PH12015501117A1 - Substrate for mounting semiconductor element and method for manufacturing said substrate - Google Patents
Substrate for mounting semiconductor element and method for manufacturing said substrateInfo
- Publication number
- PH12015501117A1 PH12015501117A1 PH12015501117A PH12015501117A PH12015501117A1 PH 12015501117 A1 PH12015501117 A1 PH 12015501117A1 PH 12015501117 A PH12015501117 A PH 12015501117A PH 12015501117 A PH12015501117 A PH 12015501117A PH 12015501117 A1 PH12015501117 A1 PH 12015501117A1
- Authority
- PH
- Philippines
- Prior art keywords
- resist layer
- layer
- substrate
- bottom resist
- semiconductor element
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/142—Metallic substrates having insulating layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3142—Sealing arrangements between parts, e.g. adhesion promotors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
Provided is a substrate for mounting a semiconductor element, said substrate having improved adhesion between an electrode layer and a resin due to said electrode layer having roughened side surfaces and a cross-section shaped substantially like an inverted trapezoid. Also provided is a method for manufacturing said substrate, said method being characterized by containing the following steps, in this order: a) a step in which a two-layer resist layer comprising a bottom resist layer and a top resist layer is formed, from resists having different main photosensitivity wavelengths, on the surface of a metal plate; b) a step in which, with the bottom resist layer unexposed, the top resist layer is exposed using a prescribed pattern; c) a developing step in which a prescribed pattern of openings is formed in the top resist layer and the same prescribed pattern of openings is formed in the unexposed bottom resist layer, thereby partially revealing the surface of the metal plate; d) a step in which the bottom resist layer is exposed and cured; e) a step in which a prescribed plating layer is formed on the parts of the metal-plate surface revealed by the bottom resist layer; f) a step in which the entire two-layer resist layer, i.e. the bottom resist layer and the top resist layer, is removed; and g) a step in which the side surfaces of the plating layer formed in step e) are roughened.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012254654A JP6099369B2 (en) | 2012-11-20 | 2012-11-20 | Semiconductor device mounting substrate and manufacturing method thereof |
PCT/JP2013/079765 WO2014080745A1 (en) | 2012-11-20 | 2013-11-01 | Substrate for mounting semiconductor element and method for manufacturing said substrate |
Publications (2)
Publication Number | Publication Date |
---|---|
PH12015501117B1 PH12015501117B1 (en) | 2015-08-17 |
PH12015501117A1 true PH12015501117A1 (en) | 2015-08-17 |
Family
ID=50775931
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PH12015501117A PH12015501117A1 (en) | 2012-11-20 | 2015-05-20 | Substrate for mounting semiconductor element and method for manufacturing said substrate |
Country Status (7)
Country | Link |
---|---|
JP (1) | JP6099369B2 (en) |
KR (1) | KR101691763B1 (en) |
CN (1) | CN104813465A (en) |
MY (1) | MY169149A (en) |
PH (1) | PH12015501117A1 (en) |
TW (1) | TWI637424B (en) |
WO (1) | WO2014080745A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109378270A (en) * | 2018-09-29 | 2019-02-22 | 大连芯冠科技有限公司 | The preparation method of the more field plates of power device |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3626075B2 (en) * | 2000-06-20 | 2005-03-02 | 九州日立マクセル株式会社 | Manufacturing method of semiconductor device |
JP2002374066A (en) * | 2001-06-14 | 2002-12-26 | Ibiden Co Ltd | Method for manufacturing multilayered printed circuit substrate |
JP3960302B2 (en) * | 2002-12-18 | 2007-08-15 | Tdk株式会社 | Substrate manufacturing method |
WO2006009030A1 (en) * | 2004-07-15 | 2006-01-26 | Dai Nippon Printing Co., Ltd. | Semiconductor device and semiconductor device producing substrate and production methods therefor |
JP4508064B2 (en) * | 2005-09-30 | 2010-07-21 | 住友金属鉱山株式会社 | Manufacturing method of wiring board for semiconductor device |
JP5370330B2 (en) * | 2010-10-01 | 2013-12-18 | 住友金属鉱山株式会社 | Manufacturing method of semiconductor device mounting substrate |
-
2012
- 2012-11-20 JP JP2012254654A patent/JP6099369B2/en active Active
-
2013
- 2013-11-01 WO PCT/JP2013/079765 patent/WO2014080745A1/en active Application Filing
- 2013-11-01 MY MYPI2015701633A patent/MY169149A/en unknown
- 2013-11-01 CN CN201380060226.4A patent/CN104813465A/en active Pending
- 2013-11-01 KR KR1020157016478A patent/KR101691763B1/en active IP Right Grant
- 2013-11-20 TW TW102142206A patent/TWI637424B/en active
-
2015
- 2015-05-20 PH PH12015501117A patent/PH12015501117A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
WO2014080745A1 (en) | 2014-05-30 |
KR20150087388A (en) | 2015-07-29 |
PH12015501117B1 (en) | 2015-08-17 |
JP6099369B2 (en) | 2017-03-22 |
TWI637424B (en) | 2018-10-01 |
TW201430907A (en) | 2014-08-01 |
KR101691763B1 (en) | 2017-01-09 |
CN104813465A (en) | 2015-07-29 |
MY169149A (en) | 2019-02-18 |
JP2014103277A (en) | 2014-06-05 |
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