CN105140194B - 热超导散热器及其制造方法 - Google Patents
热超导散热器及其制造方法 Download PDFInfo
- Publication number
- CN105140194B CN105140194B CN201510452092.1A CN201510452092A CN105140194B CN 105140194 B CN105140194 B CN 105140194B CN 201510452092 A CN201510452092 A CN 201510452092A CN 105140194 B CN105140194 B CN 105140194B
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- CN
- China
- Prior art keywords
- heat
- superconducting
- partition plates
- plates
- pipelines
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H10W40/226—
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- H10W40/22—
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/06—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being attachable to the element
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
- F28F3/14—Elements constructed in the shape of a hollow panel, e.g. with channels by separating portions of a pair of joined sheets to form channels, e.g. by inflation
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N60/00—Superconducting devices
- H10N60/01—Manufacture or treatment
-
- H10W40/25—
-
- H10W40/257—
-
- H10W40/47—
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F2013/001—Particular heat conductive materials, e.g. superconductive elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2215/00—Fins
- F28F2215/06—Hollow fins; fins with internal circuits
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Claims (14)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510452092.1A CN105140194B (zh) | 2015-07-03 | 2015-07-28 | 热超导散热器及其制造方法 |
| US15/739,989 US10727149B2 (en) | 2015-07-03 | 2016-07-01 | Thermally superconducting heat dissipation device and manufacturing method thereof |
| PCT/CN2016/088096 WO2017005138A1 (zh) | 2015-07-03 | 2016-07-01 | 热超导散热器及其制造方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2015103984223 | 2015-07-03 | ||
| CN201510398422 | 2015-07-03 | ||
| CN201510452092.1A CN105140194B (zh) | 2015-07-03 | 2015-07-28 | 热超导散热器及其制造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105140194A CN105140194A (zh) | 2015-12-09 |
| CN105140194B true CN105140194B (zh) | 2018-02-02 |
Family
ID=54725492
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510452092.1A Active CN105140194B (zh) | 2015-07-03 | 2015-07-28 | 热超导散热器及其制造方法 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US10727149B2 (zh) |
| CN (1) | CN105140194B (zh) |
| WO (1) | WO2017005138A1 (zh) |
Families Citing this family (34)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105140194B (zh) | 2015-07-03 | 2018-02-02 | 浙江嘉熙科技有限公司 | 热超导散热器及其制造方法 |
| CN105555102A (zh) * | 2015-12-11 | 2016-05-04 | 上海嘉熙科技有限公司 | 具有热超导半导体制冷系统的密封机柜 |
| US12232428B2 (en) * | 2017-04-07 | 2025-02-18 | Bernd Burchard | Graphite superconductor and use thereof |
| US20190368823A1 (en) | 2018-05-29 | 2019-12-05 | Cooler Master Co., Ltd. | Heat dissipation plate and method for manufacturing the same |
| CN108844385B (zh) * | 2018-06-15 | 2024-02-13 | 江苏英杰铝业有限公司 | 一种散热效果好的铝型材 |
| CN109271004B (zh) * | 2018-09-21 | 2025-02-25 | 浙江嘉熙科技股份有限公司 | 散热器及热水器组合结构 |
| CN109246984B (zh) * | 2018-09-21 | 2024-01-02 | 浙江嘉熙科技股份有限公司 | 轨道交通用大功率热超导板翅组合式散热器 |
| CN109244050B (zh) * | 2018-09-21 | 2024-08-13 | 浙江嘉熙科技股份有限公司 | 大功率热超导板翅组合式散热器 |
| CN109246970A (zh) * | 2018-10-11 | 2019-01-18 | 苏州睿达矩自动化设备有限公司 | 一种散热效率高的控制电路板安装座 |
| US12331997B2 (en) | 2018-12-21 | 2025-06-17 | Cooler Master Co., Ltd. | Heat dissipation device having irregular shape |
| US11913725B2 (en) | 2018-12-21 | 2024-02-27 | Cooler Master Co., Ltd. | Heat dissipation device having irregular shape |
| SE543441C2 (en) * | 2019-03-26 | 2021-02-16 | Centropy Ab | Heat transfer device |
| SE543338C2 (en) | 2019-04-04 | 2020-12-08 | Swep Int Ab | Stencil device and method for stencil printing of brazing material onto a heat exchanger plate and use thereof |
| CN110296624A (zh) * | 2019-06-11 | 2019-10-01 | 深圳兴奇宏科技有限公司 | 流道型二相流散热器 |
| CN110345561A (zh) * | 2019-07-08 | 2019-10-18 | 上海嘉熙科技有限公司 | 空调室内机 |
| CN110351991B (zh) * | 2019-07-22 | 2020-10-27 | 浙江嘉熙科技有限公司 | 传热基板及散热器结构 |
| US11454462B2 (en) * | 2019-08-05 | 2022-09-27 | Aavid Thermalloy, Llc | Heat dissipating fin with thermosiphon |
| CN110567301A (zh) * | 2019-08-23 | 2019-12-13 | 深圳市嘉名科技有限公司 | 一种散热板及其制造方法 |
| US11359870B2 (en) * | 2020-01-13 | 2022-06-14 | Cooler Master Co., Ltd. | Method of manufacturing a heat exchanger |
| EP3848662B1 (en) * | 2020-01-13 | 2022-11-16 | Cooler Master Co., Ltd. | Heat exchanger fin and manufacturing mehtod of the same |
| FI3859261T3 (fi) * | 2020-01-29 | 2023-02-19 | Lämmönvaihtimen ripa ja sen valmistusmenetelmä | |
| CN113395867A (zh) | 2020-03-12 | 2021-09-14 | 中兴通讯股份有限公司 | 散热齿片及其制备方法、散热装置及电子设备 |
| CN111521051B (zh) * | 2020-04-09 | 2025-02-07 | 浙江嘉熙科技股份有限公司 | 热超导传热板及散热器 |
| CN111609743A (zh) * | 2020-04-27 | 2020-09-01 | 浙江嘉熙科技有限公司 | 热超导散热板、散热器及5g基站设备 |
| CN111725156B (zh) * | 2020-06-05 | 2025-02-14 | 河南新科隆电器有限公司 | 一种集成电路散热装置 |
| CN214950816U (zh) * | 2020-07-01 | 2021-11-30 | 讯凯国际股份有限公司 | 热交换器鳍片 |
| CN114383453A (zh) * | 2020-10-22 | 2022-04-22 | 讯凯国际股份有限公司 | 散热装置 |
| CN112672610A (zh) * | 2020-12-27 | 2021-04-16 | 镇江宏联电工有限公司 | 一种闭合式风冷散热器及其制造工艺 |
| WO2022141626A1 (en) | 2021-01-04 | 2022-07-07 | Telefonaktiebolaget Lm Ericsson (Publ) | Heatsink and communication device having the heatsink |
| EP4050295A1 (en) * | 2021-02-26 | 2022-08-31 | Ovh | Water block having hollow fins |
| CN114245665B (zh) * | 2021-11-30 | 2022-10-21 | 珠海格力电器股份有限公司 | 一种空调 |
| CN114734212B (zh) * | 2022-05-18 | 2023-07-18 | 东莞新凯隆热能科技有限公司 | 一种高导热吹胀板及其制造工艺 |
| EP4387405A1 (en) * | 2022-12-14 | 2024-06-19 | Huawei Technologies Co., Ltd. | Apparatus for transferring heat from a heat source to air |
| US20250189239A1 (en) * | 2023-12-08 | 2025-06-12 | JWS Technology CO., LTD. | Three-dimensional vapor chamber device |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5381859A (en) * | 1990-11-09 | 1995-01-17 | Kabushiki Kaisha Toshiba | Heat sink and the producing method thereof |
| CN2571137Y (zh) * | 2002-09-17 | 2003-09-03 | 刘克文 | 新型超导散热器 |
| CN201327002Y (zh) * | 2008-12-26 | 2009-10-14 | 倪亮 | 发光二极管照明装置散热器 |
| CN102700218A (zh) * | 2012-06-25 | 2012-10-03 | 常州市常蒸蒸发器有限公司 | 吹胀式蒸发器复铝板的生产方法 |
| CN103247584A (zh) * | 2013-05-15 | 2013-08-14 | 上海鹰峰电子科技有限公司 | 一种微槽群平板热管散片模块及其生产方法 |
| CN103464966A (zh) * | 2013-08-21 | 2013-12-25 | 浙江嘉熙光电设备制造有限公司 | 纯铝板材单面吹胀工艺 |
| CN205104482U (zh) * | 2015-07-03 | 2016-03-23 | 浙江嘉熙光电设备制造有限公司 | 热超导散热器 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3477504A (en) * | 1967-05-29 | 1969-11-11 | Gen Electric | Porous metal and plastic heat exchanger |
| US3829740A (en) * | 1973-07-09 | 1974-08-13 | Buehler Corp | Cooling arrangement for a direct current power supply |
| US4184862A (en) * | 1976-09-30 | 1980-01-22 | Mcdonnell Douglas Corporation | Heat exchanger gas separator |
| US5365400A (en) * | 1988-09-09 | 1994-11-15 | Hitachi, Ltd. | Heat sinks and semiconductor cooling device using the heat sinks |
| US4971144A (en) * | 1989-05-30 | 1990-11-20 | Microelectronics And Computer Technology Corporation | Liquid ribbon cooler |
| TW331586B (en) * | 1997-08-22 | 1998-05-11 | Biing-Jiun Hwang | Network-type heat pipe device |
| US6942019B2 (en) * | 2002-03-25 | 2005-09-13 | Ltx Corporation | Apparatus and method for circuit board liquid cooling |
| US6907917B2 (en) * | 2003-01-10 | 2005-06-21 | International Business Machines Corporation | Graphite-based heat sinks and method and apparatus for the manufacture thereof |
| FR2861894B1 (fr) * | 2003-10-31 | 2008-01-18 | Valeo Equip Electr Moteur | Dispositif de refroidissement d'une electronique de puissance |
| US7770407B1 (en) * | 2005-02-18 | 2010-08-10 | Motion Computing, Inc. | Fuel cell having an integrated, porous thermal exchange mechanism |
| DE112012001293T5 (de) * | 2011-03-18 | 2014-01-09 | Dana Canada Corporation | Batteriezellenkühler |
| CN105140194B (zh) * | 2015-07-03 | 2018-02-02 | 浙江嘉熙科技有限公司 | 热超导散热器及其制造方法 |
-
2015
- 2015-07-28 CN CN201510452092.1A patent/CN105140194B/zh active Active
-
2016
- 2016-07-01 US US15/739,989 patent/US10727149B2/en active Active
- 2016-07-01 WO PCT/CN2016/088096 patent/WO2017005138A1/zh not_active Ceased
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5381859A (en) * | 1990-11-09 | 1995-01-17 | Kabushiki Kaisha Toshiba | Heat sink and the producing method thereof |
| CN2571137Y (zh) * | 2002-09-17 | 2003-09-03 | 刘克文 | 新型超导散热器 |
| CN201327002Y (zh) * | 2008-12-26 | 2009-10-14 | 倪亮 | 发光二极管照明装置散热器 |
| CN102700218A (zh) * | 2012-06-25 | 2012-10-03 | 常州市常蒸蒸发器有限公司 | 吹胀式蒸发器复铝板的生产方法 |
| CN103247584A (zh) * | 2013-05-15 | 2013-08-14 | 上海鹰峰电子科技有限公司 | 一种微槽群平板热管散片模块及其生产方法 |
| CN103464966A (zh) * | 2013-08-21 | 2013-12-25 | 浙江嘉熙光电设备制造有限公司 | 纯铝板材单面吹胀工艺 |
| CN205104482U (zh) * | 2015-07-03 | 2016-03-23 | 浙江嘉熙光电设备制造有限公司 | 热超导散热器 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2017005138A1 (zh) | 2017-01-12 |
| CN105140194A (zh) | 2015-12-09 |
| US20180308780A1 (en) | 2018-10-25 |
| US10727149B2 (en) | 2020-07-28 |
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| Date | Code | Title | Description |
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| CB02 | Change of applicant information |
Address after: Jiaxing City, Zhejiang province 314100 Zhuang Zhen Yao Jiashan County Jinxiu Road No. 1 Building No. 188 Applicant after: ZHEJIANG JIAXI TECHNOLOGY Co.,Ltd. Address before: Jiaxing City, Zhejiang province 314100 Zhuang Zhen Yao Jiashan County Jinxiu Road No. 1 Building No. 188 Applicant before: ZHEJIANG JIAXI OPTOELECTRONIC EQUIPMENT MANUFACTURING Co.,Ltd. |
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Address after: 311100 Room 201, 2 / F, building 2, No. 9, Taiji Road, Yuhang Economic and Technological Development Zone, Yuhang District, Hangzhou City, Zhejiang Province Patentee after: Zhejiang Jiaxi Technology Co.,Ltd. Address before: 314100 workshop 1, 188 Jinxiu Avenue, Yaozhuang Town, Jiashan County, Jiaxing City, Zhejiang Province Patentee before: ZHEJIANG JIAXI TECHNOLOGY Co.,Ltd. |
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| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Thermal superconducting heat sink and its manufacturing method Effective date of registration: 20230322 Granted publication date: 20180202 Pledgee: China Construction Bank Corporation Hangzhou Linping Sub-branch Pledgor: Zhejiang Jiaxi Technology Co.,Ltd. Registration number: Y2023330000585 |
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| PE01 | Entry into force of the registration of the contract for pledge of patent right |