DK3951306T3 - Højtydende elektronisk kølesystem - Google Patents

Højtydende elektronisk kølesystem Download PDF

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Publication number
DK3951306T3
DK3951306T3 DK21197460.5T DK21197460T DK3951306T3 DK 3951306 T3 DK3951306 T3 DK 3951306T3 DK 21197460 T DK21197460 T DK 21197460T DK 3951306 T3 DK3951306 T3 DK 3951306T3
Authority
DK
Denmark
Prior art keywords
cooling system
high performance
electronic cooling
performance electronic
performance
Prior art date
Application number
DK21197460.5T
Other languages
English (en)
Inventor
Soheil Farshchian
Emad Samadiani
Original Assignee
Google Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Google Llc filed Critical Google Llc
Application granted granted Critical
Publication of DK3951306T3 publication Critical patent/DK3951306T3/da

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2215/00—Fins
    • F28F2215/06—Hollow fins; fins with internal circuits
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2240/00—Spacing means

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)
DK21197460.5T 2017-10-30 2018-09-07 Højtydende elektronisk kølesystem DK3951306T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/797,996 US10433461B2 (en) 2017-10-30 2017-10-30 High-performance electronics cooling system
EP18778774.2A EP3589904B1 (en) 2017-10-30 2018-09-07 High-performance electronics cooling system

Publications (1)

Publication Number Publication Date
DK3951306T3 true DK3951306T3 (da) 2023-06-12

Family

ID=63684607

Family Applications (2)

Application Number Title Priority Date Filing Date
DK21197460.5T DK3951306T3 (da) 2017-10-30 2018-09-07 Højtydende elektronisk kølesystem
DK18778774.2T DK3589904T3 (da) 2017-10-30 2018-09-07 Højtydende elektronisk kølesystem

Family Applications After (1)

Application Number Title Priority Date Filing Date
DK18778774.2T DK3589904T3 (da) 2017-10-30 2018-09-07 Højtydende elektronisk kølesystem

Country Status (7)

Country Link
US (2) US10433461B2 (da)
EP (2) EP3951306B1 (da)
CN (1) CN110537067A (da)
DK (2) DK3951306T3 (da)
FI (1) FI3951306T3 (da)
TW (1) TWI684095B (da)
WO (1) WO2019089126A1 (da)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI806885B (zh) * 2017-07-28 2023-07-01 日商古河電氣工業股份有限公司 芯構造體及容納芯構造體的熱管
TWI700471B (zh) * 2019-05-27 2020-08-01 大陸商深圳興奇宏科技有限公司 具軸向毛細的散熱單元
CN112055502B (zh) * 2019-06-05 2022-12-20 英业达科技有限公司 冷却系统
CN114383453A (zh) * 2020-10-22 2022-04-22 讯凯国际股份有限公司 散热装置

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4047198A (en) 1976-04-19 1977-09-06 Hughes Aircraft Company Transistor cooling by heat pipes having a wick of dielectric powder
US6410982B1 (en) 1999-11-12 2002-06-25 Intel Corporation Heatpipesink having integrated heat pipe and heat sink
JP2004190977A (ja) 2002-12-12 2004-07-08 Sony Corp 熱輸送装置、熱輸送装置の製造方法及び電子デバイス
US6994152B2 (en) 2003-06-26 2006-02-07 Thermal Corp. Brazed wick for a heat transfer device
TWM309091U (en) 2004-03-15 2007-04-01 Delta Electronics Inc Heat sink
TWM258337U (en) 2004-05-31 2005-03-01 Hua Yin Electric Co Ltd The improved structure of a heat sink with heat pipes
CN1805133A (zh) 2005-01-14 2006-07-19 杨洪武 板式热管散热器
CN2874398Y (zh) * 2005-05-10 2007-02-28 苏子欣 一体化热导管散热结构
US7705342B2 (en) 2005-09-16 2010-04-27 University Of Cincinnati Porous semiconductor-based evaporator having porous and non-porous regions, the porous regions having through-holes
JP4714638B2 (ja) * 2006-05-25 2011-06-29 富士通株式会社 ヒートシンク
US7957132B2 (en) * 2007-04-16 2011-06-07 Fried Stephen S Efficiently cool data centers and electronic enclosures using loop heat pipes
US8422218B2 (en) * 2007-04-16 2013-04-16 Stephen Samuel Fried Liquid cooled condensers for loop heat pipe like enclosure cooling
WO2008131587A1 (en) * 2007-04-28 2008-11-06 Jenshyan Chen Heat pipe and manufacturing method thereof
US20090040726A1 (en) 2007-08-09 2009-02-12 Paul Hoffman Vapor chamber structure and method for manufacturing the same
WO2010036442A1 (en) 2008-07-21 2010-04-01 The Regents Of The University Of California Titanium-based thermal ground plane
US8587944B2 (en) 2009-04-01 2013-11-19 Harris Corporation Multi-layer mesh wicks for heat pipes
CN102484105A (zh) * 2010-02-26 2012-05-30 古河电气工业株式会社 散热器
CN102095323A (zh) 2010-11-04 2011-06-15 华中科技大学 一种平板均热板
TWM455153U (zh) 2013-01-03 2013-06-11 Enermax Technology Corp 熱交換模組
US9436235B2 (en) 2013-02-26 2016-09-06 Nvidia Corporation Heat sink with an integrated vapor chamber
TWI644074B (zh) * 2016-02-15 2018-12-11 訊凱國際股份有限公司 立體傳熱裝置

Also Published As

Publication number Publication date
WO2019089126A1 (en) 2019-05-09
EP3589904B1 (en) 2022-03-02
US11051427B2 (en) 2021-06-29
CN110537067A (zh) 2019-12-03
FI3951306T3 (fi) 2023-06-06
EP3951306B1 (en) 2023-03-22
US20190132992A1 (en) 2019-05-02
US20190373770A1 (en) 2019-12-05
DK3589904T3 (da) 2022-06-07
TW201923513A (zh) 2019-06-16
TWI684095B (zh) 2020-02-01
US10433461B2 (en) 2019-10-01
EP3589904A1 (en) 2020-01-08
EP3951306A1 (en) 2022-02-09

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