MX359663B - Ventilador centrifugo con unidad de transferencia termica integrada. - Google Patents
Ventilador centrifugo con unidad de transferencia termica integrada.Info
- Publication number
- MX359663B MX359663B MX2016005427A MX2016005427A MX359663B MX 359663 B MX359663 B MX 359663B MX 2016005427 A MX2016005427 A MX 2016005427A MX 2016005427 A MX2016005427 A MX 2016005427A MX 359663 B MX359663 B MX 359663B
- Authority
- MX
- Mexico
- Prior art keywords
- centrifugal fan
- thermal transfer
- rotatable hub
- transfer unit
- integrated thermal
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D17/00—Radial-flow pumps, e.g. centrifugal pumps; Helico-centrifugal pumps
- F04D17/08—Centrifugal pumps
- F04D17/16—Centrifugal pumps for displacing without appreciable compression
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D29/00—Details, component parts, or accessories
- F04D29/58—Cooling; Heating; Diminishing heat transfer
- F04D29/582—Cooling; Heating; Diminishing heat transfer specially adapted for elastic fluid pumps
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Mechanical Engineering (AREA)
- Human Computer Interaction (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Thermal Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Structures Of Non-Positive Displacement Pumps (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Se describen dispositivos de cómputo y métodos para fabricar dispositivos de cómputo, que tienen un ventilador de enfriamiento y una unidad de transferencia térmica integrada. Una unidad de ventilador centrífugo incluye un cubo giratorio, una pluralidad de aspas dispuestas en el cubo giratorio y un motor acoplado al cubo giratorio. El motor hace que el cubo giratorio gire alrededor de un eje de manera que un flujo de aire prosigue hacia afuera desde la unidad de ventilador centrífugo a lo largo de trayectorias que son perpendiculares al eje. Una o más unidades de transferencia térmica tienen primeras porciones que están acopladas a las una o más fuentes de calor y segundas porciones que en conjunto al menos parcialmente rodean la unidad de ventilador centrífugo.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/068,715 US9639125B2 (en) | 2013-10-31 | 2013-10-31 | Centrifugal fan with integrated thermal transfer unit |
PCT/US2014/062486 WO2015065926A1 (en) | 2013-10-31 | 2014-10-28 | Centrifugal fan with integrated thermal transfer unit |
Publications (2)
Publication Number | Publication Date |
---|---|
MX2016005427A MX2016005427A (es) | 2016-08-11 |
MX359663B true MX359663B (es) | 2018-10-05 |
Family
ID=51932576
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX2016005427A MX359663B (es) | 2013-10-31 | 2014-10-28 | Ventilador centrifugo con unidad de transferencia termica integrada. |
Country Status (12)
Country | Link |
---|---|
US (1) | US9639125B2 (es) |
EP (1) | EP3063600B1 (es) |
JP (1) | JP6472796B2 (es) |
KR (1) | KR102277432B1 (es) |
CN (1) | CN105765481B (es) |
AU (1) | AU2014342659B2 (es) |
BR (1) | BR112016007144A8 (es) |
CA (1) | CA2924909C (es) |
MX (1) | MX359663B (es) |
RU (1) | RU2666632C2 (es) |
TW (1) | TWI636356B (es) |
WO (1) | WO2015065926A1 (es) |
Families Citing this family (17)
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US9746888B2 (en) | 2014-09-12 | 2017-08-29 | Microsoft Technology Licensing, Llc | Uniform flow heat sink |
CN105263301B (zh) * | 2015-11-12 | 2017-12-19 | 深圳市研派科技有限公司 | 一种液冷散热系统及其液体散热排 |
WO2017139923A1 (en) * | 2016-02-16 | 2017-08-24 | Siemens Aktiengesellschaft | Radiator and electric device |
CN116666814A (zh) * | 2017-05-30 | 2023-08-29 | 奇跃公司 | 用于电子装置的具有风扇组件的电源组件 |
US10545546B2 (en) * | 2018-02-23 | 2020-01-28 | Intel Corporation | Reversible direction thermal cooling system |
US11304334B2 (en) * | 2018-06-14 | 2022-04-12 | Microsoft Technology Licensing, Llc | Vapor chamber having an electromagnetic shielding layer and methods of manufacturing the same |
EP3628872B1 (en) | 2018-09-27 | 2023-01-25 | INTEL Corporation | Volumetric resistance blowers |
US10584717B1 (en) | 2019-04-25 | 2020-03-10 | Dell Products, Lp | Blower system with dual opposite outlets and fan diameter approaching to blower housing dimension for information handling systems |
US11109509B2 (en) * | 2019-05-03 | 2021-08-31 | Dell Products, Lp | Cooling module with blower system having dual opposite outlets for information handling systems |
US11028857B2 (en) | 2019-09-18 | 2021-06-08 | Dell Products, Lp | Cooling module with blower system having opposite, blower and impeller outlets for information handling systems |
CN112817409A (zh) | 2019-11-15 | 2021-05-18 | 英业达科技有限公司 | 散热系统 |
TWI711367B (zh) * | 2019-11-28 | 2020-11-21 | 英業達股份有限公司 | 散熱系統 |
US11240931B1 (en) | 2020-07-16 | 2022-02-01 | Dell Products, Lp | Variable height fan |
US11994144B2 (en) | 2020-10-30 | 2024-05-28 | Dell Products Lp | Blower system with an inner axial fan blade set and an outer centrifugal fan blade set |
US11503740B2 (en) * | 2021-02-10 | 2022-11-15 | Dell Products L.P. | Cooling system for an information handling system |
US20230232569A1 (en) * | 2022-01-19 | 2023-07-20 | Dell Products, Lp | System and method for a radio module on premise of a cooling fan |
CN117215377A (zh) * | 2022-06-02 | 2023-12-12 | 英业达科技有限公司 | 散热系统 |
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US5785116A (en) | 1996-02-01 | 1998-07-28 | Hewlett-Packard Company | Fan assisted heat sink device |
TWI222344B (en) | 1999-12-09 | 2004-10-11 | Advanced Rotary Systems Llc | Cooler for electronic devices |
TWM285188U (en) | 2000-03-01 | 2006-01-01 | Delta Electronics Inc | Heat dissipating device of centrifugal fan blades |
US6778390B2 (en) * | 2001-05-15 | 2004-08-17 | Nvidia Corporation | High-performance heat sink for printed circuit boards |
US20030131970A1 (en) * | 2002-01-17 | 2003-07-17 | Carter Daniel P. | Heat sinks and method of formation |
US7312985B2 (en) | 2002-03-08 | 2007-12-25 | Lg Electronics Inc. | Cooler of notebook personal computer and fabrication method thereof |
US6571862B1 (en) * | 2002-06-25 | 2003-06-03 | Waffer Technology Corp. | Heat dissipating fin |
JP2004044962A (ja) * | 2002-07-15 | 2004-02-12 | Matsushita Ecology Systems Co Ltd | 冷却装置 |
JP2005191452A (ja) * | 2003-12-26 | 2005-07-14 | Toshiba Corp | 放熱器、冷却装置および冷却装置を有する電子機器 |
US7280358B2 (en) * | 2004-04-19 | 2007-10-09 | Hewlett-Packard Development Company, L.P. | Liquid loop with multiple heat exchangers for efficient space utilization |
JP4330015B2 (ja) * | 2005-03-29 | 2009-09-09 | 古河電気工業株式会社 | 電子機器用冷却装置 |
US20070047200A1 (en) * | 2005-08-23 | 2007-03-01 | Tai-Chi Huang | Fan cartridge assembly |
US20080106171A1 (en) | 2005-09-30 | 2008-05-08 | Mongia Rajiv K | Self-focusing acoustic transducers to cool mobile devices |
US7317614B2 (en) | 2005-10-19 | 2008-01-08 | Hewlett-Packard Development Company, L.P. | Computer device cooling system |
US7508662B2 (en) | 2006-04-05 | 2009-03-24 | Apple Inc. | Handle arrangement with integrated heat pipe |
CN100584171C (zh) * | 2006-07-12 | 2010-01-20 | 富准精密工业(深圳)有限公司 | 散热装置 |
US20080043431A1 (en) * | 2006-08-16 | 2008-02-21 | The Texas A&M University System | Methods and Systems Employing Tailored Dimples to Enhance Heat Transfer |
JP2008071800A (ja) * | 2006-09-12 | 2008-03-27 | Mitsubishi Electric Corp | 放熱板、冷却構造体およびヒートシンク |
RU2416180C2 (ru) * | 2007-06-21 | 2011-04-10 | Андрей Леонидович Шпади | Устройство теплоотвода от электронных приборов и вентилятор устройства теплоотвода от электронных приборов (варианты) |
JP4564991B2 (ja) * | 2007-07-10 | 2010-10-20 | 株式会社ソニー・コンピュータエンタテインメント | ヒートシンク及び冷却装置 |
US8837139B2 (en) * | 2007-09-29 | 2014-09-16 | Biao Qin | Flat heat pipe radiator and application thereof |
US7969730B1 (en) | 2008-02-08 | 2011-06-28 | Motion Computer, Inc. | Portable computer with thermal control and power source shield |
US20110194252A1 (en) | 2008-02-27 | 2011-08-11 | Nxp B.V. | Mobile electronic devices with integrated personal cooling fan |
TWI425742B (zh) | 2008-11-14 | 2014-02-01 | Metal Ind Res & Dev Ct | Integrated in the electronic device of the motor |
TWM366878U (en) | 2009-01-23 | 2009-10-11 | Wistron Corp | Thermal module with airflow-guided effect |
JP5314481B2 (ja) * | 2009-04-02 | 2013-10-16 | 株式会社ソニー・コンピュータエンタテインメント | 電子機器 |
CN102290389B (zh) * | 2010-06-18 | 2013-04-10 | 晶致半导体股份有限公司 | 具散热风扇的半导体封装件及其堆叠结构 |
US9249803B2 (en) | 2010-06-30 | 2016-02-02 | Intel Corporation | Integrated crossflow blower motor apparatus and system |
CN201766803U (zh) * | 2010-09-03 | 2011-03-16 | 纬创资通股份有限公司 | 散热器及具有该散热器的散热装置 |
US8432696B2 (en) | 2010-12-01 | 2013-04-30 | Apple Inc. | Using a battery pack to facilitate thermal transfer in a portable electronic device |
US8477490B2 (en) | 2011-05-02 | 2013-07-02 | Apple Inc. | Cooling system for mobile electronic devices |
KR20130025635A (ko) | 2011-09-02 | 2013-03-12 | 삼성전기주식회사 | 냉각장치 |
-
2013
- 2013-10-31 US US14/068,715 patent/US9639125B2/en active Active
-
2014
- 2014-09-04 TW TW103130598A patent/TWI636356B/zh active
- 2014-10-28 RU RU2016116986A patent/RU2666632C2/ru active
- 2014-10-28 WO PCT/US2014/062486 patent/WO2015065926A1/en active Application Filing
- 2014-10-28 BR BR112016007144A patent/BR112016007144A8/pt not_active Application Discontinuation
- 2014-10-28 JP JP2016526883A patent/JP6472796B2/ja active Active
- 2014-10-28 EP EP14800186.0A patent/EP3063600B1/en active Active
- 2014-10-28 CA CA2924909A patent/CA2924909C/en active Active
- 2014-10-28 KR KR1020167012636A patent/KR102277432B1/ko active IP Right Grant
- 2014-10-28 MX MX2016005427A patent/MX359663B/es active IP Right Grant
- 2014-10-28 AU AU2014342659A patent/AU2014342659B2/en active Active
- 2014-10-28 CN CN201480060845.8A patent/CN105765481B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
BR112016007144A2 (pt) | 2017-08-01 |
JP2016536788A (ja) | 2016-11-24 |
TW201518917A (zh) | 2015-05-16 |
EP3063600A1 (en) | 2016-09-07 |
US20150116928A1 (en) | 2015-04-30 |
KR102277432B1 (ko) | 2021-07-13 |
CA2924909A1 (en) | 2015-05-07 |
MX2016005427A (es) | 2016-08-11 |
KR20160082238A (ko) | 2016-07-08 |
AU2014342659A1 (en) | 2016-03-31 |
US9639125B2 (en) | 2017-05-02 |
CA2924909C (en) | 2021-05-04 |
RU2666632C2 (ru) | 2018-09-11 |
RU2016116986A (ru) | 2017-11-02 |
EP3063600B1 (en) | 2020-08-05 |
TWI636356B (zh) | 2018-09-21 |
BR112016007144A8 (pt) | 2020-03-03 |
CN105765481A (zh) | 2016-07-13 |
CN105765481B (zh) | 2020-02-14 |
RU2016116986A3 (es) | 2018-07-09 |
WO2015065926A1 (en) | 2015-05-07 |
AU2014342659B2 (en) | 2019-09-12 |
JP6472796B2 (ja) | 2019-02-20 |
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Legal Events
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FG | Grant or registration |