TWI639371B - 層合板的製造方法 - Google Patents

層合板的製造方法 Download PDF

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Publication number
TWI639371B
TWI639371B TW103130567A TW103130567A TWI639371B TW I639371 B TWI639371 B TW I639371B TW 103130567 A TW103130567 A TW 103130567A TW 103130567 A TW103130567 A TW 103130567A TW I639371 B TWI639371 B TW I639371B
Authority
TW
Taiwan
Prior art keywords
resin composition
laminated board
layer
manufacturing
thermosetting resin
Prior art date
Application number
TW103130567A
Other languages
English (en)
Chinese (zh)
Other versions
TW201534193A (zh
Inventor
Shigeo Nakamura
中村茂雄
Ryo Miyamoto
宮本亮
Original Assignee
Ajinomoto Co., Inc.
味之素股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ajinomoto Co., Inc., 味之素股份有限公司 filed Critical Ajinomoto Co., Inc.
Publication of TW201534193A publication Critical patent/TW201534193A/zh
Application granted granted Critical
Publication of TWI639371B publication Critical patent/TWI639371B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4632—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating thermoplastic or uncured resin sheets comprising printed circuits without added adhesive materials between the sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B9/045—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Laminated Bodies (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Moulding By Coating Moulds (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
TW103130567A 2013-10-31 2014-09-04 層合板的製造方法 TWI639371B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013-227538 2013-10-31
JP2013227538A JP6225643B2 (ja) 2013-10-31 2013-10-31 積層板の製造方法

Publications (2)

Publication Number Publication Date
TW201534193A TW201534193A (zh) 2015-09-01
TWI639371B true TWI639371B (zh) 2018-10-21

Family

ID=53048945

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103130567A TWI639371B (zh) 2013-10-31 2014-09-04 層合板的製造方法

Country Status (4)

Country Link
JP (1) JP6225643B2 (ko)
KR (1) KR102186664B1 (ko)
CN (1) CN104602465B (ko)
TW (1) TWI639371B (ko)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6672616B2 (ja) * 2014-06-30 2020-03-25 味の素株式会社 樹脂組成物、接着フィルム、プリント配線板及び半導体装置
KR102531219B1 (ko) * 2015-07-06 2023-05-10 미츠비시 가스 가가쿠 가부시키가이샤 수지 조성물, 프리프레그, 금속박 피복 적층판, 및 프린트 배선판
JP6852332B2 (ja) * 2015-10-28 2021-03-31 味の素株式会社 接着フィルム
JP6699148B2 (ja) * 2015-12-03 2020-05-27 日立化成株式会社 積層体及びその製造方法、並びに、プリント配線板の製造方法
JP6798140B2 (ja) * 2016-05-10 2020-12-09 昭和電工マテリアルズ株式会社 プリント配線板の製造方法
CN109757023B (zh) * 2017-11-08 2022-04-26 广东生益科技股份有限公司 印刷线路板及其制作方法
TWI788471B (zh) * 2018-01-16 2023-01-01 日商太陽油墨製造股份有限公司 熱硬化性樹脂組成物、其硬化物及印刷配線板
JP7176551B2 (ja) * 2020-07-28 2022-11-22 味の素株式会社 樹脂組成物、接着フィルム、プリプレグ、プリント配線板及び半導体装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001077494A (ja) * 1999-09-08 2001-03-23 Matsushita Electric Ind Co Ltd 印刷配線板
JP2003332734A (ja) 2002-05-14 2003-11-21 Mitsubishi Gas Chem Co Inc アディティブ法プリント配線板の製造方法。
CN101973146B (zh) * 2005-09-30 2012-09-26 住友电木株式会社 带有载体的预浸料及其制造工艺、薄双面板及其制造工艺和多层印刷电路板的制造工艺
CN101072468A (zh) * 2006-05-11 2007-11-14 冠品化学股份有限公司 软性印刷电路板基板
TWI611922B (zh) * 2008-03-25 2018-01-21 Ajinomoto Co., Inc. 絕緣樹脂薄片及使用該絕緣樹脂薄片的多層印刷電路板之製造方法
JP2010058391A (ja) * 2008-09-04 2010-03-18 Mitsubishi Gas Chemical Co Inc 金属箔張積層板
JP4853599B2 (ja) * 2009-11-25 2012-01-11 パナソニック電工株式会社 積層板、金属箔張り積層板、プリント配線板及び回路基板並びにｌｅｄバックライトユニット、ｌｅｄ照明装置
JP5540984B2 (ja) * 2010-08-11 2014-07-02 味の素株式会社 積層板の製造方法

Also Published As

Publication number Publication date
KR20150050441A (ko) 2015-05-08
JP2015085637A (ja) 2015-05-07
KR102186664B1 (ko) 2020-12-07
CN104602465A (zh) 2015-05-06
JP6225643B2 (ja) 2017-11-08
CN104602465B (zh) 2019-01-01
TW201534193A (zh) 2015-09-01

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