JP2016536788A5 - - Google Patents
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- Publication number
- JP2016536788A5 JP2016536788A5 JP2016526883A JP2016526883A JP2016536788A5 JP 2016536788 A5 JP2016536788 A5 JP 2016536788A5 JP 2016526883 A JP2016526883 A JP 2016526883A JP 2016526883 A JP2016526883 A JP 2016526883A JP 2016536788 A5 JP2016536788 A5 JP 2016536788A5
- Authority
- JP
- Japan
- Prior art keywords
- centrifugal fan
- fan unit
- computing device
- unit
- air flow
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14/068,715 | 2013-10-31 | ||
| US14/068,715 US9639125B2 (en) | 2013-10-31 | 2013-10-31 | Centrifugal fan with integrated thermal transfer unit |
| PCT/US2014/062486 WO2015065926A1 (en) | 2013-10-31 | 2014-10-28 | Centrifugal fan with integrated thermal transfer unit |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016536788A JP2016536788A (ja) | 2016-11-24 |
| JP2016536788A5 true JP2016536788A5 (enExample) | 2017-11-02 |
| JP6472796B2 JP6472796B2 (ja) | 2019-02-20 |
Family
ID=51932576
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016526883A Expired - Fee Related JP6472796B2 (ja) | 2013-10-31 | 2014-10-28 | 一体型熱伝導ユニットを持つ遠心ファン |
Country Status (12)
| Country | Link |
|---|---|
| US (1) | US9639125B2 (enExample) |
| EP (1) | EP3063600B1 (enExample) |
| JP (1) | JP6472796B2 (enExample) |
| KR (1) | KR102277432B1 (enExample) |
| CN (1) | CN105765481B (enExample) |
| AU (1) | AU2014342659B2 (enExample) |
| BR (1) | BR112016007144A8 (enExample) |
| CA (1) | CA2924909C (enExample) |
| MX (1) | MX359663B (enExample) |
| RU (1) | RU2666632C2 (enExample) |
| TW (1) | TWI636356B (enExample) |
| WO (1) | WO2015065926A1 (enExample) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9746888B2 (en) | 2014-09-12 | 2017-08-29 | Microsoft Technology Licensing, Llc | Uniform flow heat sink |
| CN105263301B (zh) * | 2015-11-12 | 2017-12-19 | 深圳市研派科技有限公司 | 一种液冷散热系统及其液体散热排 |
| WO2017139923A1 (en) * | 2016-02-16 | 2017-08-24 | Siemens Aktiengesellschaft | Radiator and electric device |
| IL270856B2 (en) | 2017-05-30 | 2023-12-01 | Magic Leap Inc | Power supply assembly with fan assembly for electronic device |
| US10545546B2 (en) * | 2018-02-23 | 2020-01-28 | Intel Corporation | Reversible direction thermal cooling system |
| US11304334B2 (en) * | 2018-06-14 | 2022-04-12 | Microsoft Technology Licensing, Llc | Vapor chamber having an electromagnetic shielding layer and methods of manufacturing the same |
| EP3628872B1 (en) | 2018-09-27 | 2023-01-25 | INTEL Corporation | Volumetric resistance blowers |
| US10584717B1 (en) | 2019-04-25 | 2020-03-10 | Dell Products, Lp | Blower system with dual opposite outlets and fan diameter approaching to blower housing dimension for information handling systems |
| US11109509B2 (en) * | 2019-05-03 | 2021-08-31 | Dell Products, Lp | Cooling module with blower system having dual opposite outlets for information handling systems |
| US11028857B2 (en) | 2019-09-18 | 2021-06-08 | Dell Products, Lp | Cooling module with blower system having opposite, blower and impeller outlets for information handling systems |
| CN112817409A (zh) | 2019-11-15 | 2021-05-18 | 英业达科技有限公司 | 散热系统 |
| TWI711367B (zh) * | 2019-11-28 | 2020-11-21 | 英業達股份有限公司 | 散熱系統 |
| US12055149B2 (en) | 2020-07-16 | 2024-08-06 | Dell Products Lp | Blower fan with through hole and fan support rod |
| US11240931B1 (en) | 2020-07-16 | 2022-02-01 | Dell Products, Lp | Variable height fan |
| US11994144B2 (en) | 2020-10-30 | 2024-05-28 | Dell Products Lp | Blower system with an inner axial fan blade set and an outer centrifugal fan blade set |
| US11503740B2 (en) * | 2021-02-10 | 2022-11-15 | Dell Products L.P. | Cooling system for an information handling system |
| US12376257B2 (en) * | 2022-01-19 | 2025-07-29 | Dell Products Lp | System and method for a radio module on premise of a cooling fan |
| CN117215379A (zh) | 2022-06-02 | 2023-12-12 | 英业达科技有限公司 | 散热结构 |
| CN117215380A (zh) | 2022-06-02 | 2023-12-12 | 英业达科技有限公司 | 散热结构 |
| CN117215377A (zh) * | 2022-06-02 | 2023-12-12 | 英业达科技有限公司 | 散热系统 |
| CN117215378A (zh) | 2022-06-02 | 2023-12-12 | 英业达科技有限公司 | 气冷系统 |
| TWI890096B (zh) * | 2023-07-24 | 2025-07-11 | 華碩電腦股份有限公司 | 散熱模組 |
Family Cites Families (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5785116A (en) | 1996-02-01 | 1998-07-28 | Hewlett-Packard Company | Fan assisted heat sink device |
| TWI222344B (en) | 1999-12-09 | 2004-10-11 | Advanced Rotary Systems Llc | Cooler for electronic devices |
| TWM285188U (en) | 2000-03-01 | 2006-01-01 | Delta Electronics Inc | Heat dissipating device of centrifugal fan blades |
| US6778390B2 (en) | 2001-05-15 | 2004-08-17 | Nvidia Corporation | High-performance heat sink for printed circuit boards |
| US20030131970A1 (en) * | 2002-01-17 | 2003-07-17 | Carter Daniel P. | Heat sinks and method of formation |
| US7312985B2 (en) | 2002-03-08 | 2007-12-25 | Lg Electronics Inc. | Cooler of notebook personal computer and fabrication method thereof |
| US6571862B1 (en) * | 2002-06-25 | 2003-06-03 | Waffer Technology Corp. | Heat dissipating fin |
| JP2004044962A (ja) * | 2002-07-15 | 2004-02-12 | Matsushita Ecology Systems Co Ltd | 冷却装置 |
| JP2005191452A (ja) * | 2003-12-26 | 2005-07-14 | Toshiba Corp | 放熱器、冷却装置および冷却装置を有する電子機器 |
| US7280358B2 (en) * | 2004-04-19 | 2007-10-09 | Hewlett-Packard Development Company, L.P. | Liquid loop with multiple heat exchangers for efficient space utilization |
| JP4330015B2 (ja) * | 2005-03-29 | 2009-09-09 | 古河電気工業株式会社 | 電子機器用冷却装置 |
| US20070047200A1 (en) * | 2005-08-23 | 2007-03-01 | Tai-Chi Huang | Fan cartridge assembly |
| US20080106171A1 (en) | 2005-09-30 | 2008-05-08 | Mongia Rajiv K | Self-focusing acoustic transducers to cool mobile devices |
| US7317614B2 (en) | 2005-10-19 | 2008-01-08 | Hewlett-Packard Development Company, L.P. | Computer device cooling system |
| US7508662B2 (en) | 2006-04-05 | 2009-03-24 | Apple Inc. | Handle arrangement with integrated heat pipe |
| CN100584171C (zh) * | 2006-07-12 | 2010-01-20 | 富准精密工业(深圳)有限公司 | 散热装置 |
| US20080043431A1 (en) * | 2006-08-16 | 2008-02-21 | The Texas A&M University System | Methods and Systems Employing Tailored Dimples to Enhance Heat Transfer |
| JP2008071800A (ja) * | 2006-09-12 | 2008-03-27 | Mitsubishi Electric Corp | 放熱板、冷却構造体およびヒートシンク |
| RU2416180C2 (ru) * | 2007-06-21 | 2011-04-10 | Андрей Леонидович Шпади | Устройство теплоотвода от электронных приборов и вентилятор устройства теплоотвода от электронных приборов (варианты) |
| JP4564991B2 (ja) * | 2007-07-10 | 2010-10-20 | 株式会社ソニー・コンピュータエンタテインメント | ヒートシンク及び冷却装置 |
| US8837139B2 (en) * | 2007-09-29 | 2014-09-16 | Biao Qin | Flat heat pipe radiator and application thereof |
| US7969730B1 (en) | 2008-02-08 | 2011-06-28 | Motion Computer, Inc. | Portable computer with thermal control and power source shield |
| US20110194252A1 (en) | 2008-02-27 | 2011-08-11 | Nxp B.V. | Mobile electronic devices with integrated personal cooling fan |
| TWI425742B (zh) | 2008-11-14 | 2014-02-01 | Metal Ind Res & Dev Ct | Integrated in the electronic device of the motor |
| TWM366878U (en) | 2009-01-23 | 2009-10-11 | Wistron Corp | Thermal module with airflow-guided effect |
| JP5314481B2 (ja) * | 2009-04-02 | 2013-10-16 | 株式会社ソニー・コンピュータエンタテインメント | 電子機器 |
| CN102290389B (zh) * | 2010-06-18 | 2013-04-10 | 晶致半导体股份有限公司 | 具散热风扇的半导体封装件及其堆叠结构 |
| US9249803B2 (en) | 2010-06-30 | 2016-02-02 | Intel Corporation | Integrated crossflow blower motor apparatus and system |
| CN201766803U (zh) * | 2010-09-03 | 2011-03-16 | 纬创资通股份有限公司 | 散热器及具有该散热器的散热装置 |
| US8432696B2 (en) | 2010-12-01 | 2013-04-30 | Apple Inc. | Using a battery pack to facilitate thermal transfer in a portable electronic device |
| US8477490B2 (en) | 2011-05-02 | 2013-07-02 | Apple Inc. | Cooling system for mobile electronic devices |
| KR20130025635A (ko) | 2011-09-02 | 2013-03-12 | 삼성전기주식회사 | 냉각장치 |
-
2013
- 2013-10-31 US US14/068,715 patent/US9639125B2/en active Active
-
2014
- 2014-09-04 TW TW103130598A patent/TWI636356B/zh active
- 2014-10-28 WO PCT/US2014/062486 patent/WO2015065926A1/en not_active Ceased
- 2014-10-28 AU AU2014342659A patent/AU2014342659B2/en active Active
- 2014-10-28 CN CN201480060845.8A patent/CN105765481B/zh active Active
- 2014-10-28 KR KR1020167012636A patent/KR102277432B1/ko active Active
- 2014-10-28 EP EP14800186.0A patent/EP3063600B1/en active Active
- 2014-10-28 MX MX2016005427A patent/MX359663B/es active IP Right Grant
- 2014-10-28 JP JP2016526883A patent/JP6472796B2/ja not_active Expired - Fee Related
- 2014-10-28 CA CA2924909A patent/CA2924909C/en active Active
- 2014-10-28 RU RU2016116986A patent/RU2666632C2/ru active
- 2014-10-28 BR BR112016007144A patent/BR112016007144A8/pt not_active Application Discontinuation
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