TWI650203B - 板狀工作件之搬出方法 - Google Patents

板狀工作件之搬出方法 Download PDF

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Publication number
TWI650203B
TWI650203B TW104116808A TW104116808A TWI650203B TW I650203 B TWI650203 B TW I650203B TW 104116808 A TW104116808 A TW 104116808A TW 104116808 A TW104116808 A TW 104116808A TW I650203 B TWI650203 B TW I650203B
Authority
TW
Taiwan
Prior art keywords
plate
work piece
shaped work
suction
washing water
Prior art date
Application number
TW104116808A
Other languages
English (en)
Chinese (zh)
Other versions
TW201603948A (zh
Inventor
山端一郎
浦山孝世
Original Assignee
日商迪思科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商迪思科股份有限公司 filed Critical 日商迪思科股份有限公司
Publication of TW201603948A publication Critical patent/TW201603948A/zh
Application granted granted Critical
Publication of TWI650203B publication Critical patent/TWI650203B/zh

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00Component parts such as frames, beds, carriages, headstocks
    • B24B41/06Work supports, e.g. adjustable steadies
    • B24B41/068Table-like supports for panels, sheets or the like
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00Component parts such as frames, beds, carriages, headstocks
    • B24B41/005Feeding or manipulating devices specially adapted to grinding machines

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW104116808A 2014-07-01 2015-05-26 板狀工作件之搬出方法 TWI650203B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014-135788 2014-07-01
JP2014135788A JP6309371B2 (ja) 2014-07-01 2014-07-01 板状ワークの搬出方法

Publications (2)

Publication Number Publication Date
TW201603948A TW201603948A (zh) 2016-02-01
TWI650203B true TWI650203B (zh) 2019-02-11

Family

ID=55169675

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104116808A TWI650203B (zh) 2014-07-01 2015-05-26 板狀工作件之搬出方法

Country Status (4)

Country Link
JP (1) JP6309371B2 (ja)
KR (1) KR102185240B1 (ja)
CN (1) CN105313008B (ja)
TW (1) TWI650203B (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6902872B2 (ja) * 2017-01-10 2021-07-14 東京エレクトロン株式会社 基板処理システムおよび基板処理方法
JP6535066B2 (ja) 2017-11-09 2019-06-26 株式会社アマダホールディングス 製品取り出し装置,製品搬出装置,及び製品取り出し方法
JP2021062418A (ja) * 2019-10-10 2021-04-22 株式会社ディスコ 加工装置
CN111266958B (zh) * 2020-03-20 2021-12-07 谢辉 一种麻将桌圆形玻璃打磨装置
CN112548450A (zh) * 2020-12-01 2021-03-26 中国建筑材料科学研究总院有限公司 超薄片固定装置及方法
CN112548736A (zh) * 2020-12-03 2021-03-26 范彬彬 一种铝合金基板的处理机构

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003023417A (ja) * 2001-07-10 2003-01-24 Matsushita Electric Ind Co Ltd 同期クロック発生回路、および同期クロック発生装置
JP2014086485A (ja) * 2012-10-22 2014-05-12 Disco Abrasive Syst Ltd 搬送方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0671689B2 (ja) * 1985-11-27 1994-09-14 株式会社日立製作所 研磨、研削用真空吸着装置
JPH05305560A (ja) * 1992-04-30 1993-11-19 Toshiba Corp 精密研削装置および精密研削方法
JP2000195926A (ja) * 1998-12-25 2000-07-14 Disco Abrasive Syst Ltd ウェ―ハ搬送装置
JP4480813B2 (ja) * 1999-07-28 2010-06-16 株式会社ディスコ 加工方法
JP4417525B2 (ja) * 2000-04-28 2010-02-17 株式会社ディスコ 研削装置
JP2003234317A (ja) * 2002-02-07 2003-08-22 Okamoto Machine Tool Works Ltd ユニバ−サルチャック用ウエハ取付板
JP2003257909A (ja) * 2002-03-04 2003-09-12 Nippei Toyama Corp 半導体ウェーハの加工装置
JP2004319885A (ja) * 2003-04-18 2004-11-11 Disco Abrasive Syst Ltd チャックテーブル及び半導体ウェーハの研削方法
JP2009056518A (ja) * 2007-08-30 2009-03-19 Kyocera Corp 吸着装置およびそれを備えた加工システムならびに加工方法
JP5270179B2 (ja) * 2008-01-18 2013-08-21 株式会社ディスコ 研削装置
KR101036605B1 (ko) * 2008-06-30 2011-05-24 세메스 주식회사 기판 지지 유닛 및 이를 이용한 매엽식 기판 연마 장치
JP5730071B2 (ja) * 2011-02-25 2015-06-03 京セラ株式会社 吸着用部材
CN103084969B (zh) * 2011-11-01 2015-09-09 中芯国际集成电路制造(上海)有限公司 一种化学机械研磨设备
JP5914062B2 (ja) 2012-03-09 2016-05-11 株式会社ディスコ 板状ワークの保持解除方法及び加工装置
CN203003672U (zh) * 2012-12-27 2013-06-19 苏州珈玛自动化科技有限公司 内置真空发生器的新型工装吸附治具

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003023417A (ja) * 2001-07-10 2003-01-24 Matsushita Electric Ind Co Ltd 同期クロック発生回路、および同期クロック発生装置
JP2014086485A (ja) * 2012-10-22 2014-05-12 Disco Abrasive Syst Ltd 搬送方法

Also Published As

Publication number Publication date
JP2016013585A (ja) 2016-01-28
JP6309371B2 (ja) 2018-04-11
KR20160003570A (ko) 2016-01-11
CN105313008B (zh) 2019-04-19
CN105313008A (zh) 2016-02-10
KR102185240B1 (ko) 2020-12-01
TW201603948A (zh) 2016-02-01

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