TWI639371B - 層合板的製造方法 - Google Patents
層合板的製造方法 Download PDFInfo
- Publication number
- TWI639371B TWI639371B TW103130567A TW103130567A TWI639371B TW I639371 B TWI639371 B TW I639371B TW 103130567 A TW103130567 A TW 103130567A TW 103130567 A TW103130567 A TW 103130567A TW I639371 B TWI639371 B TW I639371B
- Authority
- TW
- Taiwan
- Prior art keywords
- resin composition
- laminated board
- layer
- manufacturing
- thermosetting resin
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4632—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating thermoplastic or uncured resin sheets comprising printed circuits without added adhesive materials between the sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B9/045—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Laminated Bodies (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Moulding By Coating Moulds (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013-227538 | 2013-10-31 | ||
JP2013227538A JP6225643B2 (ja) | 2013-10-31 | 2013-10-31 | 積層板の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201534193A TW201534193A (zh) | 2015-09-01 |
TWI639371B true TWI639371B (zh) | 2018-10-21 |
Family
ID=53048945
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW103130567A TWI639371B (zh) | 2013-10-31 | 2014-09-04 | 層合板的製造方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6225643B2 (ja) |
KR (1) | KR102186664B1 (ja) |
CN (1) | CN104602465B (ja) |
TW (1) | TWI639371B (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6672616B2 (ja) * | 2014-06-30 | 2020-03-25 | 味の素株式会社 | 樹脂組成物、接着フィルム、プリント配線板及び半導体装置 |
EP3321325B1 (en) * | 2015-07-06 | 2021-11-24 | Mitsubishi Gas Chemical Company, Inc. | Resin composition, prepreg, metal foil-clad laminate, and printed circuit board |
JP6852332B2 (ja) * | 2015-10-28 | 2021-03-31 | 味の素株式会社 | 接着フィルム |
JP6699148B2 (ja) * | 2015-12-03 | 2020-05-27 | 日立化成株式会社 | 積層体及びその製造方法、並びに、プリント配線板の製造方法 |
JP6798140B2 (ja) * | 2016-05-10 | 2020-12-09 | 昭和電工マテリアルズ株式会社 | プリント配線板の製造方法 |
CN109757023B (zh) * | 2017-11-08 | 2022-04-26 | 广东生益科技股份有限公司 | 印刷线路板及其制作方法 |
TWI788471B (zh) * | 2018-01-16 | 2023-01-01 | 日商太陽油墨製造股份有限公司 | 熱硬化性樹脂組成物、其硬化物及印刷配線板 |
JP7176551B2 (ja) * | 2020-07-28 | 2022-11-22 | 味の素株式会社 | 樹脂組成物、接着フィルム、プリプレグ、プリント配線板及び半導体装置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001077494A (ja) * | 1999-09-08 | 2001-03-23 | Matsushita Electric Ind Co Ltd | 印刷配線板 |
JP2003332734A (ja) | 2002-05-14 | 2003-11-21 | Mitsubishi Gas Chem Co Inc | アディティブ法プリント配線板の製造方法。 |
CN101223015B (zh) * | 2005-09-30 | 2010-11-24 | 住友电木株式会社 | 带有载体的预浸料及其制造工艺、薄双面板及其制造工艺和多层印刷电路板的制造工艺 |
CN101072468A (zh) * | 2006-05-11 | 2007-11-14 | 冠品化学股份有限公司 | 软性印刷电路板基板 |
TWI611922B (zh) * | 2008-03-25 | 2018-01-21 | Ajinomoto Co., Inc. | 絕緣樹脂薄片及使用該絕緣樹脂薄片的多層印刷電路板之製造方法 |
JP2010058391A (ja) * | 2008-09-04 | 2010-03-18 | Mitsubishi Gas Chemical Co Inc | 金属箔張積層板 |
CN102695612B (zh) * | 2009-11-25 | 2014-06-25 | 松下电器产业株式会社 | 层叠板、其用途及其制造方法 |
JP5540984B2 (ja) * | 2010-08-11 | 2014-07-02 | 味の素株式会社 | 積層板の製造方法 |
-
2013
- 2013-10-31 JP JP2013227538A patent/JP6225643B2/ja active Active
-
2014
- 2014-09-04 TW TW103130567A patent/TWI639371B/zh active
- 2014-10-29 CN CN201410588828.3A patent/CN104602465B/zh active Active
- 2014-10-29 KR KR1020140147966A patent/KR102186664B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
TW201534193A (zh) | 2015-09-01 |
CN104602465B (zh) | 2019-01-01 |
KR102186664B1 (ko) | 2020-12-07 |
JP2015085637A (ja) | 2015-05-07 |
JP6225643B2 (ja) | 2017-11-08 |
CN104602465A (zh) | 2015-05-06 |
KR20150050441A (ko) | 2015-05-08 |
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