TWI645759B - 印刷配線板用表面處理銅箔、印刷配線板用覆銅積層板及印刷配線板 - Google Patents

印刷配線板用表面處理銅箔、印刷配線板用覆銅積層板及印刷配線板 Download PDF

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Publication number
TWI645759B
TWI645759B TW105140617A TW105140617A TWI645759B TW I645759 B TWI645759 B TW I645759B TW 105140617 A TW105140617 A TW 105140617A TW 105140617 A TW105140617 A TW 105140617A TW I645759 B TWI645759 B TW I645759B
Authority
TW
Taiwan
Prior art keywords
copper foil
printed wiring
wiring board
coupling agent
roughened
Prior art date
Application number
TW105140617A
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English (en)
Chinese (zh)
Other versions
TW201735754A (zh
Inventor
齋藤貴広
繪面健
Original Assignee
古河電氣工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 古河電氣工業股份有限公司 filed Critical 古河電氣工業股份有限公司
Publication of TW201735754A publication Critical patent/TW201735754A/zh
Application granted granted Critical
Publication of TWI645759B publication Critical patent/TWI645759B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
TW105140617A 2015-12-09 2016-12-08 印刷配線板用表面處理銅箔、印刷配線板用覆銅積層板及印刷配線板 TWI645759B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015240007A JP6294862B2 (ja) 2015-12-09 2015-12-09 プリント配線板用表面処理銅箔、プリント配線板用銅張積層板及びプリント配線板
JPJP2015-240007 2015-12-09

Publications (2)

Publication Number Publication Date
TW201735754A TW201735754A (zh) 2017-10-01
TWI645759B true TWI645759B (zh) 2018-12-21

Family

ID=59013245

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105140617A TWI645759B (zh) 2015-12-09 2016-12-08 印刷配線板用表面處理銅箔、印刷配線板用覆銅積層板及印刷配線板

Country Status (5)

Country Link
JP (1) JP6294862B2 (ko)
KR (1) KR102054281B1 (ko)
CN (1) CN107109679B (ko)
TW (1) TWI645759B (ko)
WO (1) WO2017099093A1 (ko)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7492807B2 (ja) * 2016-12-06 2024-05-30 Ｊｘ金属株式会社 表面処理銅箔、キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP7492808B2 (ja) * 2017-03-31 2024-05-30 Ｊｘ金属株式会社 表面処理銅箔、樹脂層付き表面処理銅箔、キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
KR102340473B1 (ko) * 2017-04-25 2021-12-16 후루카와 덴키 고교 가부시키가이샤 표면 처리 동박
JP6965660B2 (ja) * 2017-09-26 2021-11-10 昭和電工マテリアルズ株式会社 表面状態の数値化方法、接合特性の評価方法及び接合体の製造方法
JP7040056B2 (ja) * 2017-09-28 2022-03-23 株式会社Ｇｓユアサ 鉛蓄電池
WO2019111914A1 (ja) * 2017-12-05 2019-06-13 古河電気工業株式会社 表面処理銅箔、並びにこれを用いた銅張積層板及びプリント配線板
JP6413039B1 (ja) * 2018-03-29 2018-10-24 Ｊｘ金属株式会社 表面処理銅箔及び銅張積層板
JP7251928B2 (ja) * 2018-06-05 2023-04-04 Ｊｘ金属株式会社 表面処理銅箔、銅張積層板及びプリント配線板
TWI656682B (zh) * 2018-10-16 2019-04-11 長春石油化學股份有限公司 電解銅箔、包含其的電極、及包含其的鋰離子電池
US11365486B2 (en) 2018-10-16 2022-06-21 Chang Chun Petrochemical Co., Ltd. Electrolytic copper foil, electrode comprising the same, and lithium ion battery comprising the same
JP7463831B2 (ja) 2019-05-13 2024-04-09 大日本印刷株式会社 積層体
CN110344105B (zh) * 2019-08-05 2020-10-09 中色奥博特铜铝业有限公司 一种压延铜箔的双面表面处理方法
LU101698B1 (en) 2020-03-18 2021-09-20 Circuit Foil Luxembourg Surface-treated copper foil for high-frequency circuit and method for producing same
CN111364032A (zh) * 2020-04-22 2020-07-03 山东金宝电子股份有限公司 一种高频高速覆铜板用铜箔的表面处理剂
CN111640845A (zh) * 2020-05-29 2020-09-08 旭宇光电（深圳）股份有限公司 深紫外led光源及其封装方法
CN113099605B (zh) * 2021-06-08 2022-07-12 广州方邦电子股份有限公司 金属箔、带载体金属箔、覆铜层叠板及印刷线路板

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200404920A (en) * 2002-06-04 2004-04-01 Mitsui Mining & Smelting Co Surface-treated copper foil for low dielectric substrate, and copper clad laminate and printed wiring board both using the same
TW201524279A (zh) * 2013-09-20 2015-06-16 Mitsui Mining & Smelting Co 銅箔、具有載子箔的銅箔以及覆銅層積板

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JPS4833556A (ko) 1971-09-03 1973-05-11
US4185781A (en) 1978-01-16 1980-01-29 Spraying Systems Co. Quick-disconnect nozzle connection
CN1301046C (zh) 2002-05-13 2007-02-14 三井金属鉱业株式会社 膜上芯片用软性印刷线路板
JP4570070B2 (ja) * 2004-03-16 2010-10-27 三井金属鉱業株式会社 絶縁層形成用の樹脂層を備えたキャリア箔付電解銅箔、銅張積層板、プリント配線板、多層銅張積層板の製造方法及びプリント配線板の製造方法
JP5889443B2 (ja) * 2013-08-01 2016-03-22 古河電気工業株式会社 プリント配線基板用銅箔
JP6343204B2 (ja) * 2013-08-20 2018-06-13 Ｊｘ金属株式会社 表面処理銅箔及びそれを用いたキャリア付銅箔、積層板、プリント配線板、電子機器、並びに、プリント配線板の製造方法
JP2015061757A (ja) * 2013-08-21 2015-04-02 Jx日鉱日石金属株式会社 キャリア付銅箔及びそれを用いた積層板、プリント配線板、電子機器、並びに、プリント配線板の製造方法
JP5710737B1 (ja) * 2013-11-29 2015-04-30 Jx日鉱日石金属株式会社 表面処理銅箔、積層板、プリント配線板、プリント回路板及び電子機器
CN105814242B (zh) * 2013-12-10 2018-08-10 Ｊｘ金属株式会社 表面处理铜箔、覆铜积层板、印刷配线板、电子机器及印刷配线板的制造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200404920A (en) * 2002-06-04 2004-04-01 Mitsui Mining & Smelting Co Surface-treated copper foil for low dielectric substrate, and copper clad laminate and printed wiring board both using the same
TW201524279A (zh) * 2013-09-20 2015-06-16 Mitsui Mining & Smelting Co 銅箔、具有載子箔的銅箔以及覆銅層積板

Also Published As

Publication number Publication date
JP2017106069A (ja) 2017-06-15
JP6294862B2 (ja) 2018-03-14
TW201735754A (zh) 2017-10-01
KR20180037133A (ko) 2018-04-11
WO2017099093A1 (ja) 2017-06-15
CN107109679A (zh) 2017-08-29
CN107109679B (zh) 2019-10-29
KR102054281B1 (ko) 2019-12-10

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