IN2013CH04361A - - Google Patents
Info
- Publication number
- IN2013CH04361A IN2013CH04361A IN4361CH2013A IN2013CH04361A IN 2013CH04361 A IN2013CH04361 A IN 2013CH04361A IN 4361CH2013 A IN4361CH2013 A IN 4361CH2013A IN 2013CH04361 A IN2013CH04361 A IN 2013CH04361A
- Authority
- IN
- India
- Prior art keywords
- cooling
- cooling zone
- components
- zone
- casing
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/206—Cooling means comprising thermal management
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IN4361CH2013 IN2013CH04361A (es) | 2013-09-26 | 2014-08-22 | |
PCT/US2014/052370 WO2015047615A1 (en) | 2013-09-26 | 2014-08-22 | Partitioned cooling for electronic devices and systems |
US14/905,275 US10165705B2 (en) | 2013-09-26 | 2014-08-22 | Partitioned cooling for electronic devices and systems |
TW103132424A TWI605745B (zh) | 2013-09-26 | 2014-09-19 | 用於電子裝置及系統之分區冷卻技術 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IN4361CH2013 IN2013CH04361A (es) | 2013-09-26 | 2014-08-22 |
Publications (1)
Publication Number | Publication Date |
---|---|
IN2013CH04361A true IN2013CH04361A (es) | 2015-04-03 |
Family
ID=52744328
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IN4361CH2013 IN2013CH04361A (es) | 2013-09-26 | 2014-08-22 |
Country Status (4)
Country | Link |
---|---|
US (1) | US10165705B2 (es) |
IN (1) | IN2013CH04361A (es) |
TW (1) | TWI605745B (es) |
WO (1) | WO2015047615A1 (es) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20170059263A1 (en) * | 2014-03-31 | 2017-03-02 | Intel Corporation | Sonic dust remediation |
US10886875B2 (en) * | 2017-03-06 | 2021-01-05 | Tapicu, Inc. | Solar powered cooler for smart device |
US10037062B1 (en) | 2017-03-17 | 2018-07-31 | Microsoft Technology Licensing, Llc | Thermal venting device with pressurized plenum |
US11847002B2 (en) | 2019-05-21 | 2023-12-19 | Hewlett-Packard Development Company, L.P. | Expelling air from a computer enclosure |
TWI763256B (zh) * | 2021-01-15 | 2022-05-01 | 宏碁股份有限公司 | 可攜式電子裝置的散熱系統 |
US11429164B1 (en) * | 2021-02-10 | 2022-08-30 | Dell Products L.P. | Cooling system for an information handling system |
US11503740B2 (en) * | 2021-02-10 | 2022-11-15 | Dell Products L.P. | Cooling system for an information handling system |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002169626A (ja) * | 2000-12-05 | 2002-06-14 | Nec Gumma Ltd | 中央処理装置内蔵型電子機器 |
JP2003108269A (ja) * | 2001-09-28 | 2003-04-11 | Nec Gumma Ltd | 電子部品の冷却構造及び冷却方法 |
JP2004246403A (ja) * | 2003-02-10 | 2004-09-02 | Toshiba Corp | 情報処理装置、電子機器及び電子機器の冷却方法 |
JP4675666B2 (ja) * | 2005-04-15 | 2011-04-27 | 株式会社東芝 | 電子機器 |
US8085535B2 (en) * | 2009-12-18 | 2011-12-27 | Intel Corporation | Fan casing integrated heat spreader for active cooling of computing system skins |
CN102566719A (zh) * | 2010-12-30 | 2012-07-11 | 鸿富锦精密工业(深圳)有限公司 | 电子装置 |
JP5991125B2 (ja) * | 2012-09-28 | 2016-09-14 | 富士通株式会社 | 電子機器 |
CN104936411A (zh) * | 2014-03-17 | 2015-09-23 | 名硕电脑(苏州)有限公司 | 风扇散热系统 |
US9788460B2 (en) * | 2015-12-02 | 2017-10-10 | International Business Machines Corporation | Heatsink providing equivalent cooling for multiple in-line modules |
-
2014
- 2014-08-22 IN IN4361CH2013 patent/IN2013CH04361A/en unknown
- 2014-08-22 US US14/905,275 patent/US10165705B2/en active Active
- 2014-08-22 WO PCT/US2014/052370 patent/WO2015047615A1/en active Application Filing
- 2014-09-19 TW TW103132424A patent/TWI605745B/zh active
Also Published As
Publication number | Publication date |
---|---|
TW201528928A (zh) | 2015-07-16 |
US10165705B2 (en) | 2018-12-25 |
TWI605745B (zh) | 2017-11-11 |
WO2015047615A1 (en) | 2015-04-02 |
US20160165751A1 (en) | 2016-06-09 |
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