JP6225643B2 - 積層板の製造方法 - Google Patents

積層板の製造方法 Download PDF

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Publication number
JP6225643B2
JP6225643B2 JP2013227538A JP2013227538A JP6225643B2 JP 6225643 B2 JP6225643 B2 JP 6225643B2 JP 2013227538 A JP2013227538 A JP 2013227538A JP 2013227538 A JP2013227538 A JP 2013227538A JP 6225643 B2 JP6225643 B2 JP 6225643B2
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JP
Japan
Prior art keywords
resin composition
thermosetting resin
mass
laminated board
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2013227538A
Other languages
English (en)
Japanese (ja)
Other versions
JP2015085637A (ja
Inventor
中村　茂雄
茂雄 中村
亮 宮本
亮 宮本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ajinomoto Co Inc
Original Assignee
Ajinomoto Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ajinomoto Co Inc filed Critical Ajinomoto Co Inc
Priority to JP2013227538A priority Critical patent/JP6225643B2/ja
Priority to TW103130567A priority patent/TWI639371B/zh
Priority to CN201410588828.3A priority patent/CN104602465B/zh
Priority to KR1020140147966A priority patent/KR102186664B1/ko
Publication of JP2015085637A publication Critical patent/JP2015085637A/ja
Application granted granted Critical
Publication of JP6225643B2 publication Critical patent/JP6225643B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4632—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating thermoplastic or uncured resin sheets comprising printed circuits without added adhesive materials between the sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B9/045—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Laminated Bodies (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Moulding By Coating Moulds (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2013227538A 2013-10-31 2013-10-31 積層板の製造方法 Active JP6225643B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2013227538A JP6225643B2 (ja) 2013-10-31 2013-10-31 積層板の製造方法
TW103130567A TWI639371B (zh) 2013-10-31 2014-09-04 層合板的製造方法
CN201410588828.3A CN104602465B (zh) 2013-10-31 2014-10-29 叠层板的制造方法
KR1020140147966A KR102186664B1 (ko) 2013-10-31 2014-10-29 적층판의 제조 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013227538A JP6225643B2 (ja) 2013-10-31 2013-10-31 積層板の製造方法

Publications (2)

Publication Number Publication Date
JP2015085637A JP2015085637A (ja) 2015-05-07
JP6225643B2 true JP6225643B2 (ja) 2017-11-08

Family

ID=53048945

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013227538A Active JP6225643B2 (ja) 2013-10-31 2013-10-31 積層板の製造方法

Country Status (4)

Country Link
JP (1) JP6225643B2 (ko)
KR (1) KR102186664B1 (ko)
CN (1) CN104602465B (ko)
TW (1) TWI639371B (ko)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6672616B2 (ja) * 2014-06-30 2020-03-25 味の素株式会社 樹脂組成物、接着フィルム、プリント配線板及び半導体装置
KR102531219B1 (ko) * 2015-07-06 2023-05-10 미츠비시 가스 가가쿠 가부시키가이샤 수지 조성물, 프리프레그, 금속박 피복 적층판, 및 프린트 배선판
JP6852332B2 (ja) * 2015-10-28 2021-03-31 味の素株式会社 接着フィルム
JP6699148B2 (ja) * 2015-12-03 2020-05-27 日立化成株式会社 積層体及びその製造方法、並びに、プリント配線板の製造方法
JP6798140B2 (ja) * 2016-05-10 2020-12-09 昭和電工マテリアルズ株式会社 プリント配線板の製造方法
CN109757023B (zh) * 2017-11-08 2022-04-26 广东生益科技股份有限公司 印刷线路板及其制作方法
TWI788471B (zh) * 2018-01-16 2023-01-01 日商太陽油墨製造股份有限公司 熱硬化性樹脂組成物、其硬化物及印刷配線板
JP7176551B2 (ja) * 2020-07-28 2022-11-22 味の素株式会社 樹脂組成物、接着フィルム、プリプレグ、プリント配線板及び半導体装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001077494A (ja) * 1999-09-08 2001-03-23 Matsushita Electric Ind Co Ltd 印刷配線板
JP2003332734A (ja) 2002-05-14 2003-11-21 Mitsubishi Gas Chem Co Inc アディティブ法プリント配線板の製造方法。
CN101973146B (zh) * 2005-09-30 2012-09-26 住友电木株式会社 带有载体的预浸料及其制造工艺、薄双面板及其制造工艺和多层印刷电路板的制造工艺
CN101072468A (zh) * 2006-05-11 2007-11-14 冠品化学股份有限公司 软性印刷电路板基板
TWI611922B (zh) * 2008-03-25 2018-01-21 Ajinomoto Co., Inc. 絕緣樹脂薄片及使用該絕緣樹脂薄片的多層印刷電路板之製造方法
JP2010058391A (ja) * 2008-09-04 2010-03-18 Mitsubishi Gas Chemical Co Inc 金属箔張積層板
JP4853599B2 (ja) * 2009-11-25 2012-01-11 パナソニック電工株式会社 積層板、金属箔張り積層板、プリント配線板及び回路基板並びにｌｅｄバックライトユニット、ｌｅｄ照明装置
JP5540984B2 (ja) * 2010-08-11 2014-07-02 味の素株式会社 積層板の製造方法

Also Published As

Publication number Publication date
KR20150050441A (ko) 2015-05-08
JP2015085637A (ja) 2015-05-07
KR102186664B1 (ko) 2020-12-07
TWI639371B (zh) 2018-10-21
CN104602465A (zh) 2015-05-06
CN104602465B (zh) 2019-01-01
TW201534193A (zh) 2015-09-01

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