KR102419729B1 - 반도체용 지지 유리 기판 및 이것을 사용한 적층 기판 - Google Patents

반도체용 지지 유리 기판 및 이것을 사용한 적층 기판 Download PDF

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Publication number
KR102419729B1
KR102419729B1 KR1020177015503A KR20177015503A KR102419729B1 KR 102419729 B1 KR102419729 B1 KR 102419729B1 KR 1020177015503 A KR1020177015503 A KR 1020177015503A KR 20177015503 A KR20177015503 A KR 20177015503A KR 102419729 B1 KR102419729 B1 KR 102419729B1
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KR
South Korea
Prior art keywords
glass substrate
substrate
semiconductors
semiconductor
support glass
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KR1020177015503A
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English (en)
Korean (ko)
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KR20170124524A (ko
Inventor
토모키 야나세
Original Assignee
니폰 덴키 가라스 가부시키가이샤
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Application filed by 니폰 덴키 가라스 가부시키가이샤 filed Critical 니폰 덴키 가라스 가부시키가이샤
Priority to KR1020227023203A priority Critical patent/KR102508645B1/ko
Publication of KR20170124524A publication Critical patent/KR20170124524A/ko
Application granted granted Critical
Publication of KR102419729B1 publication Critical patent/KR102419729B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15—Ceramic or glass substrates
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C19/00—Surface treatment of glass, not in the form of fibres or filaments, by mechanical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Surface Treatment Of Glass (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Glass Compositions (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Liquid Crystal (AREA)
KR1020177015503A 2015-03-10 2016-02-29 반도체용 지지 유리 기판 및 이것을 사용한 적층 기판 KR102419729B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020227023203A KR102508645B1 (ko) 2015-03-10 2016-02-29 반도체용 지지 유리 기판 및 이것을 사용한 적층 기판

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015046782 2015-03-10
JPJP-P-2015-046782 2015-03-10
PCT/JP2016/056076 WO2016143583A1 (ja) 2015-03-10 2016-02-29 半導体用支持ガラス基板及びこれを用いた積層基板

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020227023203A Division KR102508645B1 (ko) 2015-03-10 2016-02-29 반도체용 지지 유리 기판 및 이것을 사용한 적층 기판

Publications (2)

Publication Number Publication Date
KR20170124524A KR20170124524A (ko) 2017-11-10
KR102419729B1 true KR102419729B1 (ko) 2022-07-12

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ID=56880031

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020177015503A KR102419729B1 (ko) 2015-03-10 2016-02-29 반도체용 지지 유리 기판 및 이것을 사용한 적층 기판
KR1020227023203A KR102508645B1 (ko) 2015-03-10 2016-02-29 반도체용 지지 유리 기판 및 이것을 사용한 적층 기판

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020227023203A KR102508645B1 (ko) 2015-03-10 2016-02-29 반도체용 지지 유리 기판 및 이것을 사용한 적층 기판

Country Status (5)

Country Link
JP (2) JP6663596B2 (ja)
KR (2) KR102419729B1 (ja)
CN (1) CN107108344A (ja)
TW (1) TWI665170B (ja)
WO (1) WO2016143583A1 (ja)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018095514A (ja) * 2016-12-14 2018-06-21 日本電気硝子株式会社 支持ガラス基板及びこれを用いた積層体
TWI771375B (zh) * 2017-02-24 2022-07-21 美商康寧公司 高寬高比玻璃晶圓
SG11201907847WA (en) * 2017-02-28 2019-09-27 Corning Inc Glass article with reduced thickness variation, method for making and apparatus therefor
WO2018207794A1 (ja) * 2017-05-12 2018-11-15 Ａｇｃ株式会社 ガラス基板、およびガラス基板の製造方法
JP7045647B2 (ja) * 2017-11-13 2022-04-01 日本電気硝子株式会社 ガラス基板
JP7115932B2 (ja) * 2018-08-14 2022-08-09 株式会社ディスコ 被加工物の加工方法
JP2020131552A (ja) * 2019-02-20 2020-08-31 株式会社東芝 キャリアおよび半導体装置の製造方法
CN110677932B (zh) * 2019-09-10 2021-06-25 博宇（天津）半导体材料有限公司 一种陶瓷加热器支撑基体及陶瓷加热器
JPWO2022019211A1 (ja) * 2020-07-22 2022-01-27
KR20240023733A (ko) 2022-08-16 2024-02-23 에이치엘만도 주식회사 코일 조립체 및 이를 포함하는 전자제어장치

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004258380A (ja) 2003-02-26 2004-09-16 Toshiba Corp 表示装置および表示装置用透明基板の製造方法
JP2010245084A (ja) * 2009-04-01 2010-10-28 Sanyo Electric Co Ltd 半導体装置及びその製造方法

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Publication number Priority date Publication date Assignee Title
JP3616610B2 (ja) * 1998-08-19 2005-02-02 Ｈｏｙａ株式会社 磁気記録媒体用ガラス基板、磁気記録媒体及びそれらの製造方法
JP4378769B2 (ja) * 2003-09-18 2009-12-09 日本電気硝子株式会社 ガラス基板
JP2009013046A (ja) * 2007-06-05 2009-01-22 Asahi Glass Co Ltd ガラス基板表面を加工する方法
JP2010070415A (ja) * 2008-09-18 2010-04-02 Tokyo Ohka Kogyo Co Ltd 加工ガラス基板の製造方法
JP5780487B2 (ja) * 2009-06-01 2015-09-16 日本電気硝子株式会社 ガラス基板の製造方法
US9676649B2 (en) * 2011-08-26 2017-06-13 Corning Incorporated Glass substrates with strategically imprinted B-side features and methods for manufacturing the same
US9082764B2 (en) * 2012-03-05 2015-07-14 Corning Incorporated Three-dimensional integrated circuit which incorporates a glass interposer and method for fabricating the same
CN103373818B (zh) * 2012-04-17 2017-05-17 安瀚视特控股株式会社 显示器用玻璃基板的制造方法、玻璃基板以及显示器用面板
KR101522452B1 (ko) * 2012-04-17 2015-05-21 아반스트레이트 가부시키가이샤 디스플레이용 글래스 기판의 제조 방법, 글래스 기판 및 디스플레이용 패널
JP5911750B2 (ja) * 2012-05-14 2016-04-27 アルバック成膜株式会社 ウェハ支持体およびその製造方法
JP5399542B2 (ja) * 2012-08-08 2014-01-29 富士通株式会社 半導体装置の製造方法
JP2014201446A (ja) * 2013-03-31 2014-10-27 ＡｖａｎＳｔｒａｔｅ株式会社 ディスプレイ用ガラス基板及びその製造方法、並びにディスプレイ用パネルの製造方法
WO2014163188A1 (ja) * 2013-04-04 2014-10-09 富士電機株式会社 半導体デバイスの製造方法
US10329193B2 (en) * 2013-05-24 2019-06-25 Nippon Electric Glass Co., Ltd. Method for producing toughened glass plate
JP6593669B2 (ja) * 2013-09-12 2019-10-23 日本電気硝子株式会社 支持ガラス基板及びこれを用いた搬送体
SG11201702158SA (en) * 2014-09-25 2017-04-27 Nippon Electric Glass Co Supporting glass substrate and laminate using same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004258380A (ja) 2003-02-26 2004-09-16 Toshiba Corp 表示装置および表示装置用透明基板の製造方法
JP2010245084A (ja) * 2009-04-01 2010-10-28 Sanyo Electric Co Ltd 半導体装置及びその製造方法

Also Published As

Publication number Publication date
JP6930570B2 (ja) 2021-09-01
KR20170124524A (ko) 2017-11-10
TW201704181A (zh) 2017-02-01
KR102508645B1 (ko) 2023-03-10
JP2020037512A (ja) 2020-03-12
KR20220101754A (ko) 2022-07-19
WO2016143583A1 (ja) 2016-09-15
JP6663596B2 (ja) 2020-03-13
CN107108344A (zh) 2017-08-29
JPWO2016143583A1 (ja) 2018-02-22
TWI665170B (zh) 2019-07-11

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