CN107109679B - 印刷线路板用表面处理铜箔、印刷线路板用覆铜层压板及印刷线路板 - Google Patents

印刷线路板用表面处理铜箔、印刷线路板用覆铜层压板及印刷线路板 Download PDF

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Publication number
CN107109679B
CN107109679B CN201680004945.8A CN201680004945A CN107109679B CN 107109679 B CN107109679 B CN 107109679B CN 201680004945 A CN201680004945 A CN 201680004945A CN 107109679 B CN107109679 B CN 107109679B
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CN
China
Prior art keywords
copper foil
wiring board
printed wiring
coupling agent
roughening
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CN201680004945.8A
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English (en)
Chinese (zh)
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CN107109679A (zh
Inventor
斋藤贵广
绘面健
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Furukawa Co Ltd
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Furukawa Co Ltd
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Publication of CN107109679A publication Critical patent/CN107109679A/zh
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
CN201680004945.8A 2015-12-09 2016-12-06 印刷线路板用表面处理铜箔、印刷线路板用覆铜层压板及印刷线路板 Active CN107109679B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015-240007 2015-12-09
JP2015240007A JP6294862B2 (ja) 2015-12-09 2015-12-09 プリント配線板用表面処理銅箔、プリント配線板用銅張積層板及びプリント配線板
PCT/JP2016/086281 WO2017099093A1 (ja) 2015-12-09 2016-12-06 プリント配線板用表面処理銅箔、プリント配線板用銅張積層板及びプリント配線板

Publications (2)

Publication Number Publication Date
CN107109679A CN107109679A (zh) 2017-08-29
CN107109679B true CN107109679B (zh) 2019-10-29

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201680004945.8A Active CN107109679B (zh) 2015-12-09 2016-12-06 印刷线路板用表面处理铜箔、印刷线路板用覆铜层压板及印刷线路板

Country Status (5)

Country Link
JP (1) JP6294862B2 (ko)
KR (1) KR102054281B1 (ko)
CN (1) CN107109679B (ko)
TW (1) TWI645759B (ko)
WO (1) WO2017099093A1 (ko)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7492807B2 (ja) * 2016-12-06 2024-05-30 Ｊｘ金属株式会社 表面処理銅箔、キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP7492808B2 (ja) * 2017-03-31 2024-05-30 Ｊｘ金属株式会社 表面処理銅箔、樹脂層付き表面処理銅箔、キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
KR102340473B1 (ko) * 2017-04-25 2021-12-16 후루카와 덴키 고교 가부시키가이샤 표면 처리 동박
JP6965660B2 (ja) * 2017-09-26 2021-11-10 昭和電工マテリアルズ株式会社 表面状態の数値化方法、接合特性の評価方法及び接合体の製造方法
JP7040056B2 (ja) * 2017-09-28 2022-03-23 株式会社Ｇｓユアサ 鉛蓄電池
WO2019111914A1 (ja) * 2017-12-05 2019-06-13 古河電気工業株式会社 表面処理銅箔、並びにこれを用いた銅張積層板及びプリント配線板
JP6413039B1 (ja) * 2018-03-29 2018-10-24 Ｊｘ金属株式会社 表面処理銅箔及び銅張積層板
JP7251928B2 (ja) * 2018-06-05 2023-04-04 Ｊｘ金属株式会社 表面処理銅箔、銅張積層板及びプリント配線板
TWI656682B (zh) * 2018-10-16 2019-04-11 長春石油化學股份有限公司 電解銅箔、包含其的電極、及包含其的鋰離子電池
US11365486B2 (en) 2018-10-16 2022-06-21 Chang Chun Petrochemical Co., Ltd. Electrolytic copper foil, electrode comprising the same, and lithium ion battery comprising the same
JP7463831B2 (ja) 2019-05-13 2024-04-09 大日本印刷株式会社 積層体
CN110344105B (zh) * 2019-08-05 2020-10-09 中色奥博特铜铝业有限公司 一种压延铜箔的双面表面处理方法
LU101698B1 (en) 2020-03-18 2021-09-20 Circuit Foil Luxembourg Surface-treated copper foil for high-frequency circuit and method for producing same
CN111364032A (zh) * 2020-04-22 2020-07-03 山东金宝电子股份有限公司 一种高频高速覆铜板用铜箔的表面处理剂
CN111640845A (zh) * 2020-05-29 2020-09-08 旭宇光电（深圳）股份有限公司 深紫外led光源及其封装方法
CN113099605B (zh) * 2021-06-08 2022-07-12 广州方邦电子股份有限公司 金属箔、带载体金属箔、覆铜层叠板及印刷线路板

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1925982A (zh) * 2004-03-16 2007-03-07 三井金属矿业株式会社 具有绝缘层形成用树脂层的带载体箔的电解铜箔、覆铜箔层压板、印刷电路板、多层覆铜箔层压板的制造方法及印刷电路板的制造方法
JP2015061757A (ja) * 2013-08-21 2015-04-02 Jx日鉱日石金属株式会社 キャリア付銅箔及びそれを用いた積層板、プリント配線板、電子機器、並びに、プリント配線板の製造方法
CN104717831A (zh) * 2013-11-29 2015-06-17 Jx日矿日石金属株式会社 表面处理铜箔、层压板、印刷布线板、电子机器、附载体铜箔、及印刷布线板的制造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4833556A (ko) 1971-09-03 1973-05-11
US4185781A (en) 1978-01-16 1980-01-29 Spraying Systems Co. Quick-disconnect nozzle connection
CN1301046C (zh) 2002-05-13 2007-02-14 三井金属鉱业株式会社 膜上芯片用软性印刷线路板
WO2003102277A1 (fr) * 2002-06-04 2003-12-11 Mitsui Mining & Smelting Co.,Ltd. Feuille de cuivre traitee en surface pour substrat dielectrique faible, stratifie cuivre comportant cette feuille et carte a cablage imprime
JP5889443B2 (ja) * 2013-08-01 2016-03-22 古河電気工業株式会社 プリント配線基板用銅箔
JP6343204B2 (ja) * 2013-08-20 2018-06-13 Ｊｘ金属株式会社 表面処理銅箔及びそれを用いたキャリア付銅箔、積層板、プリント配線板、電子機器、並びに、プリント配線板の製造方法
TWI587757B (zh) * 2013-09-20 2017-06-11 Mitsui Mining & Smelting Co Copper foil, copper foil with carrier foil, and copper clad laminate
CN105814242B (zh) * 2013-12-10 2018-08-10 Ｊｘ金属株式会社 表面处理铜箔、覆铜积层板、印刷配线板、电子机器及印刷配线板的制造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1925982A (zh) * 2004-03-16 2007-03-07 三井金属矿业株式会社 具有绝缘层形成用树脂层的带载体箔的电解铜箔、覆铜箔层压板、印刷电路板、多层覆铜箔层压板的制造方法及印刷电路板的制造方法
JP2015061757A (ja) * 2013-08-21 2015-04-02 Jx日鉱日石金属株式会社 キャリア付銅箔及びそれを用いた積層板、プリント配線板、電子機器、並びに、プリント配線板の製造方法
CN104717831A (zh) * 2013-11-29 2015-06-17 Jx日矿日石金属株式会社 表面处理铜箔、层压板、印刷布线板、电子机器、附载体铜箔、及印刷布线板的制造方法

Also Published As

Publication number Publication date
JP2017106069A (ja) 2017-06-15
JP6294862B2 (ja) 2018-03-14
TW201735754A (zh) 2017-10-01
KR20180037133A (ko) 2018-04-11
WO2017099093A1 (ja) 2017-06-15
TWI645759B (zh) 2018-12-21
CN107109679A (zh) 2017-08-29
KR102054281B1 (ko) 2019-12-10

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