TWI659551B - 發光裝置及其製造方法 - Google Patents
發光裝置及其製造方法 Download PDFInfo
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- TWI659551B TWI659551B TW103113487A TW103113487A TWI659551B TW I659551 B TWI659551 B TW I659551B TW 103113487 A TW103113487 A TW 103113487A TW 103113487 A TW103113487 A TW 103113487A TW I659551 B TWI659551 B TW I659551B
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- light emitting
- semiconductor light
- emitting devices
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- wavelength conversion
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
- H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
- H10H20/013—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials
- H10H20/0133—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials with a substrate not being Group III-V materials
- H10H20/01335—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials with a substrate not being Group III-V materials the light-emitting regions comprising nitride materials
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
- H10H20/018—Bonding of wafers
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/811—Bodies having quantum effect structures or superlattices, e.g. tunnel junctions
- H10H20/812—Bodies having quantum effect structures or superlattices, e.g. tunnel junctions within the light-emitting regions, e.g. having quantum confinement structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/822—Materials of the light-emitting regions
- H10H20/824—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
- H10H20/825—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP containing nitrogen, e.g. GaN
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
- H10H20/841—Reflective coatings, e.g. dielectric Bragg reflectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
- H10H20/8512—Wavelength conversion materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
- H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/862—Resonant cavity structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/034—Manufacture or treatment of coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
- H10H20/0361—Manufacture or treatment of packages of wavelength conversion means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
- H10H20/0362—Manufacture or treatment of packages of encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
- H10H20/0364—Manufacture or treatment of packages of interconnections
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/882—Scattering means
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361810833P | 2013-04-11 | 2013-04-11 | |
| US61/810,833 | 2013-04-11 | ||
| US201361900466P | 2013-11-06 | 2013-11-06 | |
| US61/900,466 | 2013-11-06 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201501366A TW201501366A (zh) | 2015-01-01 |
| TWI659551B true TWI659551B (zh) | 2019-05-11 |
Family
ID=51690078
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW103113487A TWI659551B (zh) | 2013-04-11 | 2014-04-11 | 發光裝置及其製造方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US9871167B2 (enExample) |
| EP (1) | EP2984685B1 (enExample) |
| JP (2) | JP6680670B2 (enExample) |
| KR (1) | KR102245056B1 (enExample) |
| CN (3) | CN105378950A (enExample) |
| TW (1) | TWI659551B (enExample) |
| WO (1) | WO2014167455A2 (enExample) |
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| JP7068771B2 (ja) * | 2013-07-08 | 2022-05-17 | ルミレッズ ホールディング ベーフェー | 波長変換式半導体発光デバイス |
| CN113658943A (zh) | 2013-12-13 | 2021-11-16 | 晶元光电股份有限公司 | 发光装置及其制作方法 |
| DE102014101492A1 (de) * | 2014-02-06 | 2015-08-06 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauelement |
| US20160225962A1 (en) * | 2015-01-30 | 2016-08-04 | Empire Technology Development Llc | Nanoparticle gradient refractive index encapsulants for semi-conductor diodes |
| JP6832282B2 (ja) * | 2015-02-18 | 2021-02-24 | ルミレッズ ホールディング ベーフェー | 複数の積み重ねられた発光デバイスを有するデバイス |
| DE102015107593A1 (de) * | 2015-05-13 | 2016-11-17 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterchip und Leuchtmittel |
| WO2017023502A1 (en) * | 2015-08-03 | 2017-02-09 | Koninklijke Philips N.V. | Semiconductor light emitting device with reflective side coating |
| US9753277B2 (en) | 2015-08-11 | 2017-09-05 | Delta Electronics, Inc. | Wavelength conversion device |
| JP6327220B2 (ja) * | 2015-08-31 | 2018-05-23 | 日亜化学工業株式会社 | 発光装置 |
| WO2017052800A1 (en) * | 2015-09-25 | 2017-03-30 | Koninklijke Philips N.V. | Surface emitter with light-emitting area equal to the led top surface and its fabrication |
| TWI587543B (zh) * | 2015-12-15 | 2017-06-11 | 李乃義 | 發光二極體封裝結構及其製造方法 |
| EP3398211B1 (en) * | 2015-12-29 | 2020-07-29 | Lumileds Holding B.V. | Flip chip led with side reflectors and phosphor |
| JP6974324B2 (ja) * | 2015-12-29 | 2021-12-01 | ルミレッズ ホールディング ベーフェー | 側面反射器と蛍光体とを備えるフリップチップled |
| FR3056014B1 (fr) * | 2016-09-15 | 2020-05-29 | Valeo Vision | Procede pour creer une isolation optique entre des pixels d'une matrice de sources lumineuses semi-conductrices |
| FR3061358B1 (fr) * | 2016-12-27 | 2021-06-11 | Aledia | Procede de fabrication d’un dispositif optoelectronique comportant des plots photoluminescents de photoresine |
| JP6699580B2 (ja) | 2017-02-09 | 2020-05-27 | 日亜化学工業株式会社 | 発光装置 |
| JP6662322B2 (ja) | 2017-02-09 | 2020-03-11 | 日亜化学工業株式会社 | 発光装置 |
| US10546985B2 (en) * | 2017-03-28 | 2020-01-28 | Nanosys, Inc. | Method for increasing the light output of microLED devices using quantum dots |
| US10224358B2 (en) * | 2017-05-09 | 2019-03-05 | Lumileds Llc | Light emitting device with reflective sidewall |
| JP6699634B2 (ja) | 2017-07-28 | 2020-05-27 | 日亜化学工業株式会社 | 発光装置の製造方法 |
| US11355548B2 (en) | 2017-12-20 | 2022-06-07 | Lumileds Llc | Monolithic segmented LED array architecture |
| US20190198564A1 (en) * | 2017-12-20 | 2019-06-27 | Lumileds Llc | Monolithic segmented led array architecture with islanded epitaxial growth |
| US10854794B2 (en) * | 2017-12-20 | 2020-12-01 | Lumileds Llc | Monolithic LED array structure |
| US11296262B2 (en) * | 2017-12-21 | 2022-04-05 | Lumileds Llc | Monolithic segmented LED array architecture with reduced area phosphor emission surface |
| US20190198720A1 (en) * | 2017-12-22 | 2019-06-27 | Lumileds Llc | Particle systems and patterning for monolithic led arrays |
| US11201267B2 (en) * | 2018-12-21 | 2021-12-14 | Lumileds Llc | Photoresist patterning process supporting two step phosphor-deposition to form an LED matrix array |
| US20240213401A1 (en) * | 2022-12-21 | 2024-06-27 | Creeled, Inc. | Textured lumiphore layer to improve light extraction for light-emitting diode chips and related methods |
| CN118899327A (zh) * | 2023-05-05 | 2024-11-05 | 北京字跳网络技术有限公司 | Micro/Nano LED装置及其制备方法 |
| CN117558851A (zh) * | 2024-01-05 | 2024-02-13 | 晶能光电股份有限公司 | 发光装置及其制备方法、发光阵列结构 |
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| JP2012084622A (ja) * | 2010-10-08 | 2012-04-26 | Citizen Holdings Co Ltd | 半導体発光素子の製造方法 |
| JP5508244B2 (ja) * | 2010-11-15 | 2014-05-28 | シチズンホールディングス株式会社 | 半導体発光装置の製造方法 |
| JP2012142410A (ja) * | 2010-12-28 | 2012-07-26 | Rohm Co Ltd | 発光素子ユニットおよびその製造方法、発光素子パッケージならびに照明装置 |
| JP5962102B2 (ja) * | 2011-03-24 | 2016-08-03 | 日亜化学工業株式会社 | 発光装置及びその製造方法 |
| JP5745319B2 (ja) * | 2011-04-14 | 2015-07-08 | 日東電工株式会社 | 蛍光反射シート、および、発光ダイオード装置の製造方法 |
| JP5670249B2 (ja) * | 2011-04-14 | 2015-02-18 | 日東電工株式会社 | 発光素子転写シートの製造方法、発光装置の製造方法、発光素子転写シートおよび発光装置 |
| JP5840377B2 (ja) * | 2011-04-14 | 2016-01-06 | 日東電工株式会社 | 反射樹脂シートおよび発光ダイオード装置の製造方法 |
| KR20140022019A (ko) * | 2011-04-20 | 2014-02-21 | 가부시키가이샤 에루므 | 발광장치 및 그 제조방법 |
| JP5619680B2 (ja) * | 2011-06-03 | 2014-11-05 | シチズンホールディングス株式会社 | 半導体発光素子の製造方法 |
| JP2013016588A (ja) * | 2011-07-01 | 2013-01-24 | Citizen Electronics Co Ltd | Led発光装置 |
-
2014
- 2014-03-31 JP JP2016507081A patent/JP6680670B2/ja active Active
- 2014-03-31 KR KR1020157032326A patent/KR102245056B1/ko active Active
- 2014-03-31 US US14/783,780 patent/US9871167B2/en active Active
- 2014-03-31 CN CN201480033532.3A patent/CN105378950A/zh active Pending
- 2014-03-31 EP EP14716970.0A patent/EP2984685B1/en active Active
- 2014-03-31 CN CN202010279869.XA patent/CN111613708B/zh active Active
- 2014-03-31 CN CN202010280757.6A patent/CN111628062A/zh active Pending
- 2014-03-31 WO PCT/IB2014/060310 patent/WO2014167455A2/en not_active Ceased
- 2014-04-11 TW TW103113487A patent/TWI659551B/zh active
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2019
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6229160B1 (en) * | 1997-06-03 | 2001-05-08 | Lumileds Lighting, U.S., Llc | Light extraction from a semiconductor light-emitting device via chip shaping |
| US7789531B2 (en) * | 2006-10-02 | 2010-09-07 | Illumitex, Inc. | LED system and method |
| US20100279437A1 (en) * | 2009-05-01 | 2010-11-04 | Koninklijke Philips Electronics N.V. | Controlling edge emission in package-free led die |
Also Published As
| Publication number | Publication date |
|---|---|
| EP2984685B1 (en) | 2018-12-19 |
| WO2014167455A3 (en) | 2015-01-08 |
| CN111628062A (zh) | 2020-09-04 |
| CN111613708B (zh) | 2024-09-20 |
| KR102245056B1 (ko) | 2021-04-27 |
| US9871167B2 (en) | 2018-01-16 |
| WO2014167455A2 (en) | 2014-10-16 |
| US20160240735A1 (en) | 2016-08-18 |
| JP6933691B2 (ja) | 2021-09-08 |
| KR20150142033A (ko) | 2015-12-21 |
| JP2016518713A (ja) | 2016-06-23 |
| CN105378950A (zh) | 2016-03-02 |
| CN111613708A (zh) | 2020-09-01 |
| JP6680670B2 (ja) | 2020-04-15 |
| JP2019192946A (ja) | 2019-10-31 |
| EP2984685A2 (en) | 2016-02-17 |
| TW201501366A (zh) | 2015-01-01 |
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