CN114383453A - 散热装置 - Google Patents
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- CN114383453A CN114383453A CN202011138603.XA CN202011138603A CN114383453A CN 114383453 A CN114383453 A CN 114383453A CN 202011138603 A CN202011138603 A CN 202011138603A CN 114383453 A CN114383453 A CN 114383453A
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- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
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- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
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- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
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Abstract
一种散热装置用以供一相变化流体充填。散热装置包含一基部及多个散热鳍片。基部具有至少一内部流道,用以供相变化流体充填。这些散热鳍片各包含一板体及至少一管体。这些板体插设于基部的其中一侧。这些板体各具有一延伸流道。这些管体的相对两端分别插接于这些板体及基部,且这些板体的这些延伸流道分别透过这些管体连通至少一内部流道。
Description
技术领域
本发明是关于一种散热装置,特别是一种液冷式散热装置。
背景技术
伴随着电子元件运行频率及速度的不断提升,电子元件每单位体积所产生的热量随之增高。然而,传统的简单铝挤型及压铸型散热鳍片由于受限于机械加工而其散热面积极其有限,与周围空气交换热量的面积不大,即使配用风扇亦无法及时充分地散发热量,这种散热鳍片不再满足目前电子厂商的散热要求。
发明内容
本发明在于提供一种散热装置,借以提升散热装置的散热效率。
本发明的一实施例所揭露的散热装置用以供一相变化流体充填。散热装置包含一基部及多个散热鳍片。基部具有至少一内部流道,用以供相变化流体充填。这些散热鳍片各包含一板体及至少一管体。这些板体插设于基部的其中一侧。这些板体各具有一延伸流道。这些管体的相对两端分别插接于这些板体及基部,且这些板体的这些延伸流道分别透过这些管体连通至少一内部流道。
根据上述实施例的散热装置,透过内部流道与延伸流道相连通,使得充填于这些内部流道的相变化流体受热后会汽化并流向延伸流道,且位于延伸流道的相变化流体液化后再流回内部流道以形成内部冷却循环。如此一来,散热装置除了通过基部构成二维度的传导外,还透过均温板构成第三维度的传导,以令散热装置达到立体式的均温效果,进而提升散热装置的散热效能。
再者,吹胀板形式的板体透过管体组装于基部,可降低散热装置的制造难度。
以上关于本发明内容的说明及以下实施方式的说明是用以示范与解释本发明的原理,并且提供本发明的权利要求书更进一步的解释。
附图说明
图1为根据本发明第一实施例所述的散热装置的立体示意图;
图2为图1的分解示意图;
图3为图1的分解示意图;
图4为图1的剖面示意图;
图5为根据本发明第二实施例所述的散热装置的剖面示意图;
图6为根据本发明第三实施例所述的散热装置的剖面示意图;
图7为根据本发明第四实施例所述的散热装置的平面示意图;
图8为根据本发明第五实施例所述的散热装置的平面示意图。
【符号说明】
10、10a、10b、10c、10d...散热装置
100...基部
110...第一板部
111...第一凹槽
112...插槽
120、120c、120d...第二板部
121...第二凹槽
200...散热鳍片
210...板体
220...管体
300...第一毛细结构
400、400b...第二毛细结构
S...内部流道
C...延伸流道
具体实施方式
请参阅图1至图4。图1为根据本发明第一实施例所述的散热装置的立体示意图。图2为图1的分解示意图。图3为图1的分解示意图。图4为图1的剖面示意图。
本实施例的散热装置10,用以供一相变化流体(未绘示)充填,散热装置10包含一基部100及多个散热鳍片200。
基部100例如具有多个内部流道S。这些内部流道S彼此平行,并彼此相连通。内部流道S用以供相变化流体(未绘示)充填。在本实施例中,基部100包含一第一板部110及一第二板部120。第一板部110的一侧具有多个第一凹槽111,以及相对一侧具有多个插槽112。第二板部120具有多个第二凹槽121。第一板部110与第二板部120相叠,且第一凹槽111与第二凹槽121共同形成多个内部流道S。第二板部120例如用以热接触一热源(未绘示)。热源例如为中央处理器、影像处理器等。相变化流体例如为水、醇类、冷媒等流体,其相变化流体的选用可视散热装置10本身的材质,或所应用的热源(未绘示)的工作温度来决定。举例来说,热源可接受的工作温度为80度至100度,则相变化流体的汽化温度介于80度至100度。
本实施例的基部100是透过两板部组装而成,但并不以此为限。在其他实施例中,基部亦可由吹胀、消失模铸造的方式一体成型。此外,本实施例的内部流道S的数量为多个,但并不以此为限。在其他实施例中,内部流道的数量也可以仅为单个。
这些均温板200各包含一板体210及至少一管体220。每一散热鳍片200的板体210例如为吹胀板,即例如透过吹胀的方式形成。这些散热鳍片200的这些板体210插设于第一板部110的这些插槽112,且这些板体210各具有一延伸流道C。这些管体220的相对两端分别插接于这些板体210及基部100,且这些板体210的这些延伸流道C分别透过这些管体220连通内部流道S。
在本实施例中,这些散热鳍片200的这些板体210插设于第一板部110的这些插槽112后例如可再透过焊接制程焊接板体210与第一板部110,以提升散热装置10的组装品质。
在本实施例中,每一板体210透过两个管体220与内部流道S相连通,但并不以此为限。在其他实施例中,每一板体也可以透过单个管体与内部流道S相连通,或是透过三个以上的管体与内部流道S相连通。
本实施例的板体210是由吹胀的方式一体成型,但并不以此为限。在其他实施例中,板体也可以由两板件组合而成。
在本实施例中,散热装置10还可以包含一第一毛细结构300。第一毛细结构300分布于第二板部120形成至少一内部流道S的壁面。然而,此设计并非用以限制本发明。在其他实施例中,第一毛细结构的数量亦可以多个,并分布第一板部110形成至少一内部流道S的壁面与第二板部120形成至少一内部流道S靠近热源的壁面。
第一毛细结构300例如为高分子微结构、微沟槽、金属网、粉末烧结体、陶瓷烧结体或高分子微结构、微沟槽、金属网、粉末烧结体及陶瓷烧结体的至少两个的复合体,且第一毛细结构300分布于第二板部120形成这些内部流道S靠近热源的壁面。
本实施例的这些内部流道S与延伸流道C与散热装置10以外的元件不相连通而为封闭式流道。也就是说,充填于这些内部流道S的相变化流体受热后会汽化并流向延伸流道C,且位于延伸流道C的相变化流体液化后再流回内部流道S,以形成内部冷却循环。从前述冷却循环可知,散热装置10除了通过基部100构成二维度的传导外,还透过均温板200构成第三维度的传导,以令散热装置10达到立体式的均温效果,进而提升散热装置10的散热效能。
此外,透过在基部100形成内部流道S,以及形成于基部100形成内部流道S的壁面的毛细结构300,来提升散热装置10的热扩散速度。举例来说,若热源热接触于散热装置10的中央处,且内部流道S与毛细结构300自散热装置10的中央处延伸至散热装置10的边缘处,则可透过内部流道S与毛细结构300让热源所产生的热量迅速传递至散热装置10的边缘处。如此一来,将可让散热装置10的全域均匀地将热源所产生的热量排出。
此外,吹胀板形式的板体210透过管体220组装于基部100,可降低散热装置10的制造难度。
请参阅图5。图5为根据本发明第二实施例所述的散热装置的剖面示意图。
在本实施例中,散热装置10a还可以包含多个第二毛细结构400,这些第二毛细结构400分别分布于这些板体210形成这些延伸流道C的壁面以及这些管体220的内壁面,且这些第二毛细结构400与第一毛细结构300分离。
第二毛细结构400例如为高分子微结构、微沟槽、金属网、粉末烧结体、陶瓷烧结体或高分子微结构、微沟槽、金属网、粉末烧结体及陶瓷烧结体的至少两个的复合体,且第二毛细结构400分布于板体210形成这些延伸流道C的壁面。
请参阅图6。图6为根据本发明第三实施例所述的散热装置的剖面示意图。
在本实施例中,散热装置10b还可以包含多个第二毛细结构400b,这些第二毛细结构400分别分布于这些板体210形成这些延伸流道C的壁面以及这些管体220的内壁面,且这些第二毛细结构400与第一毛细结构300相连。
第二毛细结构400b例如为高分子微结构、微沟槽、金属网、粉末烧结体、陶瓷烧结体或高分子微结构、微沟槽、金属网、粉末烧结体及陶瓷烧结体的至少两个的复合体,且第二毛细结构400b分布于板体210形成这些延伸流道C的壁面。
请参阅图7。图7为根据本发明第四实施例所述的散热装置的平面示意图。在本实施例的散热装置10c中,以从第二板部120c底部的视角来看,至少一内部流道S的数量为多个,且这些内部流道S彼此交叉。
请参阅图8。图8为根据本发明第五实施例所述的散热装置的平面示意图。在本实施例的散热装置10d中,以从第二板部120d底部的视角来看,至少一内部流道S的流道路径匹配于震荡式热管的流道路径而形成弯曲状回路。
根据上述实施例的散热装置,透过内部流道与延伸流道相连通,使得充填于这些内部流道的相变化流体受热后会汽化并流向延伸流道,且位于延伸流道的相变化流体液化后再流回内部流道以形成内部冷却循环。如此一来,散热装置除了通过基部构成二维度的传导外,还透过均温板构成第三维度的传导,以令散热装置达到立体式的均温效果,进而提升散热装置的散热效能。
再者,吹胀板形式的板体透过管体组装于基部,可降低散热装置的制造难度。
此外,透过在基部形成内部流道,以及形成于基部形成内部流道的壁面的毛细结构,来提升散热装置的热扩散速度。举例来说,若热源热接触于散热装置的中央处,且内部流道与毛细结构自散热装置的中央处延伸至散热装置的边缘处,则可透过内部流道与毛细结构让热源所产生的热量迅速传递至散热装置的边缘处。如此一来,将可让散热装置的全域均匀地将热源所产生的热量排出。
虽然本发明以前述的诸项实施例揭露如上,然其并非用以限定本发明,任何熟悉相像技艺者,在不脱离本发明的精神和范围内,当可作些许的更动与润饰,因此本发明的专利保护范围须视本说明书所附的权利要求书所界定的范围为准。
Claims (14)
1.一种散热装置,其特征在于,用以供一相变化流体充填,该散热装置包含:
一基部,具有至少一内部流道,用以供该相变化流体充填;以及
多个散热鳍片,该些散热鳍片各包含一板体及至少一管体,该些板体插设于该基部的其中一侧,该些板体各具有一延伸流道,该些管体的相对两端分别插接于该些板体及该基部,且该些板体的该些延伸流道分别透过该些管体连通该至少一内部流道。
2.根据权利要求1所述的散热装置,其特征在于,该至少一内部流道为封闭式流道。
3.根据权利要求2所述的散热装置,其特征在于,该基部包含一第一板部及一第二板部,该些散热鳍片的该些板体插设于该第一板部,且该第一板部与该第二板部共同围绕出该至少一内部流道。
4.根据权利要求3所述的散热装置,其特征在于,还包含至少一第一毛细结构,该第一毛细结构分布于该第二板部形成该至少一内部流道靠近热源的壁面。
5.根据权利要求3所述的散热装置,其特征在于,还包含至少一第一毛细结构,该第一毛细结构分布该第一板部形成该至少一内部流道的壁面与该第二板部形成该至少一内部流道靠近热源的壁面。
6.根据权利要求5所述的散热装置,其特征在于,还包含多个第二毛细结构,该些第二毛细结构分别分布于该些板体形成该些延伸流道的壁面。
7.根据权利要求6所述的散热装置,其特征在于,该些第二毛细结构与该第一毛细结构分离。
8.根据权利要求6所述的散热装置,其特征在于,该些第二毛细结构与该第一毛细结构相连。
9.根据权利要求4至8的任一项所述的散热装置,其特征在于,该至少一第一毛细结构为高分子微结构、微沟槽、金属网、粉末烧结体、陶瓷烧结体或高分子微结构、微沟槽、金属网、粉末烧结体及陶瓷烧结体的至少两个的复合体。
10.根据权利要求1所述的散热装置,其特征在于,该至少一内部流道的流道路径匹配于震荡式热管的流道路径而形成弯曲状回路。
11.根据权利要求1所述的散热装置,其特征在于,该至少一内部流道的数量为多个,且该些内部流道彼此交叉。
12.根据权利要求1所述的散热装置,其特征在于,该至少一内部流道的数量为多个,且该些内部流道彼此平行。
13.根据权利要求1所述的散热装置,其特征在于,每一该散热鳍片的该板体为吹胀板。
14.根据权利要求1所述的散热装置,其特征在于,每一该散热鳍片的该板体为两板件组合而成。
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