TWI665170B - 半導體用支撐玻璃基板及用其的積層基板 - Google Patents

半導體用支撐玻璃基板及用其的積層基板 Download PDF

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Publication number
TWI665170B
TWI665170B TW105106421A TW105106421A TWI665170B TW I665170 B TWI665170 B TW I665170B TW 105106421 A TW105106421 A TW 105106421A TW 105106421 A TW105106421 A TW 105106421A TW I665170 B TWI665170 B TW I665170B
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TW
Taiwan
Prior art keywords
glass substrate
semiconductor
substrate
less
supporting
Prior art date
Application number
TW105106421A
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English (en)
Chinese (zh)
Other versions
TW201704181A (zh
Inventor
柳瀬智基
Original Assignee
日商日本電氣硝子股份有限公司
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Application filed by 日商日本電氣硝子股份有限公司 filed Critical 日商日本電氣硝子股份有限公司
Publication of TW201704181A publication Critical patent/TW201704181A/zh
Application granted granted Critical
Publication of TWI665170B publication Critical patent/TWI665170B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15—Ceramic or glass substrates
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C19/00—Surface treatment of glass, not in the form of fibres or filaments, by mechanical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Surface Treatment Of Glass (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Glass Compositions (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Liquid Crystal (AREA)
TW105106421A 2015-03-10 2016-03-03 半導體用支撐玻璃基板及用其的積層基板 TWI665170B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015046782 2015-03-10
JP2015-046782 2015-03-10

Publications (2)

Publication Number Publication Date
TW201704181A TW201704181A (zh) 2017-02-01
TWI665170B true TWI665170B (zh) 2019-07-11

Family

ID=56880031

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105106421A TWI665170B (zh) 2015-03-10 2016-03-03 半導體用支撐玻璃基板及用其的積層基板

Country Status (5)

Country Link
JP (2) JP6663596B2 (ja)
KR (2) KR102419729B1 (ja)
CN (1) CN107108344A (ja)
TW (1) TWI665170B (ja)
WO (1) WO2016143583A1 (ja)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018095514A (ja) * 2016-12-14 2018-06-21 日本電気硝子株式会社 支持ガラス基板及びこれを用いた積層体
TWI771375B (zh) * 2017-02-24 2022-07-21 美商康寧公司 高寬高比玻璃晶圓
SG11201907847WA (en) * 2017-02-28 2019-09-27 Corning Inc Glass article with reduced thickness variation, method for making and apparatus therefor
WO2018207794A1 (ja) * 2017-05-12 2018-11-15 Ａｇｃ株式会社 ガラス基板、およびガラス基板の製造方法
JP7045647B2 (ja) * 2017-11-13 2022-04-01 日本電気硝子株式会社 ガラス基板
JP7115932B2 (ja) * 2018-08-14 2022-08-09 株式会社ディスコ 被加工物の加工方法
JP2020131552A (ja) * 2019-02-20 2020-08-31 株式会社東芝 キャリアおよび半導体装置の製造方法
CN110677932B (zh) * 2019-09-10 2021-06-25 博宇（天津）半导体材料有限公司 一种陶瓷加热器支撑基体及陶瓷加热器
JPWO2022019211A1 (ja) * 2020-07-22 2022-01-27
KR20240023733A (ko) 2022-08-16 2024-02-23 에이치엘만도 주식회사 코일 조립체 및 이를 포함하는 전자제어장치

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103373818A (zh) * 2012-04-17 2013-10-30 安瀚视特控股株式会社 显示器用玻璃基板的制造方法、玻璃基板以及显示器用面板
TW201500316A (zh) * 2013-05-24 2015-01-01 Nippon Electric Glass Co 強化玻璃板的製造方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3616610B2 (ja) * 1998-08-19 2005-02-02 Ｈｏｙａ株式会社 磁気記録媒体用ガラス基板、磁気記録媒体及びそれらの製造方法
JP3910926B2 (ja) 2003-02-26 2007-04-25 株式会社東芝 表示装置用透明基板の製造方法
JP4378769B2 (ja) * 2003-09-18 2009-12-09 日本電気硝子株式会社 ガラス基板
JP2009013046A (ja) * 2007-06-05 2009-01-22 Asahi Glass Co Ltd ガラス基板表面を加工する方法
JP2010070415A (ja) * 2008-09-18 2010-04-02 Tokyo Ohka Kogyo Co Ltd 加工ガラス基板の製造方法
JP2010245084A (ja) * 2009-04-01 2010-10-28 Sanyo Electric Co Ltd 半導体装置及びその製造方法
JP5780487B2 (ja) * 2009-06-01 2015-09-16 日本電気硝子株式会社 ガラス基板の製造方法
US9676649B2 (en) * 2011-08-26 2017-06-13 Corning Incorporated Glass substrates with strategically imprinted B-side features and methods for manufacturing the same
US9082764B2 (en) * 2012-03-05 2015-07-14 Corning Incorporated Three-dimensional integrated circuit which incorporates a glass interposer and method for fabricating the same
KR101522452B1 (ko) * 2012-04-17 2015-05-21 아반스트레이트 가부시키가이샤 디스플레이용 글래스 기판의 제조 방법, 글래스 기판 및 디스플레이용 패널
JP5911750B2 (ja) * 2012-05-14 2016-04-27 アルバック成膜株式会社 ウェハ支持体およびその製造方法
JP5399542B2 (ja) * 2012-08-08 2014-01-29 富士通株式会社 半導体装置の製造方法
JP2014201446A (ja) * 2013-03-31 2014-10-27 ＡｖａｎＳｔｒａｔｅ株式会社 ディスプレイ用ガラス基板及びその製造方法、並びにディスプレイ用パネルの製造方法
WO2014163188A1 (ja) * 2013-04-04 2014-10-09 富士電機株式会社 半導体デバイスの製造方法
JP6593669B2 (ja) * 2013-09-12 2019-10-23 日本電気硝子株式会社 支持ガラス基板及びこれを用いた搬送体
SG11201702158SA (en) * 2014-09-25 2017-04-27 Nippon Electric Glass Co Supporting glass substrate and laminate using same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103373818A (zh) * 2012-04-17 2013-10-30 安瀚视特控股株式会社 显示器用玻璃基板的制造方法、玻璃基板以及显示器用面板
TW201500316A (zh) * 2013-05-24 2015-01-01 Nippon Electric Glass Co 強化玻璃板的製造方法

Also Published As

Publication number Publication date
JP6930570B2 (ja) 2021-09-01
KR20170124524A (ko) 2017-11-10
TW201704181A (zh) 2017-02-01
KR102508645B1 (ko) 2023-03-10
JP2020037512A (ja) 2020-03-12
KR102419729B1 (ko) 2022-07-12
KR20220101754A (ko) 2022-07-19
WO2016143583A1 (ja) 2016-09-15
JP6663596B2 (ja) 2020-03-13
CN107108344A (zh) 2017-08-29
JPWO2016143583A1 (ja) 2018-02-22

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