TWI636356B - 具有整合式熱傳遞單元的離心風扇 - Google Patents

具有整合式熱傳遞單元的離心風扇 Download PDF

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Publication number
TWI636356B
TWI636356B TW103130598A TW103130598A TWI636356B TW I636356 B TWI636356 B TW I636356B TW 103130598 A TW103130598 A TW 103130598A TW 103130598 A TW103130598 A TW 103130598A TW I636356 B TWI636356 B TW I636356B
Authority
TW
Taiwan
Prior art keywords
centrifugal fan
fan unit
computing device
heat conduction
heat
Prior art date
Application number
TW103130598A
Other languages
English (en)
Chinese (zh)
Other versions
TW201518917A (zh
Inventor
Andrew D. Delano
迪拉諾安德魯Ｄ
Taylor Stellman
斯特爾曼泰勒
Andrew W. Hill
喜拉安德魯Ｗ
Original Assignee
Microsoft Technology Licensing, Llc
微軟技術授權有限責任公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Microsoft Technology Licensing, Llc, 微軟技術授權有限責任公司 filed Critical Microsoft Technology Licensing, Llc
Publication of TW201518917A publication Critical patent/TW201518917A/zh
Application granted granted Critical
Publication of TWI636356B publication Critical patent/TWI636356B/zh

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D17/00—Radial-flow pumps, e.g. centrifugal pumps; Helico-centrifugal pumps
    • F04D17/08—Centrifugal pumps
    • F04D17/16—Centrifugal pumps for displacing without appreciable compression
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00—Details, component parts, or accessories
    • F04D29/58—Cooling; Heating; Diminishing heat transfer
    • F04D29/582—Cooling; Heating; Diminishing heat transfer specially adapted for elastic fluid pumps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Mechanical Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Structures Of Non-Positive Displacement Pumps (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
TW103130598A 2013-10-31 2014-09-04 具有整合式熱傳遞單元的離心風扇 TWI636356B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/068,715 2013-10-31
US14/068,715 US9639125B2 (en) 2013-10-31 2013-10-31 Centrifugal fan with integrated thermal transfer unit

Publications (2)

Publication Number Publication Date
TW201518917A TW201518917A (zh) 2015-05-16
TWI636356B true TWI636356B (zh) 2018-09-21

Family

ID=51932576

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103130598A TWI636356B (zh) 2013-10-31 2014-09-04 具有整合式熱傳遞單元的離心風扇

Country Status (12)

Country Link
US (1) US9639125B2 (enExample)
EP (1) EP3063600B1 (enExample)
JP (1) JP6472796B2 (enExample)
KR (1) KR102277432B1 (enExample)
CN (1) CN105765481B (enExample)
AU (1) AU2014342659B2 (enExample)
BR (1) BR112016007144A8 (enExample)
CA (1) CA2924909C (enExample)
MX (1) MX359663B (enExample)
RU (1) RU2666632C2 (enExample)
TW (1) TWI636356B (enExample)
WO (1) WO2015065926A1 (enExample)

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WO2017139923A1 (en) * 2016-02-16 2017-08-24 Siemens Aktiengesellschaft Radiator and electric device
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US11304334B2 (en) * 2018-06-14 2022-04-12 Microsoft Technology Licensing, Llc Vapor chamber having an electromagnetic shielding layer and methods of manufacturing the same
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US10584717B1 (en) 2019-04-25 2020-03-10 Dell Products, Lp Blower system with dual opposite outlets and fan diameter approaching to blower housing dimension for information handling systems
US11109509B2 (en) * 2019-05-03 2021-08-31 Dell Products, Lp Cooling module with blower system having dual opposite outlets for information handling systems
US11028857B2 (en) 2019-09-18 2021-06-08 Dell Products, Lp Cooling module with blower system having opposite, blower and impeller outlets for information handling systems
CN112817409A (zh) 2019-11-15 2021-05-18 英业达科技有限公司 散热系统
TWI711367B (zh) * 2019-11-28 2020-11-21 英業達股份有限公司 散熱系統
US12055149B2 (en) 2020-07-16 2024-08-06 Dell Products Lp Blower fan with through hole and fan support rod
US11240931B1 (en) 2020-07-16 2022-02-01 Dell Products, Lp Variable height fan
US11994144B2 (en) 2020-10-30 2024-05-28 Dell Products Lp Blower system with an inner axial fan blade set and an outer centrifugal fan blade set
US11503740B2 (en) * 2021-02-10 2022-11-15 Dell Products L.P. Cooling system for an information handling system
US12376257B2 (en) * 2022-01-19 2025-07-29 Dell Products Lp System and method for a radio module on premise of a cooling fan
CN117215379A (zh) 2022-06-02 2023-12-12 英业达科技有限公司 散热结构
CN117215380A (zh) 2022-06-02 2023-12-12 英业达科技有限公司 散热结构
CN117215377A (zh) * 2022-06-02 2023-12-12 英业达科技有限公司 散热系统
CN117215378A (zh) 2022-06-02 2023-12-12 英业达科技有限公司 气冷系统
TWI890096B (zh) * 2023-07-24 2025-07-11 華碩電腦股份有限公司 散熱模組

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US20100220439A1 (en) * 2007-09-29 2010-09-02 Biao Qin Flat heat pipe radiator and application thereof
US20120055653A1 (en) * 2010-09-03 2012-03-08 Wistron Corporation Heat Dissipating Unit And Heat Dissipating Device Having The Heat Dissipating Unit

Also Published As

Publication number Publication date
MX359663B (es) 2018-10-05
JP6472796B2 (ja) 2019-02-20
US20150116928A1 (en) 2015-04-30
CN105765481A (zh) 2016-07-13
US9639125B2 (en) 2017-05-02
CN105765481B (zh) 2020-02-14
EP3063600B1 (en) 2020-08-05
RU2016116986A3 (enExample) 2018-07-09
TW201518917A (zh) 2015-05-16
BR112016007144A8 (pt) 2020-03-03
AU2014342659A1 (en) 2016-03-31
RU2016116986A (ru) 2017-11-02
KR20160082238A (ko) 2016-07-08
CA2924909A1 (en) 2015-05-07
WO2015065926A1 (en) 2015-05-07
RU2666632C2 (ru) 2018-09-11
AU2014342659B2 (en) 2019-09-12
BR112016007144A2 (pt) 2017-08-01
MX2016005427A (es) 2016-08-11
JP2016536788A (ja) 2016-11-24
CA2924909C (en) 2021-05-04
EP3063600A1 (en) 2016-09-07
KR102277432B1 (ko) 2021-07-13

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