TWI637424B - Semiconductor element mounting substrate and method of manufacturing the same - Google Patents
Semiconductor element mounting substrate and method of manufacturing the same Download PDFInfo
- Publication number
- TWI637424B TWI637424B TW102142206A TW102142206A TWI637424B TW I637424 B TWI637424 B TW I637424B TW 102142206 A TW102142206 A TW 102142206A TW 102142206 A TW102142206 A TW 102142206A TW I637424 B TWI637424 B TW I637424B
- Authority
- TW
- Taiwan
- Prior art keywords
- photoresist layer
- layer
- metal plate
- plating
- semiconductor element
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/142—Metallic substrates having insulating layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3142—Sealing arrangements between parts, e.g. adhesion promotors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing & Machinery (AREA)
- Wire Bonding (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012254654A JP6099369B2 (ja) | 2012-11-20 | 2012-11-20 | 半導体素子搭載用基板及びその製造方法 |
| JP2012-254654 | 2012-11-20 | ||
| PCT/JP2013/079765 WO2014080745A1 (ja) | 2012-11-20 | 2013-11-01 | 半導体素子搭載用基板及びその製造方法 |
| ??PCT/JP2013/079765 | 2013-11-01 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201430907A TW201430907A (zh) | 2014-08-01 |
| TWI637424B true TWI637424B (zh) | 2018-10-01 |
Family
ID=50775931
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102142206A TWI637424B (zh) | 2012-11-20 | 2013-11-20 | Semiconductor element mounting substrate and method of manufacturing the same |
Country Status (7)
| Country | Link |
|---|---|
| JP (1) | JP6099369B2 (ja) |
| KR (1) | KR101691763B1 (ja) |
| CN (1) | CN104813465A (ja) |
| MY (1) | MY169149A (ja) |
| PH (1) | PH12015501117A1 (ja) |
| TW (1) | TWI637424B (ja) |
| WO (1) | WO2014080745A1 (ja) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109378270A (zh) * | 2018-09-29 | 2019-02-22 | 大连芯冠科技有限公司 | 功率器件多场板的制备方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004214633A (ja) * | 2002-12-18 | 2004-07-29 | Tdk Corp | 基板及びその製造方法 |
| TW201236051A (en) * | 2010-10-01 | 2012-09-01 | Sumitomo Metal Mining Co | Manufacturing method of substrate for mounting semiconductor element |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3626075B2 (ja) * | 2000-06-20 | 2005-03-02 | 九州日立マクセル株式会社 | 半導体装置の製造方法 |
| JP2002374066A (ja) * | 2001-06-14 | 2002-12-26 | Ibiden Co Ltd | 多層プリント配線板の製造方法 |
| WO2006009030A1 (ja) * | 2004-07-15 | 2006-01-26 | Dai Nippon Printing Co., Ltd. | 半導体装置及び半導体装置製造用基板並びにそれらの製造方法 |
| JP4508064B2 (ja) * | 2005-09-30 | 2010-07-21 | 住友金属鉱山株式会社 | 半導体装置用配線基板の製造方法 |
-
2012
- 2012-11-20 JP JP2012254654A patent/JP6099369B2/ja active Active
-
2013
- 2013-11-01 WO PCT/JP2013/079765 patent/WO2014080745A1/ja active Application Filing
- 2013-11-01 MY MYPI2015701633A patent/MY169149A/en unknown
- 2013-11-01 CN CN201380060226.4A patent/CN104813465A/zh active Pending
- 2013-11-01 KR KR1020157016478A patent/KR101691763B1/ko active IP Right Grant
- 2013-11-20 TW TW102142206A patent/TWI637424B/zh active
-
2015
- 2015-05-20 PH PH12015501117A patent/PH12015501117A1/en unknown
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004214633A (ja) * | 2002-12-18 | 2004-07-29 | Tdk Corp | 基板及びその製造方法 |
| TW201236051A (en) * | 2010-10-01 | 2012-09-01 | Sumitomo Metal Mining Co | Manufacturing method of substrate for mounting semiconductor element |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2014080745A1 (ja) | 2014-05-30 |
| KR20150087388A (ko) | 2015-07-29 |
| PH12015501117B1 (en) | 2015-08-17 |
| JP6099369B2 (ja) | 2017-03-22 |
| TW201430907A (zh) | 2014-08-01 |
| KR101691763B1 (ko) | 2017-01-09 |
| PH12015501117A1 (en) | 2015-08-17 |
| CN104813465A (zh) | 2015-07-29 |
| MY169149A (en) | 2019-02-18 |
| JP2014103277A (ja) | 2014-06-05 |
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