FR2898668B1 - Echangeur de chaleur destine au refroidissement d'un composant electronique et son procede de fabrication - Google Patents

Echangeur de chaleur destine au refroidissement d'un composant electronique et son procede de fabrication

Info

Publication number
FR2898668B1
FR2898668B1 FR0602277A FR0602277A FR2898668B1 FR 2898668 B1 FR2898668 B1 FR 2898668B1 FR 0602277 A FR0602277 A FR 0602277A FR 0602277 A FR0602277 A FR 0602277A FR 2898668 B1 FR2898668 B1 FR 2898668B1
Authority
FR
France
Prior art keywords
cooling
manufacturing
heat exchanger
same
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR0602277A
Other languages
English (en)
Other versions
FR2898668A1 (fr
Inventor
Eric Guyon
Pierre Lecocq
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FERRAZ DATE IND SOC PAR ACTION
Original Assignee
FERRAZ DATE IND SOC PAR ACTION
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FERRAZ DATE IND SOC PAR ACTION filed Critical FERRAZ DATE IND SOC PAR ACTION
Priority to FR0602277A priority Critical patent/FR2898668B1/fr
Priority to US12/224,721 priority patent/US8434228B2/en
Priority to CN2007800093659A priority patent/CN101405561B/zh
Priority to EP07731127A priority patent/EP1996893A1/fr
Priority to PCT/FR2007/000431 priority patent/WO2007104857A1/fr
Publication of FR2898668A1 publication Critical patent/FR2898668A1/fr
Application granted granted Critical
Publication of FR2898668B1 publication Critical patent/FR2898668B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
    • B23P15/26—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass heat exchangers or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4882—Assembly of heatsink parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P2700/00—Indexing scheme relating to the articles being treated, e.g. manufactured, repaired, assembled, connected or other operations covered in the subgroups
    • B23P2700/10—Heat sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/02—Constructions of heat-exchange apparatus characterised by the selection of particular materials of carbon, e.g. graphite
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
    • F28F21/081—Heat exchange elements made from metals or metal alloys
    • F28F21/084—Heat exchange elements made from metals or metal alloys from aluminium or aluminium alloys
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2255/00—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
    • F28F2255/16—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes extruded
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00—Fastening; Joining
    • F28F2275/12—Fastening; Joining by methods involving deformation of the elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00—Fastening; Joining
    • F28F2275/14—Fastening; Joining by using form fitting connection, e.g. with tongue and groove
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49345—Catalytic device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49393—Heat exchanger or boiler making with metallurgical bonding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining
    • Y10T29/49908—Joining by deforming
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining
    • Y10T29/49908—Joining by deforming
    • Y10T29/49936—Surface interlocking

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
FR0602277A 2006-03-15 2006-03-15 Echangeur de chaleur destine au refroidissement d'un composant electronique et son procede de fabrication Active FR2898668B1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
FR0602277A FR2898668B1 (fr) 2006-03-15 2006-03-15 Echangeur de chaleur destine au refroidissement d'un composant electronique et son procede de fabrication
US12/224,721 US8434228B2 (en) 2006-03-15 2007-03-13 Heat exchanger and a method of manufacturing it
CN2007800093659A CN101405561B (zh) 2006-03-15 2007-03-13 热交换器及其制造方法
EP07731127A EP1996893A1 (fr) 2006-03-15 2007-03-13 Echangeur de chaleur et son procede de fabrication
PCT/FR2007/000431 WO2007104857A1 (fr) 2006-03-15 2007-03-13 Echangeur de chaleur et son procede de fabrication

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0602277A FR2898668B1 (fr) 2006-03-15 2006-03-15 Echangeur de chaleur destine au refroidissement d'un composant electronique et son procede de fabrication

Publications (2)

Publication Number Publication Date
FR2898668A1 FR2898668A1 (fr) 2007-09-21
FR2898668B1 true FR2898668B1 (fr) 2008-06-27

Family

ID=37575264

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0602277A Active FR2898668B1 (fr) 2006-03-15 2006-03-15 Echangeur de chaleur destine au refroidissement d'un composant electronique et son procede de fabrication

Country Status (5)

Country Link
US (1) US8434228B2 (fr)
EP (1) EP1996893A1 (fr)
CN (1) CN101405561B (fr)
FR (1) FR2898668B1 (fr)
WO (1) WO2007104857A1 (fr)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090145580A1 (en) * 2007-12-10 2009-06-11 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. Heat sink and a method of manufacturing the heat sink
TWM360549U (en) * 2009-02-10 2009-07-01 Giga Byte Tech Co Ltd Heat-dissipating device
TWI348017B (en) * 2009-02-10 2011-09-01 Giga Byte Tech Co Ltd Method of making a heat sink
CN101813394A (zh) * 2010-04-04 2010-08-25 姚德龙 一种太阳能热水器集热器高导热翅片
US8498116B2 (en) * 2010-07-16 2013-07-30 Rockwell Automation Technologies, Inc. Heat sink for power circuits
US8966758B1 (en) * 2010-09-17 2015-03-03 Jeffrey Skaggs McReynolds System and method of producing scalable heat-sink assembly
WO2013058953A1 (fr) * 2011-10-19 2013-04-25 Carrier Corporation Echangeur de chaleur à ailettes en tube aplati et procédé de fabrication
CN102803888A (zh) * 2012-01-05 2012-11-28 萨帕有限公司 散热器及其制造方法
CN103493196B (zh) * 2012-02-06 2016-07-06 华为技术有限公司 具有层叠鳍片的散热片和此散热片的生产方法
EP2804251B1 (fr) * 2013-04-24 2016-07-20 Samsung SDI Co., Ltd. Système de batterie de véhicule
US10914539B2 (en) 2013-05-15 2021-02-09 Osram Sylvania Inc. Two piece aluminum heat sink
US20170115073A1 (en) * 2015-10-22 2017-04-27 Michael R. Knox Heat exchanger elements and divices
JP7094805B2 (ja) * 2018-07-05 2022-07-04 住友精密工業株式会社 熱交換器および熱交換器の製造方法
CN109465632A (zh) * 2018-10-12 2019-03-15 全椒赛德利机械有限公司 铝芯散热器装配工艺
EP3696849A1 (fr) * 2019-02-18 2020-08-19 ABB Schweiz AG Dissipateur thermique et procédé de fabrication d'un dissipateur thermique
CN109967988B (zh) * 2019-03-18 2020-10-27 青岛登辉机械配件有限公司 内螺纹外翅管加工工艺
CN114383453A (zh) * 2020-10-22 2022-04-22 讯凯国际股份有限公司 散热装置

Family Cites Families (17)

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Publication number Priority date Publication date Assignee Title
NL262409A (fr) * 1960-03-24
GB991581A (en) * 1962-03-21 1965-05-12 High Temperature Materials Inc Expanded pyrolytic graphite and process for producing the same
DE3814145C2 (de) * 1988-04-27 1998-07-23 Hess Joachim Vorrichtung zum Zuführen oder Abführen von Wärme
US5542176A (en) * 1992-09-21 1996-08-06 Hideaki Serizawa Radiation plate and method of producing the same
US5819407A (en) * 1995-04-19 1998-10-13 Tousui, Ltd. Method of joining together a pair of members each having a high thermal conductivity
DE29507286U1 (de) * 1995-05-04 1995-07-20 Alusuisse Lonza Services Ag Kühlkörper für Halbleiterbauelemente o.dgl. Geräte
US6085830A (en) * 1997-03-24 2000-07-11 Fujikura Ltd. Heat sink, and process and apparatus for manufacturing the same
US6520248B2 (en) * 2000-05-18 2003-02-18 Aavid Thermalloy Llc Heat sink having bonded cooling fins
JP2002118211A (ja) * 2000-10-12 2002-04-19 Mizutani Denki Kogyo Kk 電子部品の放熱器およびその製造方法
US6758263B2 (en) * 2001-12-13 2004-07-06 Advanced Energy Technology Inc. Heat dissipating component using high conducting inserts
US6749010B2 (en) * 2002-06-28 2004-06-15 Advanced Energy Technology Inc. Composite heat sink with metal base and graphite fins
US6771502B2 (en) * 2002-06-28 2004-08-03 Advanced Energy Technology Inc. Heat sink made from longer and shorter graphite sheets
US6907917B2 (en) * 2003-01-10 2005-06-21 International Business Machines Corporation Graphite-based heat sinks and method and apparatus for the manufacture thereof
CN1262368C (zh) 2003-02-19 2006-07-05 萧复元 散热器
US7286352B2 (en) * 2005-04-15 2007-10-23 Hewlett-Packard Development Company, L.P. Thermally expanding base of heatsink to receive fins
US7497013B2 (en) * 2005-04-15 2009-03-03 R-Theta Thermal Solutions Inc. Method and apparatus for coupling fins in a high-fin density heatsink to dual heat-dissipating base plates
TWI262760B (en) * 2005-05-20 2006-09-21 Shr-Ming Chen Riveting process of bottom plate of heat-dissipating device and fins

Also Published As

Publication number Publication date
CN101405561A (zh) 2009-04-08
US20090178782A1 (en) 2009-07-16
EP1996893A1 (fr) 2008-12-03
US8434228B2 (en) 2013-05-07
CN101405561B (zh) 2012-02-29
FR2898668A1 (fr) 2007-09-21
WO2007104857A1 (fr) 2007-09-20

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