MX359663B - Ventilador centrifugo con unidad de transferencia termica integrada. - Google Patents

Ventilador centrifugo con unidad de transferencia termica integrada.

Info

Publication number
MX359663B
MX359663B MX2016005427A MX2016005427A MX359663B MX 359663 B MX359663 B MX 359663B MX 2016005427 A MX2016005427 A MX 2016005427A MX 2016005427 A MX2016005427 A MX 2016005427A MX 359663 B MX359663 B MX 359663B
Authority
MX
Mexico
Prior art keywords
thermal transfer
rotating hub
transfer unit
integrated thermal
centrifugal fan
Prior art date
Application number
MX2016005427A
Other languages
English (en)
Spanish (es)
Other versions
MX2016005427A (es
Inventor
D Delano Andrew
Stellman Taylor
W Hill Andrew
Original Assignee
Microsoft Technology Licensing Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Microsoft Technology Licensing Llc filed Critical Microsoft Technology Licensing Llc
Publication of MX2016005427A publication Critical patent/MX2016005427A/es
Publication of MX359663B publication Critical patent/MX359663B/es

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D17/00—Radial-flow pumps, e.g. centrifugal pumps; Helico-centrifugal pumps
    • F04D17/08—Centrifugal pumps
    • F04D17/16—Centrifugal pumps for displacing without appreciable compression
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00—Details, component parts, or accessories
    • F04D29/58—Cooling; Heating; Diminishing heat transfer
    • F04D29/582—Cooling; Heating; Diminishing heat transfer specially adapted for elastic fluid pumps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Mechanical Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Structures Of Non-Positive Displacement Pumps (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
MX2016005427A 2013-10-31 2014-10-28 Ventilador centrifugo con unidad de transferencia termica integrada. MX359663B (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/068,715 US9639125B2 (en) 2013-10-31 2013-10-31 Centrifugal fan with integrated thermal transfer unit
PCT/US2014/062486 WO2015065926A1 (en) 2013-10-31 2014-10-28 Centrifugal fan with integrated thermal transfer unit

Publications (2)

Publication Number Publication Date
MX2016005427A MX2016005427A (es) 2016-08-11
MX359663B true MX359663B (es) 2018-10-05

Family

ID=51932576

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2016005427A MX359663B (es) 2013-10-31 2014-10-28 Ventilador centrifugo con unidad de transferencia termica integrada.

Country Status (12)

Country Link
US (1) US9639125B2 (enExample)
EP (1) EP3063600B1 (enExample)
JP (1) JP6472796B2 (enExample)
KR (1) KR102277432B1 (enExample)
CN (1) CN105765481B (enExample)
AU (1) AU2014342659B2 (enExample)
BR (1) BR112016007144A8 (enExample)
CA (1) CA2924909C (enExample)
MX (1) MX359663B (enExample)
RU (1) RU2666632C2 (enExample)
TW (1) TWI636356B (enExample)
WO (1) WO2015065926A1 (enExample)

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US10545546B2 (en) * 2018-02-23 2020-01-28 Intel Corporation Reversible direction thermal cooling system
US11304334B2 (en) * 2018-06-14 2022-04-12 Microsoft Technology Licensing, Llc Vapor chamber having an electromagnetic shielding layer and methods of manufacturing the same
EP3628872B1 (en) 2018-09-27 2023-01-25 INTEL Corporation Volumetric resistance blowers
US10584717B1 (en) 2019-04-25 2020-03-10 Dell Products, Lp Blower system with dual opposite outlets and fan diameter approaching to blower housing dimension for information handling systems
US11109509B2 (en) * 2019-05-03 2021-08-31 Dell Products, Lp Cooling module with blower system having dual opposite outlets for information handling systems
US11028857B2 (en) 2019-09-18 2021-06-08 Dell Products, Lp Cooling module with blower system having opposite, blower and impeller outlets for information handling systems
CN112817409A (zh) 2019-11-15 2021-05-18 英业达科技有限公司 散热系统
TWI711367B (zh) * 2019-11-28 2020-11-21 英業達股份有限公司 散熱系統
US12055149B2 (en) 2020-07-16 2024-08-06 Dell Products Lp Blower fan with through hole and fan support rod
US11240931B1 (en) 2020-07-16 2022-02-01 Dell Products, Lp Variable height fan
US11994144B2 (en) 2020-10-30 2024-05-28 Dell Products Lp Blower system with an inner axial fan blade set and an outer centrifugal fan blade set
US11503740B2 (en) * 2021-02-10 2022-11-15 Dell Products L.P. Cooling system for an information handling system
US12376257B2 (en) * 2022-01-19 2025-07-29 Dell Products Lp System and method for a radio module on premise of a cooling fan
CN117215379A (zh) 2022-06-02 2023-12-12 英业达科技有限公司 散热结构
CN117215380A (zh) 2022-06-02 2023-12-12 英业达科技有限公司 散热结构
CN117215377A (zh) * 2022-06-02 2023-12-12 英业达科技有限公司 散热系统
CN117215378A (zh) 2022-06-02 2023-12-12 英业达科技有限公司 气冷系统
TWI890096B (zh) * 2023-07-24 2025-07-11 華碩電腦股份有限公司 散熱模組

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US7312985B2 (en) 2002-03-08 2007-12-25 Lg Electronics Inc. Cooler of notebook personal computer and fabrication method thereof
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TWI425742B (zh) 2008-11-14 2014-02-01 Metal Ind Res & Dev Ct Integrated in the electronic device of the motor
TWM366878U (en) 2009-01-23 2009-10-11 Wistron Corp Thermal module with airflow-guided effect
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US9249803B2 (en) 2010-06-30 2016-02-02 Intel Corporation Integrated crossflow blower motor apparatus and system
CN201766803U (zh) * 2010-09-03 2011-03-16 纬创资通股份有限公司 散热器及具有该散热器的散热装置
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KR20130025635A (ko) 2011-09-02 2013-03-12 삼성전기주식회사 냉각장치

Also Published As

Publication number Publication date
JP6472796B2 (ja) 2019-02-20
US20150116928A1 (en) 2015-04-30
CN105765481A (zh) 2016-07-13
US9639125B2 (en) 2017-05-02
CN105765481B (zh) 2020-02-14
EP3063600B1 (en) 2020-08-05
RU2016116986A3 (enExample) 2018-07-09
TW201518917A (zh) 2015-05-16
BR112016007144A8 (pt) 2020-03-03
AU2014342659A1 (en) 2016-03-31
RU2016116986A (ru) 2017-11-02
KR20160082238A (ko) 2016-07-08
CA2924909A1 (en) 2015-05-07
WO2015065926A1 (en) 2015-05-07
RU2666632C2 (ru) 2018-09-11
AU2014342659B2 (en) 2019-09-12
BR112016007144A2 (pt) 2017-08-01
MX2016005427A (es) 2016-08-11
JP2016536788A (ja) 2016-11-24
CA2924909C (en) 2021-05-04
EP3063600A1 (en) 2016-09-07
KR102277432B1 (ko) 2021-07-13
TWI636356B (zh) 2018-09-21

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