (ja) 2016-09-29 2020-10-14 株式会社荏原製作所 基板洗浄装置及び基板処理装置
JP6792512B2 (ja) 2017-05-16 2020-11-25 株式会社荏原製作所 基板洗浄装置および基板処理装置
JP6823541B2 (ja) * 2017-05-30 2021-02-03 株式会社荏原製作所 キャリブレーション方法およびキャリブレーションプログラム
JP7079164B2 (ja) 2018-07-06 2022-06-01 株式会社荏原製作所 基板洗浄装置および基板洗浄方法
CN108955846A (zh) * 2018-08-14 2018-12-07 安徽中联九通机械设备有限公司 一种配料机控制系统
DE102020133121B4 (de) 2019-12-12 2024-06-20 Alfred Schöpf Verfahren und Vorrichtung zur Überlaufmessung einer Flüssigkeit über eine Überlaufkante eines Beckens
JP7093390B2 (ja) * 2020-10-15 2022-06-29 株式会社荏原製作所 基板洗浄装置
CN117772662A (zh) * 2023-12-25 2024-03-29 北京晶亦精微科技股份有限公司 一种基板清洗装置以及清洗方法

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US4248317A (en) * 1979-09-10 1981-02-03 Cardinal Scale Manufacturing Company Load cell apparatus
US4425808A (en) * 1982-02-26 1984-01-17 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Thin film strain transducer
JPS61278724A (ja) * 1985-06-04 1986-12-09 Nippon Kokan Kk <Nkk> 脱水機圧力測定装置
JP3341872B2 (ja) * 1995-04-03 2002-11-05 大日本スクリーン製造株式会社 回転式基板洗浄装置
KR19980022571A (ko) * 1996-09-23 1998-07-06 김광호 반도체 스크러버(Scrubber)장비
JP3540524B2 (ja) * 1996-10-28 2004-07-07 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
JPH10189512A (ja) * 1996-12-26 1998-07-21 Sony Corp 基板洗浄装置
JP2000228382A (ja) * 1999-02-05 2000-08-15 Sony Corp ウエハ洗浄装置
US6579797B1 (en) * 2000-01-25 2003-06-17 Agere Systems Inc. Cleaning brush conditioning apparatus
JP2002051497A (ja) * 2000-07-28 2002-02-15 Mitsumi Electric Co Ltd モータ駆動軸の側圧機構及び側圧機構を備えたモータ
US7743449B2 (en) * 2002-06-28 2010-06-29 Lam Research Corporation System and method for a combined contact and non-contact wafer cleaning module
CN101218665B (zh) * 2005-09-15 2010-09-29 株式会社荏原制作所 清洁元件、基片清洁装置和基片处理装置
FR2931550B1 (fr) 2008-05-20 2012-12-07 Commissariat Energie Atomique Dispositif pour la detection gravimetrique de particules en milieu fluide comprenant un oscillateur entre deux canaux fluidiques, procede de realisation et methode de mise en oeuvre du dispositif
US9312159B2 (en) * 2009-06-09 2016-04-12 Nikon Corporation Transport apparatus and exposure apparatus
US9254510B2 (en) * 2012-02-03 2016-02-09 Stmicroelectronics, Inc. Drying apparatus with exhaust control cap for semiconductor wafers and associated methods
JP5878441B2 (ja) * 2012-08-20 2016-03-08 株式会社荏原製作所 基板洗浄装置及び基板処理装置
JP6262983B2 (ja) 2012-10-25 2018-01-17 株式会社荏原製作所 基板洗浄装置及び基板洗浄方法
JP6279276B2 (ja) * 2013-10-03 2018-02-14 株式会社荏原製作所 基板洗浄装置及び基板処理装置
US9266496B2 (en) * 2013-11-18 2016-02-23 Ford Global Technologies, Llc Flexible electro-resistive impact detection sensor for front rail mounted airbag
KR102454775B1 (ko) * 2015-02-18 2022-10-17 가부시키가이샤 에바라 세이사꾸쇼 기판 세정 장치, 기판 세정 방법 및 기판 처리 장치

Also Published As

Publication number Publication date
KR102238958B1 (ko) 2021-04-13
US9719869B2 (en) 2017-08-01
TW201631680A (zh) 2016-09-01
US20160243592A1 (en) 2016-08-25
JP2016157778A (ja) 2016-09-01
JP6328577B2 (ja) 2018-05-23
CN105914166A (zh) 2016-08-31
KR20160103520A (ko) 2016-09-01
CN105914166B (zh) 2019-03-01
TWI666712B (zh) 2019-07-21

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